Effect of Tribological Properties of Undoped and Florine-Doped Silicon Di-Oxide Fims on Chemical Mechanical Planarization Process

2001 ◽  
Vol 697 ◽  
Author(s):  
A.K. Sikder ◽  
S. Thagella ◽  
U.C. Bandugilla ◽  
Ashok Kumar
Keyword(s):  
Tribological Properties ◽  
Chemical Mechanical Planarization ◽  
Critical Role ◽  
Successful Implementation ◽  
Emission Signal ◽  
Doped Silicon ◽  
The Coefficient Of Friction ◽  
Planarization Process ◽  
Silica Slurry ◽  
Physical Phenomena

AbstractChemical mechanical planarization (CMP) occurs at an atomic level at the slurry/wafer interface and hence slurries and the interaction of the films and polishing pads play a critical role in the successful implementation of this process. Understanding the tribological properties of a dielectric layer in the CMP process is critical for successful evaluation and implementation of the materials. In this paper, we present the effect of tribological properties of undoped and florine doped silicon dioxide films on their CMP process. A micro-CMP tester was used to study the fundamental aspects of CMP process. We have studied the CMP process of oxides on polyurethane pads (IC1000-B4/SubaIV) with colloidal silica slurry at different conditions. The coefficient of friction (COF) and acoustic emission signal was monitored during process. The COF was measured during the process and was found to varies differently for different samples and with down force and platen roatation. The effects of machine's parameters on the polishing performance and correlation of physical phenomena with the process has been discussed.

Metrology Issues in Cu-Low-K Chemical Mechanical Planarization

2002 ◽  
Vol 750 ◽  
Author(s):  
Parshuram B. Zantye ◽  
Arun K. Sikder ◽  
Swetha Thagella ◽  
Nivedita Gulati ◽  
Ashok Kumar
Keyword(s):  
Tribological Properties ◽  
Surface Characterization ◽  
Chemical Mechanical Planarization ◽  
Dielectric Materials ◽  
Successful Implementation ◽  
Post Process ◽  
Damascene Process ◽  
Reduced Modulus ◽  
Materials Used ◽  
Cu Cmp

ABSTRACTUltra low-k materials used in Cu damascene process are inherently soft and weak in nature; hence the evaluation of tribological properties of these materials is an issue of paramount importance in the field of semiconductor fabrication. Chemical Mechanical Polishing (CMP) of these films is a major challenge due to their reduced modulus and cohesive strength. The objective of this research is to develop a strong understanding of the tribological properties of Cu ultra low-k dielectric materials for successful implementation in the semiconductor devices. The Cu ultra low-k systems are polished at different conditions of load and platen rotation and their polishing behavior is compared with the standard Cu-SiO2 system. The polishing behavior of Cu and the barrier Ta material is studied in order to effectively detect the end point of the Cu CMP process. Delamination studies, post process surface characterization using scanning electron microscopy and the reliability issues of these materials also come within the scope of this study.

In-Situ Tribological Properties Monitoring and Chemical Mechanical Characterization of Planarization Process

2004 ◽  
Author(s):  
Arun Sikder ◽  
Norm Gitis ◽  
Michael Vinogradov ◽  
Antanas Daugela
Keyword(s):  
Integrated Circuits ◽  
Tribological Properties ◽  
Chemical Mechanical Planarization ◽  
Signal Propagation ◽  
Emission Data ◽  
Severe Problem ◽  
Lower Dielectric Constant ◽  
Planarization Process ◽  
Low K

For faster signal propagation in integrated circuits, new materials with lower dielectric constant (low-k) values are required with copper metal lines. Although integration of low-k materials (k<3.0) has been demonstrated, but ultra low-k materials possess many challenges due to their poor mechanical integrity and weak adhesion to other interconnects. During chemical mechanical planarization (CMP) generation of several defects including delamination of low-k materials is severe problem in the integration of these materials. Different slurries and pad introduces different levels of defect and also batch-to-batch variation in consumables is often makes process more difficult. In this study we have investigated the tribological properties of CMP pad and wafer interface while monitoring coefficient of friction and acoustic emission data. Signals are analyzed in order to online defect monitoring, batch-to-batch consumable variations and different consumables effects.

