Rapid Thermal Annealing of GaAs Films on (001) Si Substrate Grown by Solid Phase Epitaxy Technique

1990 ◽  
Vol 202 ◽  
Author(s):  
W.K. Choo ◽  
K.I. Cho ◽  
J.Y. Lee ◽  
S.C. Park ◽  
O.J. Kwon
Keyword(s):  
Solid Phase ◽  
Substantial Improvement ◽  
Misfit Dislocations ◽  
Solid Phase Epitaxy ◽  
Si Substrate ◽  
Rapid Thermal Anneal ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Distributed Array ◽  
Gaas Films

ABSTRACTGaAs layers grown by solid phase epitaxy on (001) Si substrate were subjected to post-growth rapid thermal anneal (RTA) at 700, 800, and 900°C for 10s in a N2 atmosphere. Rutherford backscattering/channeling showed a substantial improvement in crystalline quality of GaAs epilayer after RTA at 800°C. After RTA at 900°C for 10s, stacking faults (and/or microtwins) were eliminated entirely, and the dislocation densities in both the interface region and the film interior were reduced. High-resolution transmission electron micrographs showed a significant change in misfit dislocation structure at the interface after RTA; namely, the 90° pure edge and 60° misfit dislocations were transformed to an evenly distributed array of 90° dislocations at the interface.

An Influence of the Si(111)3-4o Vicinal Surface on the Solid Phase Epitaxy of α-FeSi2 Nanorods and their Crystal Parameters

2019 ◽  
Vol 806 ◽  
pp. 30-35
Author(s):  
Nikolay Gennadievich Galkin ◽  
Konstantin N. Galkin ◽  
Sergei Andreevich Dotsenko ◽  
Dmitrii L'vovich Goroshko ◽  
Evgeniy Anatolievich Chusovitin ◽  
...  
Keyword(s):  
Direct Evidence ◽  
Solid Phase ◽  
Iron Silicide ◽  
Solid Phase Epitaxy ◽  
Vicinal Surface ◽  
Si Substrate ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Spe Method ◽  
First Time

The morphology and structure of iron silicide nanorods formed on Si (111) vicinal surface by the SPE method at T = 630 °C were studied. Optimal Fe coverage and Fe deposition rate for the formation of a dense array of the nanorods (54-65% of the substrate area) on Si (111) surface with 3-4o miscut angles were established. The aspect ratio of the nanorods is 1.9 – 3.3. Cross-sectional images of a high-resolution transmission electron microscopy (HRTEM) have shown that the nanorods have α-FeSi2 crystal structure. They are strained along the “a” axis and stretched along the “c” axis, which increased the unit cell volume by 10.3%. According to HRTEM image analysis, the nanorods have the following epitaxial relationships: α-FeSi2[01]//Si [10] and α-FeSi2(112)//Si (111). All the data obtained have provided, for the first time, a direct evidence of α-FeSi2 nanorods formation on Si (111) vicinal surface without noticeable penetration of Fe atoms into the Si substrate.

Microstructure of Oxidized Ge0.78SiO.12 annealed in a Reducing Ambient

1995 ◽  
Vol 379 ◽  
Author(s):  
N.D. Theodore ◽  
W.S. Liu ◽  
D.Y.C. Lie ◽  
T.K. Cams ◽  
K.L. Wang
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
High Resolution ◽  
Solid Phase ◽  
Solid Phase Epitaxy ◽  
Seeding Layer ◽  
Transmission Electron ◽  
Microstructural Behavior ◽  
Defect Densities

ABSTRACTTransmission electron microscopy, conventional and high-resolution, is used to characterize the microstructural behavior of oxidized Ge0.78Si0.12 layers annealed in a reducing 95% N2+ 5% H2 ambient. An epitaxial Ge layer grows by solid-phase epitaxy on an underlying Ge0.78Si0.12 seeding layer with a Ge-Sio2 matrix positioned between them. Defect densities in the epitaxial Ge are significantly lower than in the underlying Ge0.78Si0.12. Microstructural details of this behavior are investigated.

