Mechanical Behavior of Benzocyclobutene Films on Silicon Substrates

1991 ◽  
Vol 226 ◽  
Author(s):  
P. H. Townsend ◽  
T. M. Stokich ◽  
B. S. Huber
Keyword(s):  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Mechanical Behavior ◽  
Structural State ◽  
Room Temperature ◽  
Silicon Substrates ◽  
Positional Isomers ◽  
Thermal Cycles ◽  
Substrate Curvature

AbstractThe evolution of the stress in coatings derived from divinylsiloxane bisbenzocyclobutene, mixed stereo and positional isomers of 1,3-bis(2-bicyclo[4.2.0]octa-1,3,5-trien-3-ylethenyl)-1,1,3,3-tetramethyl disiloxane (CAS 117732-87-3), has been measured on silicon substrates with an optically levered beam during thermal cycles. The stress at room temperature in gelled coatings varies between ca. 15 MPa and 45 MPa depending on the cure schedule. The progression of the polymer's glass transition temperature is correlated with the evolution of the structural state observed with FTIR. A method is presented for predictably controlling substrate curvature during multilayer processing.

scholarly journals Self-Sensing Carbon Nanotube Composites Exposed to Glass Transition Temperature

Materials ◽  
2020 ◽  
Vol 13 (2) ◽  
pp. 259 ◽  
Author(s):  
Sung-Hwan Jang ◽  
Long-Yuan Li
Keyword(s):  
Glass Transition ◽  
Carbon Nanotube ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Mechanical Behavior ◽  
Epoxy Matrix ◽  
Room Temperature ◽  
Epoxy Composites ◽  
Nanotube Composites ◽  
Proportional Relationship

This paper reported the effect of high temperature on the electro-mechanical behavior of carbon nanotube (CNT) reinforced epoxy composites. CNT/epoxy composites were fabricated by dispersing CNTs in the epoxy matrix using a solution casting method. Electrical conductivity measurements obtained for the CNT/epoxy composites indicated a steadily increasing directly proportional relationship with CNT concentration with a percolation threshold at 0.25 wt %, reaching a maximum of up to 0.01 S/m at 2.00 wt % CNTs. The electro-mechanical behavior of CNT/epoxy composites were investigated at a room temperature under the static and cyclic compressive loadings, resulting that the change in resistance of CNT/epoxy composites was reduced as increasing CNT concentration with good repeatability. This is due to well-networked CNTs conducting pathways created within the solid epoxy matrix observed by scanning electron microscopy. Temperature significantly affects the electro-mechanical behavior of CNT/epoxy composites. In particular, the electro-mechanical behavior of CNT/epoxy composites below the glass transition temperature showed the similar trend with those at room temperature, whereas the electro-mechanical behavior of CNT/epoxy composites above the glass transition temperature showed an opposite change in resistance with poor repeatability due to unstable CNT network in epoxy matrix.

Effect of reduced graphene oxide on mechanical behavior of an epoxy adhesive in glassy and rubbery states

2021 ◽  
pp. 002199832110316
Author(s):  
Ata Khabaz-Aghdam ◽  
Bashir Behjat ◽  
EAS Marques ◽  
RJC Carbas ◽  
Lucas FM da Silva ◽  
...  
Keyword(s):  
Graphene Oxide ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Ambient Temperature ◽  
Mechanical Behavior ◽  
Reduced Graphene Oxide ◽  
Epoxy Adhesive ◽  
Ultimate Strain ◽  
Reduced Graphene

The mechanical behavior of an adhesive, in neat state and reinforced with up to 0.5 wt% of reduced graphene oxide (RGO) was investigated here. Tests were done at temperatures between the ambient temperature and the glass transition temperature ( Tg[Formula: see text] of the adhesive. Using a metal mold, cured plates of the neat and RGO reinforced epoxy adhesive were prepared. The adhesive powder and the bulk dumbbell-shaped specimens, obtained from cured adhesive plates, were subjected to differential scanning calorimetry (DSC) and tensile tests, respectively, to obtain the Tg as well as mechanical properties of the adhesives. The results indicated that adding RGO up to 0.5 wt% increased the glass transition temperature, the modulus of elasticity, and the strength of the adhesive. It was found that the presence of RGO reduced the adhesive’s strain at the break at the ambient temperature. However, at high temperatures, near the Tg, the ultimate strain of RGO-reinforced adhesives decreased slightly when compared to the ultimate strain of the neat specimens. This explains the reduction in toughness at ambient temperature obtained by adding RGO and the increase at high temperatures. Finally, the failure morphology of the neat and RGO-reinforced adhesive specimens was investigated using microscopic imaging of the specimens’ failure cross-sections, which supported and justified the experimental observations.

