Surface Cross-Hatched Morphology on Strained III-V Semiconductor Heterostructures

1989 ◽  
Vol 160 ◽  
Author(s):  
Kevin H. Chang ◽  
Ronald Gibala ◽  
David J. Srolovitz ◽  
Pallab K. Bhattacharya ◽  
John F. Mansfield

AbstractThe correlation between surface cross-hatched morphology and interfacial misfit dislocations in strained III-V semiconductor heteroepitaxy has been studied. The surface pattern is clearly seen on samples grown at high temperature (520°C) and with lattice mismatch f < 2%. A poorly defined cross-hatched morphology is found on layers grown at low temperature (400°C). For f > 2%, a rough textured surface morphology is observed in place of cross hatching. Few threading dislocations are observed in the strained layer when cross hatch develops. Cross hatch occurs after most interfacial misfit dislocations are generated. The results suggest that surface cross hatch is directly related to the generation and glide of interfacial misfit dislocations.

1992 ◽  
Vol 280 ◽  
Author(s):  
A. K. Ballal ◽  
L. Salamanca-Riba ◽  
D. L. Partin

ABSTRACTIn this paper we investigate the defect morphology and misfit strain in InAs films grown on (100) InP substrates using two-step metal organic chemical vapor deposition (MOCVD). High quality InAs films were obtained despite the 3.2% lattice-mismatch between the InAs film and the InP substrate. Cross-sectional and plan-view transmission electron microscopy has been used to characterize the ∼3μm thick InAs films. Almost all the lattice mismatch is accomodated by an orthogonal array of pure edge Lomer dislocations which are favored over the 60° type since they are more efficient in relieving misfit strain. In addition to misfit dislocations, threading dislocations were observed propagating through the film. Most of the threading dislocations were 60° type dislocations along the < 211 > and < 110 > directions on inclined {111} planes. The threading dislocations originate from island coalescence during film growth. High resolution electron microscopy shows the epitaxial relationship between the film and the substrate and reveals an abrupt and sharp interface with periodic dislocation cores.


2018 ◽  
Vol 51 (6) ◽  
pp. 1684-1690 ◽  
Author(s):  
Marina González-Mañas ◽  
Beatriz Vallejo

Boron-doped diamond epilayers grown over diamond substrates have a different lattice parameter from the undoped diamond substrate, which introduces a lattice mismatch between substrates and epilayers. This can generate misfit dislocations at the interface when the epilayer reaches a certain critical thickness. For a boron concentration of about 1 × 1020 atoms cm−3, the calculated lattice mismatch is about 1.3 × 10−4 and the critical thickness is of the order of 0.2 µm. In the epilayers studied, grown over high-pressure high-temperature 1b (001) substrates, the lattice mismatch and the epilayer thickness are 1.3 × 10−4, 30 µm and 6.5 × 10−4, 4 µm. The epitaxial strain has been relaxed by the generation of two orthogonal misfit dislocation systems. These are edge dislocations parallel to the [100] and [010] directions with a Burgers vector making an angle of 45° with the (001) interface. Their lengths are 40–60 µm and their lineal densities 200–240 cm−1. They are heterogeneously nucleated, propagated in the form of half-loops along the slip planes (011) and (101), respectively, and related mainly to 〈111〉 threading dislocations emerging from octahedral growth sectors. Another kind of half-loop originates from the substrate growth sector boundaries. Limited X-ray topography has been demonstrated to be a very useful tool to discriminate between substrate and epilayer defects when their lattice mismatch is not sufficient to separate such defects in conventional Lang topography. X-ray section topography has confirmed the presence of [001] dislocations in the epilayers and the misfit half-loops related to threading dislocations propagating from the interface.