Evolution of Epitaxial SixGei1-x Alloys on Si(100) During Thermal Annealing a-Ge/Au Bilayers Deposited on Si Substrate

1992 ◽  
Vol 280 ◽  
Author(s):  
Z. Ma ◽  
L. H. Allen
Keyword(s):  
Single Crystal ◽  
Thermal Annealing ◽  
Rutherford Backscattering Spectrometry ◽  
Solid Phase ◽  
Growth Dynamics ◽  
X Ray Diffraction ◽  
Si Substrate ◽  
Cross Sectional ◽  
X Ray ◽  
Transmission Electron

ABSTRACTSolid phase epitaxial (SPE) growth of SixGei1-x alloys on Si (100) was achieved by thermal annealing a-Ge/Au bilayers deposited on single crystal Si substrate in the temperature range of 280°C to 310°C. Growth dynamics was investigated using X-ray diffraction, Rutherford backscattering spectrometry, and cross-sectional transmission electron microscopy. Upon annealing, Ge atoms migrate along the grain boundaries of polycrystalline Au and the epitaxial growth initiates at localized triple points between two Au grains and Si substrate, simultaneously incorporating a small amount of Si dissolved in Au. The Au is gradually displaced into the top Ge layer. Individual single crystal SixGei1-x islands then grow laterally as well as vertically. Finally, the islands coalesce to form a uniform layer of epitaxial SixGe1-x alloy on the Si substrate. The amount of Si incorporated in the final epitaxial film was found to be dependent upon the annealing temperature.

Interface Formation and the Heteroepitaxy of ZnSe on Si.

1990 ◽  
Vol 198 ◽  
Author(s):  
R. D. Bringans ◽  
D. K. Biegelsen ◽  
F. A. Ponce ◽  
L.-E. Swartz ◽  
J. C. Tramontana
Keyword(s):  
Zinc Selenide ◽  
Room Temperature ◽  
Molecular Beam ◽  
Solid Phase ◽  
Bulk Material ◽  
Znse Crystal ◽  
Si Substrate ◽  
Transmission Electron ◽  
Temperature Deposition ◽  
Substrate Temperatures

ABSTRACTZinc selenide films have been grown heteroepitaxially on Si(100) substrates by molecular beam epitaxy. The growth has been carried out for raised substrate temperatures and also at room temperature followed by solid-phase epitaxial (SPE) regrowth. The ZnSe films have been characterized by a number of surface-sensitive techniques and both the interface and the bulk material have been examined with high resolution transmission electron microscopy (HRTEM). We find that an interlayer, which is most likely SiSex, is present between the ZnSe film and the Si substrate for growths made at 300 °C and causes loss of epitaxy. In the case of room temperature deposition and SPE, it is absent, leading to good epitaxy. In the latter situation, the films are very uniform and there is a 4° rotation of the ZnSe crystal axes relative to those of the Si substrate.

Stability And Precipitation Kinetics In Si1-yCy/Si and Si1-x-yGexC/Si Heterostructures Prepared by Solid Phase Epitaxy

1993 ◽  
Vol 321 ◽  
Author(s):  
J. W. Strane ◽  
S. T. Picraux ◽  
H. J. Stein ◽  
S. R. Lee ◽  
J. Candelaria ◽  
...  
Keyword(s):  
Structural Changes ◽  
Driving Forces ◽  
Solid Phase ◽  
Strain Relaxation ◽  
Solid Phase Epitaxy ◽  
Extended Defects ◽  
Plan View ◽  
Nucleation Barrier ◽  
Transmission Electron ◽  
The Stability

ABSTRACTThis study investigates the stability of Metastable Si1-yCy/Si heterostructures during rapid thermal annealing (RTA) over a temperature range of 1000 – 1150° C Heterostructures of Si1-yCy/Si and Si1-x-yGexCy/Si (x=0.077, y ≤ .0014) were formed by solid phase epitaxy from C implanted, preamorphized substrates using a 30 Minute 700° C anneal in N2. The occupancy of C in substitution lattice sites was monitored by Fourier Transform Infrared Absorption spectroscopy. The layer strain was monitored by rocking curve x-ray diffraction and the structural changes in the layers were determined using plan-view and X-sectional transmission electron Microscopy (TEM). For anneals of 1150° C or above, all the substitutional C was lost from the Si lattice after 30 seconds. TEM verified that the strain relaxation was the result of C precipitating into highly aligned βSiC particles rather than by the formation of extended defects. No nucleation barrier was observed for the loss of substitutional C Preliminary results will also be discussed for Si1-x-yGexCy/Si heterostructures where there is the additional factor of the competition between strain energy and the chemical driving forces.

