Material Properties of Coherent Tin Films

1995 ◽  
Vol 391 ◽  
Author(s):  
Ken Ngan
Keyword(s):  
Grain Size ◽  
Hydrogen Content ◽  
Material Properties ◽  
Crystal Orientation ◽  
Lattice Spacing ◽  
Low Pressure ◽  
Atomic Composition ◽  
Tin Films ◽  
Stress Lattice ◽  
Analytical Tools

AbstractIn this paper, material properties of low pressure, metallic mode Coherent TiN and poison mode Coherent TiN have been examined. The material properties include resistivity, crystal orientation, stress, lattice spacing, density, texture, atomic composition, bonding, roughness, hydrogen content, and grain size. Various analytical tools have been used to analyze the TiN films.

scholarly journals Crystal Orientation-Dependent Oxidation of Epitaxial TiN Films with Tunable Plasmonics

ACS Photonics ◽  
2021 ◽  
Vol 8 (3) ◽  
pp. 847-856
Author(s):  
Ruyi Zhang ◽  
Qian-Ying Ma ◽  
Haigang Liu ◽  
Tian-Yu Sun ◽  
Jiachang Bi ◽  
...  
Keyword(s):  
Crystal Orientation ◽  
Tin Films

scholarly journals Quantitative Microscopy

1984 ◽  
pp. 410-508
Keyword(s):  
Grain Size ◽  
Material Properties ◽  
Volume Fraction ◽  
Fracture Morphology ◽  
Quantitative Microscopy ◽  
And Behaviors

Abstract This chapter covers the emerging practice of quantitative microscopy and its application in the study of the microstructure of metals. It describes the methods used to quantify structural gradients, volume fraction, grain size and distribution, and other features of interest. It provides examples showing how the various features appear, how they are measured, and how the resulting data are converted into usable form. The chapter also discusses the quantification of fracture morphology and its correlation with material properties and behaviors.

THE EFFECT OF PREPARED PARAMETERS ON THE MICROSTRUCTURE OF ELECTRODEPOSITED NANOCRYSTALLINE NICKEL COATING

2004 ◽  
Vol 11 (04n05) ◽  
pp. 433-442 ◽  
Author(s):  
C. Y. DAI ◽  
Y. PAN ◽  
S. JIANG ◽  
Y. C. ZHOU
Keyword(s):  
Grain Size ◽  
Surface Morphology ◽  
Current Density ◽  
Crystal Orientation ◽  
Nickel Coating ◽  
Pulse Frequency ◽  
Lattice Parameter ◽  
Nanocrystalline Nickel ◽  
Peak Current Density ◽  
Peak Current

The nanocrystalline nickel coating was synthesized by pulse-jet electrodeposition from modified Watts bath. Pulse and jet plating was employed to increase the deposition current density, decrease diffusion layer, increase the nucleation rate and in this case the prepared method would result in fine-grained deposits. Transmission and scanning electron microscopy and X-ray diffraction (XRD) were used to study the microstructure, the surface morphology, the crystal preferred orientation and the variety of the lattice parameter respectively. The influence of pulse parameters, namely peak current density, the duty cycle and pulse frequency on the grain size, surface morphology, crystal orientation and microstructure was studied. The results showed that with increasing peak current density, the deposit grain size was found to decrease markedly in other parameters at constant. However, in our experiment it was found that the grain size increased slightly with increasing pulse frequency. For higher peak current density, the surface morphology was smoother. The crystal orientation progressively changed from an almost random distribution to a strong (111) texture. This means that the peak current density was the dominated parameter to effect the microstructure of electrodeposited nanocrystalline nickel coating. In addition, the lattice parameter for the deposited nickel is calculated from XRD and it is found that the calculated value is less than the lattice parameter for the perfect nickel single crystal. This phenomenon is explained by the crystal lattice mismatch.

Analysis and Prediction of Surface Integrity in Machining: A Review

2014 ◽  
Vol 610 ◽  
pp. 1002-1020 ◽  
Author(s):  
Yuan Gao ◽  
Xin Huang ◽  
Ming Jie Lin ◽  
Zheng Guo Wang ◽  
Rong Lei Sun
Keyword(s):  
Surface Roughness ◽  
Grain Size ◽  
Residual Stresses ◽  
Surface Integrity ◽  
Material Properties ◽  
Cutting Parameters ◽  
Mechanical Parameters ◽  
Factors Affecting ◽  
Grain Size And Shape

Surface integrity is widely used for evaluating the quality of machined components. It has a set of various parameters which can be grouped as: (a) topography parameters such as surface roughness, textures and waviness (b) mechanical parameters such as residual stresses and hardness, and (c) metallurgical state such as microstructure, phase transformation, grain size and shape, inclusions etc. Surface roughness and residual stresses are among the most significant parameters of surface integrity, so that it is worth investigating them particularly. Many factors affect the surface integrity of machined components, including cutting parameters, tool parameters, material properties and vibrations. We can make prediction and optimization for surface integrity by taking advantage of these factors. This paper reviews previous studies and gives a comprehensive summary of surface integrity in the following order: introduction of surface integrity, main parameters of surface integrity, factors affecting surface integrity, prediction and optimization for surface integrity.