Silk Polymer Coating with Low Dielectric Constant and High Thermal Stability for Ulsi Interlayer Dielectric

1997 ◽  
Vol 476 ◽  
Author(s):  
P. H. Townsend ◽  
S. J. Martin ◽  
J. Godschalx ◽  
D. R. Romer ◽  
D. W. Smith ◽  
...  
Keyword(s):  
Thin Film ◽  
Dielectric Constant ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Integrated Circuits ◽  
Room Temperature ◽  
Polymer Network ◽  
Flow Characteristics ◽  
Interlayer Dielectric

AbstractA novel polymer has been developed for use as a thin film dielectric in the interconnect structure of high density integrated circuits. The coating is applied to the substrate as an oligomeric solution, SiLK*, using conventional spin coating equipment and produces highly uniform films after curing at 400 °C to 450 °C. The oligomeric solution, with a viscosity of ca. 30 cPs, is readily handled on standard thin film coating equipment. Polymerization does not require a catalyst. There is no water evolved during the polymerization. The resulting polymer network is an aromatic hydrocarbon with an isotropie structure and contains no fluorine.The properties of the cured films are designed to permit integration with current ILD processes. In particular, the rate of weight-loss during isothermal exposures at 450 °C is ca. 0.7 wt.%/hour. The dielectric constant of cured SiLK has been measured at 2.65. The refractive index in both the in-plane and out-of-plane directions is 1.63. The flow characteristics of SiLK lead to broad topographic planarization and permit the filling of gaps at least as narrow as 0.1 μm. The glass transition temperature for the fully cured film is greater than 490 °C. The coefficient of thermal expansivity is 66 ppm/°C below the glass transition temperature. The stress in fully cured films on Si wafers is ca. 60 MPa at room temperature. The fracture toughness measured on thin films is 0.62 MPa m ½. Thin coatings absorb less than 0.25 wt.% water when exposed to 80% relative humidity at room temperature.

The Effect of Thermal History on Porcelain Expansion Behavior

1989 ◽  
Vol 68 (9) ◽  
pp. 1313-1315 ◽  
Author(s):  
C.W. Fairhurst ◽  
D.T. Hashinger ◽  
S.W. Twiggs
Keyword(s):  
Thermal Expansion ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Heating Rate ◽  
Room Temperature ◽  
Heating Rates ◽  
Thermal Expansion Data ◽  
Temperature Range ◽  
Expansion Behavior

Porcelain-fused-to-metal restorations are fired several hundred degrees above the glass-transition temperature and cooled rapidly through the glass-transition temperature range. Thermal expansion data from room temperature to above the glass-transition temperature range are important for the thermal expansion of the porcelain to be matched to the alloy. The effect of heating rate during measurement of thermal expansion was determined for NBS SRM 710 glass and four commercial opaque and body porcelain products. Thermal expansion data were obtained at heating rates of from 3 to 30°C/min after the porcelain was cooled at the same rate. By use of the Moynihan equation (where Tg systematically increases in temperature with an increase in cooling/heating rate), the glass-transition temperatures (Tg) derived from these data were shown to be related to the heating rate.

A carbon nanotube–epoxy interface improved damping below the glass transition temperature

RSC Advances ◽  
2016 ◽  
Vol 6 (25) ◽  
pp. 21271-21276 ◽  
Author(s):  
Yung-Chi Chu ◽  
Ming-Hsiao Weng ◽  
Wen-Yi Lin ◽  
Hsin-Jung Tsai ◽  
Wen-Kuang Hsu
Keyword(s):  
Glass Transition ◽  
Carbon Nanotube ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Room Temperature ◽  
Viscous Drag

Composites made from fibers and epoxy display a low viscous drag and are rarely used as mechanical dampers at room temperature.

scholarly journals The Effect of Glass-cracking during Cooling in Liquid Nitrogen on Viability of Mint Shoot Tips

HortScience ◽  
1995 ◽  
Vol 30 (4) ◽  
pp. 874D-874
Author(s):  
L.E. Towill
Keyword(s):  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Liquid Nitrogen ◽  
Plant Species ◽  
Room Temperature ◽  
Shoot Formation ◽  
Shoot Tips ◽  
Vitrification Solution

