Si Nanostructure Fabrication by Ga+ FIB Selective Doping and Anisotropic Etching

1991 ◽  
Vol 256 ◽  
Author(s):  
A. J. Steckl ◽  
H. C. Mogul ◽  
S. Mogren
Keyword(s):  
Etch Rate ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Anisotropic Etching ◽  
Wet Etching ◽  
Fabrication Technique ◽  
Nanostructure Fabrication ◽  
Implantation Energy ◽  
Si Substrates ◽  
Si Nanostructures

ABSTRACTA novel fabrication technique involving the use of focused ion beam (FIB) selective implantation to fabricate nanostructures on crystalline Si substrates in conjunction with anisotropic etching is described. Using this maskless & resistless approach, Si nanostructures were fabricated by FIB implantation of Ga+ at doses from 1015 to 1016/cm 2. Wet etching in KOH/IPA does not attack the implanted region, while it removes the underlying Si anisotropically, with a very low etch rate on the {111} planes. The result is a cantilever-like structure whose thickness is dependent on the implantation energy and dose. Pre-etching rapid thermal annealing at 600°C for 30 sec does not prevent structure fabrication and post-etching RTA does not affect the shape of the structures.

Electronic Properties of Bismuth Nanowires

2001 ◽  
Vol 679 ◽  
Author(s):  
Stephen B. Cronin ◽  
Yu-Ming Lin ◽  
Oded Rabin ◽  
Marcie R. Black ◽  
Gene Dresselhaus ◽  
...  
Keyword(s):  
Theoretical Model ◽  
Band Structure ◽  
Temperature Dependence ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Temperature Dependent ◽  
Si Substrates ◽  
Bismuth Nanowires ◽  
Bi Nanowire ◽  
Anodic Alumina Templates

ABSTRACTThe pressure filling of anodic alumina templates with molten bismuth has been used to synthesize single crystalline bismuth nanowires with diameters ranging from 7 to 200nm and lengths of 50μm. The nanowires are separated by dissolving the template, and electrodes are affixed to single Bi nanowires on Si substrates. A focused ion beam (FIB) technique is used first to sputter off the oxide from the nanowires with a Ga ion beam and then to deposit Pt without breaking vacuum. The resistivity of a 200nm diameter Bi nanowire is found to be only slightly greater than the bulk value, while preliminary measurements indicate that the resistivity of a 100nm diameter nanowire is significantly larger than bulk. The temperature dependence of the resistivity of a 100nm nanowire is modeled by considering the temperature dependent band parameters and the quantized band structure of the nanowires. This theoretical model is consistent with the experimental results.

PLANAR JOSEPHSON JUNCTIONS FABRICATED BY FOCUSED-ION BEAM

2001 ◽  
Vol 15 (24n25) ◽  
pp. 3359-3360 ◽  
Author(s):  
Hye-Won Seo ◽  
Quark Y. Chen ◽  
Chong Wang ◽  
Wei-Kan Chu ◽  
T. M. Chuang ◽  
...  
Keyword(s):  
Silicon Dioxide ◽  
Josephson Junctions ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Spot Size ◽  
Physical Significance ◽  
Fabrication Technique ◽  
Beam Spot ◽  
Beam Spot Size ◽  
Current Voltage

We have fabricated nano-scaled planar superconductor-insulator-superconductor Josephson junctions using focused ion beam (FIB) with beam spot size ~5 nm . To study the effectiveness of this fabrication technique and for the purpose of comparisons, a variety of samples have been made based on high temperature superconducting (HTS) YBa2Cu3O7-δ electrodes. The insulators are either vacuum or silicon dioxide. The samples showed current-voltage (IV) characteristics typical of a resistively shunted junction (RSJ). We will discuss various aspects of the processing methods and the physical significance of the junction characteristics.

scholarly journals An Experiment-Based Profile Function for the Calculation of Damage Distribution in Bulk Silicon Induced by a Helium Focused Ion Beam Process

Sensors ◽  
2020 ◽  
Vol 20 (8) ◽  
pp. 2306 ◽  
Author(s):  
Qianhuang Chen ◽  
Tianyang Shao ◽  
Yan Xing
Keyword(s):  
Beam Energy ◽  
Focused Ion Beam ◽  
Crystalline Silicon ◽  
Ion Beam ◽  
Single Crystalline Silicon ◽  
Nanostructure Fabrication ◽  
Profile Function ◽  
Single Crystalline ◽  
Prediction Function ◽  
Wide Range

The helium focused ion beam (He-FIB) is widely used in the field of nanostructure fabrication due to its high resolution. Complicated forms of processing damage induced by He-FIB can be observed in substrates, and these damages have a severe impact on nanostructure processing. This study experimentally investigated the influence of the beam energy and ion dose of He-FIB on processing damage. Based on the experimental results, a prediction function for the amorphous damage profile of the single-crystalline silicon substrate caused by incident He-FIB was proposed, and a method for calculating the amorphous damage profile by inputting ion dose and beam energy was established. Based on one set of the amorphous damage profiles, the function coefficients were determined using a genetic algorithm. Experiments on single-crystalline silicon scanned by He-FIB under different process parameters were carried out to validate the model. The proposed experiment-based model can accurately predict the amorphous damage profile induced by He-FIB under a wide range of different ion doses and beam energies.