Author(s):  
W. Qian ◽  
M. Skowronski ◽  
R. Kaspi ◽  
M. De Graef

GaSb thin film grown on GaAs is a promising substrate for fabrication of electronic and optical devices such as infrared photodetectors. However, these two materials exhibit a 7.8% lattice constant mismatch which raises concerns about the amount of extended defects introduced during strain relaxation. It was found that, unlike small lattice mismatched systems such as InxGa1-xAs/GaAs or GexSi1-x/Si(100), the GaSb/GaAs interface consists of a quasi-periodic array of 90° misfit dislocations, and the threading dislocation density is low despite its large lattice mismatch. This paper reports on the initial stages of GaSb growth on GaAs(001) substrates by molecular beam epitaxy (MBE). In particular, we discuss the possible formation mechanism of misfit dislocations at the GaSb/GaAs(001) interface and the origin of threading dislocations in the GaSb epilayer.GaSb thin films with nominal thicknesses of 5 to 100 nm were grown on GaAs(001) by MBE at a growth rate of about 0.8 monolayers per second.


2000 ◽  
Vol 648 ◽  
Author(s):  
Morgan E. Ware ◽  
Robert J. Nemanich

AbstractThe 4% lattice mismatch between Si and Ge creates strain in epitaxial layers of SiGe alloys on Si, and this strain can manifest itself in the morphological structure of the surface of the epitaxial layer. This study explores the relationship of the evolution of the surface morphology of SiGe layers grown on a range of Si surface orientations. We have grown thin, strained and thick, relaxed layers of Si0.7Ge0.3 by solid source molecular beam epitaxy on substrates with surface normals rotated from [001] towards [111] by angles of θ = (0, 2, 4, 10, 22) degrees. The surface morphology was investigated by atomic force microscopy, which showed considerable ordering of surface features on relaxed samples. These features evolve from hut-like structures at 0 degrees to large mesa-like structures separated by pits and crevices at 22 degrees. The organization of these features is also shown to vary with the substrate orientation. Each surface has characteristic directions along which features are aligned, and these directions vary continuously with the angle of rotation of the substrate. Transmission electron microscopy confirmed that misfit dislocations had formed along those same directions. The state of relaxation of each layer is quantified by Raman spectroscopy in order to make a direct correlation between residual strain and surface morphology.


2002 ◽  
Vol 17 (12) ◽  
pp. 3117-3126 ◽  
Author(s):  
Y. L. Qin ◽  
C. L. Jia ◽  
K. Urban ◽  
J. H. Hao ◽  
X. X. Xi

The dislocation configurations in SrTiO3 thin films grown epitaxially on LaAlO3 (100) substrates were studied by conventional and high-resolution transmission electron microscopy. Misfit dislocations had, in most cases, a Burgers vector a〈100〉 and line directions of 〈100〉 These dislocations constitute orthogonal arrays of parallel dislocations at the interface, relieving the lattice mismatch between SrTiO3 and LaAlO3. Threading dislocations were found to be the major defects in the films. Two types of threading dislocations with the Burgers vectors a〈100〉?and a〈100〉?were identified. The relations of these threading dislocations with the misfit dislocations were investigated and are discussed in this paper.


Author(s):  
Dario Schiavon ◽  
Elżbieta Litwin-Staszewska ◽  
Rafał Jakieła ◽  
Szymon Grzanka ◽  
Piotr Perlin

The effect of growth temperature and precursor flows on the doping level and surface morphology of Ge-doped GaN layers was researched. The results show that germanium is more readily incorporated at low temperature, high growth rate and high V/III ratio, thus revealing a similar behavior to what was previously observed for indium. V-pit formation can be blocked at high temperature but also at low V/III ratio, the latter of which however causing step bunching.