Effect of Hydrogen Content on Structure and Properties of Sintering Body Utilizing TC21 Hydrogenated Powder

2012 ◽  
Vol 581-582 ◽  
pp. 777-781
Author(s):  
Ya Qiang Tian ◽  
Ying Li Wei ◽  
Hong Liang Hou ◽  
Xue Ping Ren
Keyword(s):  
Mechanical Property ◽  
Grain Size ◽  
Titanium Alloy ◽  
Yield Strength ◽  
Hydrogen Content ◽  
Room Temperature ◽  
Sintered Body ◽  
Compressive Yield Strength ◽  
Structure And Properties ◽  
Die Forming

The effect of hydrogenation on structure and properties of TC21 alloy by die forming and sintering using hydrogenated powder was researched by means of the room-temperature die forming and sintering in protection air to produce titanium alloy. The results show that the structure of TC21 titanium sintered body using hydrogenated powder with hydrogen content of 0.39 wt% by die forming and sintering is thinner and the density is higher than the others. The compression strength and compressive yield strength of TC21 sintered body with hydrogen content of 0.39 wt% are well. With hydrogen content increasing, the structure of TC21 production using hydrogenated powder by die forming and sintering gets well and the grain size becomes smaller. After annealing, the structure of TC21 titanium production gets more uniformity and refinement obviously, and the hydrogen content of TC21 alloy safety state is achieved. In the end, the density and mechanical property of TC21 titanium alloy sintered body with hydrogen content of 0.39wt % is the best.

Tribological behavior of TiN films depositid by reactive magnetron sputtering under low pressure

2016 ◽  
Vol 37 (3) ◽  
pp. 289-292 ◽  
Author(s):  
M. V. Ermolenko ◽  
S. M. Zavadski ◽  
D. A. Golosov ◽  
S. N. Melnikov ◽  
E. G. Zamburg
Keyword(s):  
Magnetron Sputtering ◽  
Tribological Behavior ◽  
Low Pressure ◽  
Reactive Magnetron Sputtering ◽  
Reactive Magnetron ◽  
Tin Films

Effects of Process Parameters on Graphene Growth Via Low-Pressure Chemical Vapor Deposition

2020 ◽  
Vol 8 (3) ◽  
Author(s):  
Byoungdo Lee ◽  
Weishen Chu ◽  
Wei Li
Keyword(s):  
Grain Size ◽  
Chemical Vapor Deposition ◽  
Process Parameters ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
High Growth ◽  
Low Pressure ◽  
Large Set ◽  
Graphene Growth ◽  
Pressure Chemical

Abstract Graphene has attracted enormous research interest due to its extraordinary material properties. Process control to achieve high-quality graphene is indispensable for graphene-based applications. This research investigates the effects of process parameters on graphene quality in a low-pressure chemical vapor deposition (LPCVD) graphene growth process. A fractional factorial design of experiment is conducted to provide understanding on not only the main effect of process parameters, but also the interaction effect among them. Graphene quality including the number of layers and grain size is analyzed. To achieve monolayer graphene with large grain size, a condition with low CH4–H2 ratio, short growth time, high growth pressure, high growth temperature, and slow cooling rate is recommended. This study considers a large set of process parameters with their interaction effects and provides guidelines to optimize graphene growth via LPCVD focusing on the number of graphene layers and the grain size.

Microstructure of Pvd Al Deposition on CVD Tin

1997 ◽  
Vol 3 (S2) ◽  
pp. 493-494
Author(s):  
Na Zhang ◽  
Mark McNicholas ◽  
Bob Anderhalt ◽  
Evan Slow ◽  
Neil Colvin
Keyword(s):  
Sheet Resistance ◽  
Crystal Orientation ◽  
Tin Films ◽  
Tin Film ◽  
Secondary Role ◽  
Step Coverage ◽  
System 2

CVD TiN films offer promise as a barrier to Al deposition as a result of the improved conformai step coverage of this film in 0.25 μm contact holes. As an underlayer, the TiN performs a secondary role by improving electromigration (EM) resistance. This is a result of the crystal orientation of the TiN film and its influence on the orientation of the subsequent Al layer. A <111>Al orientation shows improved EM resistance; however, CVD TiN has a preferred <200> orientation as opposed to a <111>PVD TiN orientation.In this study, two parts were investigated: 1) obtain a qualified PVD Al film on a CVD <200> TiN barrier in terms of sheet resistance and reflectivity utilizing MRC's Eclipse™ Mark II PVD system; 2) examine the texture of the Al film utilizing Philips XL30 SEM equipped with EDAX-DX4 EDS system and Electron Back Scatter Pattern (EBSP) system.

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