Formation of Sub-100 NM GE Wires on Si by E-Beam Evaporation/Lithography

1995 ◽  
Vol 380 ◽  
Author(s):  
C. Deng ◽  
J. C. Wu ◽  
C. J. Barbero ◽  
T. W. Sigmon ◽  
M. N. Wybourne
Keyword(s):  
Cross Section ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Si Substrates ◽  
Novel Technique ◽  
Atomic Force ◽  
Transmission Electron ◽  
First Time ◽  
Scanning Electron

ABSTRACTA fabrication process for sub-100 nm Ge wires on Si substrates is reported for the first time. Wires with a cross section of 6 × 57 nm2 are demonstrated. The wire structures are analyzed by atomic force (AFM), scanning electron (SEM), and transmission electron microscopy (TEM). Sample preparation for TEM is performed using a novel technique using both pre and in situ deposition of multiple protection layers using a Focused Ion Beam (FIB) micromachining system.

Ge dot organization on Si substrates patterned by focused ion beam

2004 ◽  
Vol 85 (26) ◽  
pp. 6401-6403 ◽  
Author(s):  
A. Karmous ◽  
A. Cuenat ◽  
A. Ronda ◽  
I. Berbezier ◽  
S. Atha ◽  
...  
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Si Substrates

Roughness Effects During Focused Ion Beam Repair of X-Ray Masks with Polycrystalline Tungsten Absorbers

1992 ◽  
Vol 279 ◽  
Author(s):  
R. R. Kola ◽  
G. K. Celler ◽  
L R. Harriott
Keyword(s):  
Material Removal ◽  
Etch Rate ◽  
Focused Ion Beam ◽  
Removal Rate ◽  
Ion Beam ◽  
Sidewall Roughness ◽  
X Ray ◽  
Polycrystalline Tungsten ◽  
Absorber Material ◽  
Defect Repair

ABSTRACTTungsten is emerging as the absorber material of choice for x-ray masks due to recent advances in the deposition of low stress films. For a practical technology, the masks must be free from defects. These defects may be in the form of excess or missing absorber. Finely focused ion beams have been used for defect repair on x-ray masks, both for removal of excess absorber material by physical sputtering and for addition of absorber material by ion-induced deposition. The eifect of ion channeling in polycrystalline tungsten films is spatially nonuniform material removal during sputtering. Different grains will have significantly different sputtering yields, depending on their orientation with respect to the direction of the ion beam. The repaired features then suffer from roughness on the bottoms and sidewalls of the sputter craters. We have investigated the use of XeF2 assisted sputtering with a 20 keV Ga+ focused ion beam to reduce this roughness. The chemical etching component of the material removal lessens the directional dependence and therefore the roughness during defect repair. It was also found that chromium etch rate was reduced in the presence of XeF2 gas while the etch rate of W was enhanced so that the removal rate of Cr is much less than that of W. We can take advantage of this etch selectivity by using a thin Cr layer under the W absorber as an etch stop layer to eliminate the roughness at the bottom of the features and a thin layer of Cr on top of the W as an etch mask for reducing the sidewall roughness.

Fabricating Two-Dimensional Metal Nanocrystal Arrays Using Pulsed-Laser Deposition and Focused Ion-Beam Technologies

2000 ◽  
Vol 636 ◽  
Author(s):  
Richard F. Haglund ◽  
Robert A. Weller ◽  
Cynthia E. Heiner ◽  
Matthew D. McMahon ◽  
Robert H. Magruder ◽  
...  
Keyword(s):  
Pulsed Laser Deposition ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
High Vacuum ◽  
Pulsed Laser ◽  
Laser Deposition ◽  
Silicon Surfaces ◽  
Silver Nanoclusters ◽  
Laser Evaporation ◽  
Si Substrates

AbstractWe describe recent experiments in which we attempted the initial steps for fabricating twodimensional arrays of metal nanocrystals. We use a commercial pulsed-laser deposition system in concert with a focused ion beam to attempt control over both lateral and vertical dimensions at the nanometer length scale. In our experiments, regular arrays of holes typically 80 nm in diameter were drilled in Si substrates using the focused ion beam. Silver atoms were then deposited onto these substrates by pulsed laser evaporation from a metallic target in high vacuum. Under certain conditions of substrate temperature, laser pulse repetition rate, and fluence, small silver nanoclusters form preferentially around the structures previously etched in the silicon surfaces by the focused ion beam.

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