MRS Bulletin ◽  
1994 ◽  
Vol 19 (6) ◽  
pp. 32-37 ◽  
Author(s):  
Robert Hull ◽  
John Bean

This article describes the application of transmission electron microscopy (TEM) to real-time, in situ dynamic observations of dislocations in strained epitaxial semiconductor heterostructures. Such experiments allow us to directly observe the formation, motion, and interaction of mis-fit dislocations. Preliminary extension of this work to the in situ measurement of the electrical properties of misfit dislocations will also be described.The Fundamental Scientific IssueIt is well established that it is possible to grow a thin, coherent epitaxial layer on a substrate with a slightly different lattice parameter, as illustrated in Figure la. This concept is known as strained layer epitaxy. In the fields of semiconductor physics and device design, strained layer epitaxy offers many exciting new opportunities (see Reference 1 for a review). A coherently strained structure, however, will store an enormous elastic strain energy density in the epitaxial layer, due to the distortion of interatomic bonds. Therefore, as the epitaxial layer increases in thickness during growth, it will become increasingly energetically favorable to relax this strain energy. A number of relaxation routes exist: (1) roughening of the epitaxial layer surface (see, for example, Reference 2); (2) interdiffusion of the layers (this will generally only be significant at temperatures which are a large fraction of the layer melting temperatures (e.g., Reference 3)); and (3) introduction of a dislocation network into the substrate/epilayer interface, which as shown schematically in Figure lb, will allow the epitaxial layer to relax toward its bulk lattice parameter. This dislocation mechanism is the most prevalent strain relaxation mechanism at typical crystal growth and processing temperatures, and we concentrate on this mechanism in our experimental studies.


1995 ◽  
Vol 09 (11n12) ◽  
pp. 655-664
Author(s):  
A. FISCHER ◽  
H. KÜHNE

A brief review is presented for our new approach in equilibrium theory for strain relaxation in metastable heteroepitaxial semiconductor structures, one which includes the elastic interaction between straight misfit dislocations and the lattice mismatch accommodation by tetragonal distortion of the cubic lattice cells. This approach provides an equilibrium theory which correctly predicts critical strained layer thicknesses and completely describes the strain relief via plastic flow and the phenomenon of work hardening in lattice mismatched epilayers. Experimentally observed values of critical layer thickness and strain relief are discussed and compared with our theoretical predictions.


1990 ◽  
Vol 198 ◽  
Author(s):  
F. Namavar ◽  
E. Cortesi ◽  
D.L. Perry ◽  
E.A. Johnson ◽  
N.M. Kalkhoran ◽  
...  

ABSTRACTWe have investigated improving the crystalline quality of epitaxial silicon grown on SIMOX by confining threading dislocations in the original Si top layer using a GeSi strained layer. Epitaxial Si/GeSi/Si structures were grown by CVD on SIMOX and Si substrates with a GeSi alloy layer about 1000 − 1500 angstroms thick with Ge concentrations of about 0−20%. A Ge concentration in the alloy layer of about 5.5% or higher appears to be necessary in order to bend any of the threading dislocations from the original SIMOX top layer. For a higher Ge concentration of about 16%, most of the threading dislocations appear to be bent and confined by the GeSi layer. In addition, the GeSi strained layers grown by CVD (at about 1000°C) appear to be high quality and no misfit dislocations were observed in the regions studied by XTEM and plane view TEM.


1986 ◽  
Vol 67 ◽  
Author(s):  
El Hang Lee ◽  
M. Abdul Awal ◽  
G. K. Celler ◽  
L. Pfeiffer ◽  
T. T. Sheng

ABSTRACTGermanium films have been epitaxially crystallized on silicon substrates using the electron-beam evaporation technique and the laser! strip-heater recrystallization technique. Epitaxy was achieved either directly on Si surfaces or laterally on oxide/nitride-coated Si wafers. Evaporated Ge epi-layers were mirror-smooth and were found to be in excellent crystal quality. The recrystallized Ge on Si were also found to be good crystal, but showed somewhat roughened surface morphology. In both cases, the Ge near the Ge/Si interface is heavily replete with misfit dislocations arising from 4% lattice mismatch between Ge and Si. The recrystallized Ge on insulator (GOI) showed no mismatch dislocations at the Ge/insulator interface but developed voids arising from Ge dewetting from the insulator surface. Twins have been observed to be the most prominent defects in recrystallized Ge, whether seeded or unseeded. The objective of this study is to achieve quality Ge layers that can be used as intermediate template to accomodate GaAs on Si.


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