Cryopreservation using vitrification has been reported for several plant species. Shoot tips and vitrification solution were placed in semen straws and immersed in liquid nitrogen (LN). Cracking of the external glass occurred, but may be avoided by annealing slightly below the glass transition temperature before immersion. A varying percentage still cracked with some vitrification solutions. Rapid warming also can cause cracking. There is concern that cracking may reduce viability. Shoot tips from Mentha species were used to examine this problem. Glass cracking during either cooling or warming did not produce visible damage to shoot tips. Viability of shoot tips from tubes that cracked during cooling was not different from those that did not crack; however, shoot formation was slightly reduced. Cracking upon warming did not reduce viability nor shoot formation. Very slow warming reduced viability, but warming in either water or air (room temperature) gave higher levels of survival.

scholarly journals Brewer’s spent yeast as wall material for microencapsulation of food compounds

2019 ◽  
Author(s):  
Rafaela Polessi Saturno ◽  
Miriam Dupas Hubinger ◽  
Gabriela Vollet Marson
Keyword(s):  
Ascorbic Acid ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Room Temperature ◽  
Core Material ◽  
Wall Material ◽  
Operational Conditions ◽  
Particle Stability ◽  
Brewer’S Spent Yeast

The brewer's spent yeast hydrolyzed precipitate was used as wall material for microencapsulation of ascorbic acid by the spray drying technique. The wall material had its centesimal composition determined as well as some physicochemical aspects: surface charge, surface tension and glass transition temperature, in order to study the behavior of the material after being atomized and to identify the most suitable core material. Operational conditions were also studied in the spray dryer. After microencapsulation, a 64% yield and a microencapsulation efficiency of 100% were achieved. Microparticle analyses showed low values of water activity and high glass transition temperature, indicating absence of microbiological activity and great particle stability at room temperature, respectively, suggesting that this wall material is suitable for protecting the ascorbic acid.

Large Strain Mechanical Behavior of Poly(methyl methacrylate) (PMMA) Near the Glass Transition Temperature

2006 ◽  
Vol 128 (4) ◽  
pp. 559-563 ◽  
Author(s):  
G. Palm ◽  
R. B. Dupaix ◽  
J. Castro
Keyword(s):  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Methyl Methacrylate ◽  
Mechanical Behavior ◽  
Strain Hardening ◽  
Uniaxial Compression ◽  
Large Strain ◽  
Strain Rates ◽  
Poly Methyl Methacrylate

The mechanical behavior of amorphous thermoplastics, such as poly(methyl methacrylate) (PMMA), strongly depends on temperature and strain rate. Understanding these dependencies is critical for many polymer processing applications and, in particular, for those occurring near the glass transition temperature, such as hot embossing. In this study, the large strain mechanical behavior of PMMA is investigated using uniaxial compression tests at varying temperatures and strain rates. In this study we capture the temperature and rate of deformation dependence of PMMA, and results correlate well to previous experimental work found in the literature for similar temperatures and strain rates. A three-dimensional constitutive model previously used to describe the mechanical behavior of another amorphous polymer, poly(ethylene terephthalate)-glycol (PETG), is applied to model the observed behavior of PMMA. A comparison with the experimental results reveals that the model is able to successfully capture the observed stress-strain behavior of PMMA, including the initial elastic modulus, flow stress, initial strain hardening, and final dramatic strain hardening behavior in uniaxial compression near the glass transition temperature.

INFLUENCE OF MULTIPLE CURING ON MECHANICAL PROPERTIES OF EPOXY MATRIX AND ITS ADHESION TO FIBERS

2021 ◽  
pp. 12-19
Keyword(s):  
Mechanical Properties ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Mechanical Behavior ◽  
Adhesive Strength ◽  
Epoxy Matrix ◽  
Steel Wire ◽  
Curing Temperature ◽  
The Matrix

Adhesive strength of «epoxy binder-steel wire» joints and the mechanical behavior of the binder during multiple repeated curing have been investigated. It is shown that when the curing temperature is considerably higher than the glass transition temperature of the binder, the adhesive strength decreases monotonically with an increase in the number of curing cycles. In this case the mechanical properties of the matrix also decrease. Possible mechanisms of the observed changes are discussed.

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