Ge epilayer of high quality on a Si substrate by solid‐phase epitaxy

1993 ◽  
Vol 63 (10) ◽  
pp. 1405-1407 ◽  
Author(s):  
W. S. Liu ◽  
J. S. Chen ◽  
D. Y. C. Lie ◽  
M.‐A. Nicolet
Keyword(s):  
Solid Phase ◽  
Solid Phase Epitaxy ◽  
Si Substrate ◽  
High Quality

Electrical Activation of Heavily Doped Arsenic Implanted Silicon

1988 ◽  
Vol 128 ◽  
Author(s):  
J. Said ◽  
H. Jaouen ◽  
G. Ghibaudo ◽  
I. Stoemenos ◽  
P. Zaumseil
Keyword(s):  
Solid Phase ◽  
Electrical Activation ◽  
Activation Process ◽  
Solid Phase Epitaxy ◽  
X Ray Diffraction ◽  
Electrical Transmission ◽  
X Ray ◽  
Defect Migration ◽  
Transmission Electron ◽  
Heavily Doped

ABSTRACTThe combination of electrical, Transmission Electron Microscopy and Triple Crystal X-ray Diffraction measurements allow us to separate the existence of a local impurity activation process from the amorphous- crystal transformation. The local process occurs in the highly damaged surface layer induced by the arsenic implantation and is efficient well below the Solid Phase Epitaxy transition temperature. It is suggested that point defect migration should play an important role in the electrical impurity activation at low annealing temperatures.

Marker Experiments for the moving Species in Silicides During Solid Phase Epitaxy of Evaporated Si

1983 ◽  
Vol 25 ◽  
Author(s):  
Chuen-Der Lien ◽  
Meir Bartur ◽  
Marc-A. Nicolet
Keyword(s):  
Nuclear Reaction ◽  
Solid Phase ◽  
Solid Phase Epitaxy ◽  
Silicide Formation ◽  
Si Substrate ◽  
Marker Position

ABSTRACTEvaporated W, implanted Xe, and implanted 18O were used as markers to study the dominant moving species during (a) solid phase epitaxy (SPE) of evaporated Si, (b) silicide formation, and (c) oxidation of silicides on Si substrate.MeV 4He+ backscattering spectrometry and 18O (p, α)15 N nuclear reaction were used to monitor the evolution of elemental profiles as well as the change in the marker position. In most cases, the dominant moving species in SPE is the same as that observed in the formation and oxidation of that silicide. However, in CrSi2 the dominant moving species is Si during silicide formation, but Cr during SPE or oxidation.

Hot-Wire Chemical Vapor Deposition for Epitaxial Silicon Growth On Large-Grained Polycrystalline Silicon Templates

2003 ◽  
Vol 762 ◽  
Author(s):  
M. S. Mason ◽  
C.M. Chen ◽  
H.A. Atwater
Keyword(s):  
Epitaxial Growth ◽  
Polycrystalline Silicon ◽  
Solid Phase ◽  
Chemical Vapor ◽  
Growth Conditions ◽  
Solid Phase Epitaxy ◽  
Epitaxial Silicon ◽  
Hot Wire ◽  
Transmission Electron ◽  
Silicon Growth

AbstractWe investigate low-temperature epitaxial growth of thin silicon films on Si [100] substrates and polycrystalline template layers formed by selective nucleation and solid phase epitaxy (SNSPE). We have grown 300 nm thick epitaxial layers at 300°C on silicon [100] substrates using a high H2:SiH4 ratio of 70:1. Transmission electron microscopy confirms that the films are epitaxial with a periodic array of stacking faults and are highly twinned after approximately 240 nm of growth. Evidence is also presented for epitaxial growth on polycrystalline SNSPE templates under the same growth conditions.

A Tem Study of Defect Structure in GaAs Film on Si Substrate

1993 ◽  
Vol 325 ◽  
Author(s):  
Sahn Nahm ◽  
Hee-Tae Lee ◽  
Sang-Gi Kim ◽  
Kyoung-Ik Cho
Keyword(s):  
Buffer Layer ◽  
Defect Structure ◽  
Stacking Faults ◽  
Misfit Dislocations ◽  
Gaas Film ◽  
Si Substrate ◽  
Moiré Fringes ◽  
Gaas Films ◽  
Layer Stacking ◽  
Gaas Buffer Layer

AbstractFor the GaAs buffer layer deposited on Si substrate at 80°C and annealed at 300°C for 10 min, the size of most GaAs islands was observed as ∼ 10 nm but large islands (∼ 40 nm) were also seen. According to the calculation of spacing of moire fringes, large GaAs islands are considered to be rotated about 4 ° with respect to the Si substrate normal. However, for the main GaAs film overgrown on the GaAs buffer layer at 580 °C, moire fringes with the spacing of 5 nm (GaAs film without rotation) completely covered the surface of Si substrate. Misfit dislocations and stacking faults were already formed at the growth stage of buffer layer. Stacking faults and misfit dislocations consisting of Lomer and 60 ° dislocations were observed in GaAs films grown at 580 °C. However, after rapid thermal annealing at 900 °C for 10 sec, only Lomer dislocations with 1/2[110] and 1/2[-110] Burgers vectors were observed.

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