Differences Between the Growth Kinetics of Thin Film and Bulk Diffusion Couples

1981 ◽  
Vol 10 ◽  
Author(s):  
U. Gösele ◽  
K. N. Tu

It is proposed that interface reaction barriers in binary A/B diffusion couples lead to the absence of phases predicted by the equilibrium phase diagram, provided that the diffusion zones are sufficiently thin (“thin film case”). With increasing thickness of the diffusion zones the influence of interface reaction barriers decreases and the simultaneous existence of diffusion-controlled growth of all equilibrium phases is expected (“bulk case”). First-phase and different modes of second-phase formation in the diffusion zones as well as the influence of impurities are discussed with specific reference to silicide formation. For this discussion the concept of a critical thickness of the first forming phase is introduced, below which a second compound phase cannot grow simultaneously with the first one.

Metals ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 461
Author(s):  
Konrad Kosiba ◽  
Konda Gokuldoss Prashanth ◽  
Sergio Scudino

The phase and microstructure formation as well as mechanical properties of the rapidly solidified Mg67Ag33 (at. %) alloy were investigated. Owing to kinetic constraints effective during rapid cooling, the formation of equilibrium phases is suppressed. Instead, the microstructure is mainly composed of oversaturated hexagonal closest packed Mg-based dendrites surrounded by a mixture of phases, as probed by X-ray diffraction, electron microscopy and energy dispersive X-ray spectroscopy. A possible non-equilibrium phase diagram is suggested. Mainly because of the fine-grained dendritic and interdendritic microstructure, the material shows appreciable mechanical properties, such as a compressive yield strength and Young’s modulus of 245 ± 5 MPa and 63 ± 2 GPa, respectively. Due to this low Young’s modulus, the Mg67Ag33 alloy has potential for usage as biomaterial and challenges ahead, such as biomechanical compatibility, biodegradability and antibacterial properties are outlined.


2003 ◽  
Vol 10 (04) ◽  
pp. 677-683 ◽  
Author(s):  
E. B. Hannech ◽  
N. Lamoudi ◽  
N. Benslim ◽  
B. Makhloufi

Intermetallic formation at 425°C in the aluminum–copper system has been studied by scanning electron microscopy using welded diffusion couples. Several Al–Cu phases predicted by the equilibrium phase diagram of the elements and voids taking place in the diffusion zone have been detected in the couples. The predominant phases were found to be Al 2 Cu 3 and the solid solution of Al in Cu, α. The growth of the intermetallic layer obeyed the parabolic law.


2021 ◽  
Vol 1016 ◽  
pp. 1114-1120
Author(s):  
Henryk Paul ◽  
Piotr Bobrowski ◽  
Robert Chulist ◽  
Magdalena M. Miszczyk ◽  
Mariusz Prazmowski

The interplay of various hardening and softening processes during explosive welding and post-processing annealing have been analysed in titanium/copper bimetallic sheets using scanning electron microscopy and microhardness measurements. Severe plastic deformation and intermetallics’ formation are typical processes leading to hardening, whereas dynamic/static recrystallization and the transformation of amorphous phases into crystalline ones lead to softening. In the as-welded state the interfacial layers of both parent sheets are severely deformed. However, they can undergo intense recrystalization in areas near large melted zones. Inside the melted zones a wide variety of chemical compositions can be detected, however, most of the phases do not appear in the Ti-Cu equilibrium phase diagram. The post-processing annealing at 973 K for 1 h leads to full recrystallization of severely deformed layers of parent sheets and transforms the non-equilibrium phases forming melted zone into the equilibrium TiCu4 and Ti3Cu4 ones via spinodal decomposition. Simultaneously, the growth of four intermetallic layers: Ti2Cu, TiCu, Ti3Cu4, TiCu4 situated along the whole interface was detected.


1993 ◽  
Vol 311 ◽  
Author(s):  
K. Barmak ◽  
K.K. Coffey

ABSTRACTIn order to arrive at a model for nucleation in the reaction of polycrystalline thin films, we have made use of a transport model that combines atom transport across interface reaction barriers with transport along grain boundaries. Through this transport model, the boundary chemical potential, μIi, and a characteristic length Li for each specie are defined. Li and the ratio of grain size to Li determine the spatial variation and the time evolution of the boundary chemical potential respectively. Nucleation of the product phase is modeled as a process whose driving force is determined by these position dependent (and time dependent) boundary chemical potentials. Thus thin film reactions become similar to precipitation from bulk homogeneous supersaturated solid solutions. Numerical calculations, however, show that boundary diffusion results in low “effective” driving forces for nucleation which can lead to heterogeneous nucleation of even the first phase. The model provides a new approach to phase selection by re-evaluation of the driving force and considers the effect of product and reactant grain structure to be fundamental to the reaction process.


1991 ◽  
Vol 230 ◽  
Author(s):  
Katayun Barmak ◽  
Kevin R. Coffey ◽  
David A. Rudman ◽  
Simon Foner

AbstractWe investigated the phase formation sequence in the reaction of multilayer thin films of Nb/Al with overall compositions of 25 and 33 at.% AI. We report novel phenomena which distinguish thin-film reactions unequivocally from those in bulk systems. For sufficiently thin layers composition and stability of product phases are found to deviate significantly from that predicted from the equilibrium phase diagram. We demonstrate that in the Nb/Al system the length scales below which such deviations occur is about 150 nm. We believe that these phenomena occur due to the importance of grain boundary diffusion and hence microstructure in these thin films.