Evaluation of Mechanical and Tribological Behavior, and Surface Characteristics of CMP Pads

2001 ◽  
Vol 671 ◽  
Author(s):  
A. K. Sikder ◽  
I. M. Irfan ◽  
Ashok Kumar ◽  
A. Belyaev ◽  
S. Ostapenko ◽  
...  
Keyword(s):  
Elastic Properties ◽  
State Of The Art ◽  
Tribological Behavior ◽  
Chemical Mechanical Planarization ◽  
Critical Role ◽  
Surface Characteristics ◽  
Mechanical Analysis ◽  
Successful Implementation ◽  
Polishing Pads ◽  
Non Destructive

ABSTRACTChemical Mechanical Planarization (CMP) occurs at an atomic level at the slurry/wafer interface and hence slurries and polishing pads play a critical role in the successful implementation of this process. Surface roughness, visco-elastic properties, thickness and pore size also play an important role in this process. Unfortunately the mechanical properties of polyurethane polishing pads used in CMP are poorly understood. Here we have studied the mechanical and visco-elastic properties and surface morphology of CMP pads using nano-indentation and dynamic mechanical analysis along with high resolution scanning electron microscopy. A state-of-the-art Universal Micro-Tribometer was used to measure the pad deformation behavior under load. A novel non-destructive scanning ultrasonic transmission technique was also used to characterize inhomogeneity of the visco-elastic properties of full-size CMP pads. Results obtained by different techniques were analyzed to demonstrate methods for quick and reliable evaluation of pad quality for current CMP technology.

Optimization of tribological properties of silicon dioxide during the chemical mechanical planarization process

2001 ◽  
Vol 30 (12) ◽  
pp. 1520-1526 ◽  
Author(s):  
A. K. Sikder ◽  
Frank Giglio ◽  
John Wood ◽  
Ashok Kumar ◽  
Mark Anthony
Keyword(s):  
Silicon Dioxide ◽  
Tribological Properties ◽  
Chemical Mechanical Planarization ◽  
Planarization Process

scholarly journals Impact of Operating Time on Selected Tribological Properties of the Friction Material in the Brake Pads of Passenger Cars

Materials ◽  
2021 ◽  
Vol 14 (4) ◽  
pp. 884
Author(s):  
Andrzej Borawski
Keyword(s):  
Tribological Properties ◽  
Operating Time ◽  
Friction Material ◽  
Operating Conditions ◽  
Direct Impact ◽  
Passenger Cars ◽  
Wear Factor ◽  
Brake Pads ◽  
Road Users ◽  
The Coefficient Of Friction

Braking systems have a direct impact on the safety of road users. That is why it is crucial that the performance of brakes be dependable and faultless. Unfortunately, the operating conditions of brakes during their operating time are affected by many variables, which results in changes in their tribological properties. This article presents an attempt to develop a methodology for studying how the operating time affects the value of the coefficient of friction and the abrasive wear factor. The Taguchi method of process optimization was used to plan the experiment, which was based on tests using the ball-cratering method. The results clearly show that the degree of wear affects the properties of the friction material used in the production process of brakes.

scholarly journals Analysis and Comparative Assessment of Basic Tribological Properties of Selected Polymer Composites

Materials ◽  
2019 ◽  
Vol 13 (1) ◽  
pp. 75 ◽  
Author(s):  
Jerzy Jozwik ◽  
Krzysztof Dziedzic ◽  
Marcin Barszcz ◽  
Mykhaylo Pashechko
Keyword(s):  
Polymer Composites ◽  
Friction Force ◽  
Tribological Properties ◽  
Friction Pair ◽  
Computer Software ◽  
Operating Conditions ◽  
The Coefficient Of Friction ◽  
Cast Polyamide ◽  
Friction Path ◽  
Materials Used

Phenomena occurring in the contact area between two mating bodies are characterised by high complexity and variability. Comparisons are usually made between parameters such as the coefficient of friction, friction force, wear and temperature in relation to time and friction path. Their correct measurement enables the proper evaluation of tribological properties of materials used in the friction pair. This paper concerns the measurements of basic tribological parameters in the friction of selected polymer composites. Knowing the tribological properties of these composite materials, it will be possible to create proper operating conditions for kinematic friction pairs. This study investigated the coefficients of friction, friction force and temperatures of six polymer composites: cast polyamide PA6 G with oil, PA6 G with MoS2, polyoxymethylene POM with aluminium, polyethylene terephthalate PET with polytetrafluoroethylene PTFE, PTFE with bronze, and PTFE with graphite. The friction surface was also examined using an optical system and computer software for 3D measurements. As a result, PA6-G with oil was found to be the best choice as a composite material for thin sliding coatings.

Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process

2016 ◽  
Vol 384 ◽  
pp. 505-510 ◽  
Author(s):  
Byoung-Jun Cho ◽  
Shohei Shima ◽  
Satomi Hamada ◽  
Jin-Goo Park
Keyword(s):  
Complex Formation ◽  
Chemical Mechanical Planarization ◽  
Planarization Process
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