Influence of Substrate on Cracking of Vapour-Deposited Thin Films Due to Residual Stresses
Keyword(s):
X Ray
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AbstractThe influence of the substrate material on the column and grain microstructure, the residual stresses, crack patterns and delamination of Cr films has been investigated using TEM, SEM, and X-ray diffraction. The inter-influence of these factors which determine the long term reliability of microelectronics is discussed. When interfacial adhesion is very low, as may be the case with some polymer substrates, cracking occurs discontinuously during film formation each time the stress exceeds the critical value for fracture.