1995 ◽  
Vol 10 (5) ◽  
pp. 1134-1145 ◽  
Author(s):  
T. Barge ◽  
P. Gas ◽  
F.M. d'Heurle

The solid state reaction between Co and Si has been studied in bulk diffusion couples between 850 and 1100 °C. At the scale of the observations made, the three phases Co2Si, CoSi, and CoSi2 are found to grow simultaneously, according to diffusion controlled kinetics. The results are analyzed in term of the Nernst-Einstein equation that directly relates diffusion fluxes to the free energy changes driving the formation. The growth rates obtained for CoSi2 at high temperatures, in the present bulk samples, are compared with those determined by others in thin films, at much lower temperatures. The comparison requires that attention should be paid to two factors. The first one is that the laws of growth are slightly different for a phase growing simultaneously with two other ones (bulk) and one phase growing alone (thin films). The second factor is the grain size of the various samples, which varies with the temperature of reaction. Once this is done, excellent agreement is obtained between the two sets of measurements. Moreover it is shown that knowing the grain size, it is possible to calculate quite accurately the growth rate from the respective isotope diffusion coefficients both for lattice and grain boundaries of Co and Si in CoSi2.


1988 ◽  
Vol 3 (1) ◽  
pp. 148-163 ◽  
Author(s):  
J. -C. Lin ◽  
K. -C. Hsieh ◽  
K. J. Schulz ◽  
Y. A. Chang

Reactions between Pd and GaAs have been studied using bulk-diffusion couples of Pd (∼0.6 mm thick) /GaAs and thin-film Pd (50 and 160 nm)/GaAs samples. The sequence of phase formation at 600°C between bulk Pd and GaAs was established. Initial formation of the solution phase μ and the ternary phase T does not represent the stable configuration. The stable configuration is GaAs |∊|Λ|γ|ν|Pd and is termed the diffusion path between GaAs and Pd. The sequence of phase formation for the bulk-diffusion couples is similar at 500°C. Phase formation for the thin-film Pd/GaAs specimens was studied at 180,220,250,300,350,400,450,600, and 1000°C for various annealing times. The sequence of phase formation obtained from the thin-film experiments is rationalized readily from the known ternary phase equilibria of Ga–Pd–As and the results from the bulk-diffusion couples of Pd/GaAs. The thin-film results reported in the literature are likewise rationalized. The diffusion path concept provides a useful guide in understanding the phase formation in Pd–GaAs interface or any other M-GaAs interface. This information is important in designing a uniform, stable contact for the metallization of GaAs.


1987 ◽  
Vol 102 ◽  
Author(s):  
J. C. Lin ◽  
X. -Y. Zheng ◽  
K. -C. Hsieh ◽  
Y. A. Chang

ABSTRACTInterfacial reactions between Ni and GaAs have been studied using bulk diffusion couples of Ni(∼0.5mm thick)/GaAs and thin-film Ni (∼40nm) on GaAs (100) in addition to phase diagram determination at 600° C. On the basis of the phase diagram and the bulk diffusion couples, the ternary phase which forms first in the thin-film couples is Ni3 GaAs. Thinfilm studies show that the epitaxial growth of equilibrium contact phases, i.e., NiAs and β-GaNi, on a GaAs (100) substrate is possible.


1997 ◽  
Vol 472 ◽  
Author(s):  
Yuhong Zhang ◽  
Douglas G. Ivey

ABSTRACTInitial phase formation in thin film and bulk Fe/Si couples has been investigated using transmission and scanning electron microscopy (TEM and SEM). For the thin film couples, ≈165 nm of Fe was deposited by electron beam evaporation onto <111> oriented Si substrates. SiO2 capping layers (≈100nm thick) were used to protect the Fe from oxidation during subsequent annealing. Bulk diffusion couples were fabricated by clamping together polycrystalline Fe pieces and <111> oriented single crystal Si pieces and sealed in evacuated (≈10-4 torr) quartz capsules. Annealing of thin film couples was done at temperatures ranging from 300°C to 500°C for up to several hours. Bulk couples were annealed at 700°C for up to ≈1000hrs.Interfacial reactions were detected in as deposited thin film couples. A layer =5nm thick was identified, through electron diffraction, as poorly crystalline off-stoichiometric Fe3Si. Iron was the major diffuser during the formation of Fe3Si. During annnealing off-stoichiometric Fe3Si transformed to stoichiometric Fe3Si. FeSi was the next phase to form - initially detected after annealing at 300°C for 3 hrs. Similar results were obtained for bulk couples. The first phase to form was ordered stoichiometric Fe3Si (initially detected after 7 hrs), followed by FeSi (≈23 hrs) and then FeSi2 (>200 hrs). The formation behavior of these phase is discussed.


1982 ◽  
Vol 19 ◽  
Author(s):  
K.N. Tu ◽  
U. GöSele

ABSTRACTA feature of thin film reaction that is different from the reaction in bulk samples is the tendency to form a single intermetallic compound rather than all of them which are allowed according to the equilibrium phase diagram. For example, in thin film silicide formation, Pd2Si has been found to form alone and to grow as a layer between Pd and Si. The silicide is stable over a wide temperature range of 100 to 700°C. The phenomenon of single intermetallic compound growth is not unique to silicide formation between transition metal films and silicon, but is also commonly observed in reactions between bimetallic thin films. The phenomenon indicates phase stability.


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