scholarly journals Modeling of thermal stresses during hardening the product surface by thermal pulse

2021 ◽  
Vol 64 (11) ◽  
pp. 815-824
Author(s):  
M. V. Temlyantsev ◽  
O. L. Bazaikina ◽  
E. N. Temlyantseva ◽  
V. Ya. Tsellermaer
Keyword(s):  
Thermal Stress ◽  
Stress Tensor ◽  
Thermal Stresses ◽  
Heaviside Function ◽  
Radial Coordinate ◽  
Single Wave ◽  
Temperature Pulse ◽  
Functional Series ◽  
Numerical Example ◽  
Special Cases

A particular solution of a linear variant of the dynamic thermal elasticity problem is considered in application to modeling the conditions of surface hardening of metal products by an energy pulse. The authors determined the equation of medium motion with the model of temperature pulse tested earlier for compatibility with special cases of the equations of parabolic and hyperbolic thermal conductivity. The problem of loading a flat plane of a short circular cylinder (disk) with a temperature pulse is presented. Pulse is a consequence of adopted structure of the volumetric power density of the heat flux, the time multiplier of which has the form of a single wave of the Heaviside function. Classical thermoelastic displacement potential and the method of its division into the product of independent variables functions were used to construct the thermal stress tensor. Differential equations for multiplier functions and their general solutions were found. Natural boundary conditions were set for the components of thermal stress tensor, and their tasks were solved. The obtained solutions are in the form of segments of functional series (the Bessel function in radial coordinate and the exponential function in axial coordinate). The article considers a numerical example of loading a disk made of 40KhN steel which has the mechanical properties sensitive to temperature treatment. Maple computer mathematics package was used in the calculations. Approximate solutions take into account the first 24 terms of the functional series. Estimation of the example makes it possible to explain the presence of stress peaks and stress intensity as a consequence of mutually inverse processes of temperature stress growth and reduction of elasticity coefficients with temperature rise. The numerical example warns against relying only on estimates of solutions to thermoelasticity problems without taking into account the plastic and viscous properties of the material.

scholarly journals Transient Thermal Stresses in a Reinforced Hollow Disk or Cylinder Containing a Radial Crack

1985 ◽  
Vol 107 (1) ◽  
pp. 212-219 ◽  
Author(s):  
Renji Tang ◽  
F. Erdogan
Keyword(s):  
Thermal Stress ◽  
Thermal Stresses ◽  
Radial Crack ◽  
Sudden Change ◽  
Base Material ◽  
Transient Temperature ◽  
Membrane Interface ◽  
Intensity Factors ◽  
Special Cases ◽  
Transient Thermal

In this paper, the transient thermal stress problem in a hollow cylinder or a disk containing a radial crack is considered. It is assumed that the cylinder is reinforced on its inner boundary by a membrane which has thermoelastic constants different than those of the base material. The transient temperature, thermal stresses, and the crack tip stress intensity factors are calculated in a cylinder which is subjected to a sudden change of temperature on the inside surface. The results are obtained for various dimensionless parameters and material constants. The special cases of the crack terminating at the cylinder-membrane interface and of the broken membrane are separately considered and some examples are given.

scholarly journals Machine Learning Based Methods for Obtaining Correlations between Microstructures and Thermal Stresses

Metals ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 1167
Author(s):  
Akshay Bhutada ◽  
Sunni Kumar ◽  
Dayalan Gunasegaram ◽  
Alankar Alankar
Keyword(s):  
Machine Learning ◽  
Thermal Stress ◽  
Stress Tensor ◽  
Thermal Stresses ◽  
Large Temperature ◽  
Fe Model ◽  
Tensor Fields ◽  
Thermally Induced ◽  
Synthetic Microstructures ◽  
Classification And Clustering

The microstructure–property relationship is critical for parts made using the emerging additive manufacturing process where highly localized cooling rates bestow spatially varying microstructures in the material. Typically, large temperature gradients during the build stage are known to result in significant thermally induced residual stresses in parts made using the process. Such stresses are influenced by the underlying local microstructures. Given the extensive range of variations in microstructures, it is useful to have an efficient method that can detect and quantify cause and effect. In this work, an efficient workflow within the machine learning (ML) framework for establishing microstructure–thermal stress correlations is presented. While synthetic microstructures and simulated properties were used for demonstration, the methodology may equally be applied to actual microstructures and associated measured properties. The dataset for ML consisted of images of synthetic microstructures along with thermal stress tensor fields simulated using a finite element (FE) model. The FE model considered various grain morphologies, crystallographic orientations, anisotropic elasticity and anisotropic thermal expansion. The overall workflow was divided into two parts. In the first part, image classification and clustering were performed for a sanity test of data. Accuracies of 97.33% and 99.83% were achieved using the ML based method of classification and clustering, respectively. In the second part of the work, convolution neural network model (CNN) was used to correlate the microstructures against various components and measures of stress. The target vectors of stresses consisted of individual components of stress tensor, principal stresses and hydrostatic stress. The model was able to show a consistent correlation between various morphologies and components of thermal stress. The overall predictions by the model for all the microstructures resulted into R2≈0.96 for all the stresses. Such a correlation may be used for finding a range of microstructures associated with lower amounts of thermally induced stresses. This would allow the choice of suitable process parameters that can ensure that the desired microstructures are obtained, provided the relationship between those parameters and microstructures are also known.

Three Turnaround Heat Treating Studies

2003 ◽  
Author(s):  
Jaan Taagepera ◽  
Marty Clift ◽  
D. Mike DeHart ◽  
Keneth Marden
Keyword(s):  
Heat Treatment ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Stress ◽  
Thermal Stresses ◽  
Heat Treating ◽  
Element Analysis ◽  
Stress Profiles ◽  
Insight Into

Three vessel modifications requiring heat treatment were analyzed prior to and during a planned turnaround at a refinery. One was a thick nozzle that required weld build up. This nozzle had been in hydrogen service and required bake-out to reduce the potential for cracking during the weld build up. Finite element analysis was used to study the thermal stresses involved in the bake-out. Another heat treatment studied was a PWHT of a nozzle replacement. The heat treatment band and temperature were varied with location in order to minimize cost and reduction in remaining strength of the vessel. Again, FEA was used to provide insight into the thermal stress profiles during heat treatment. The fmal heat treatment study was for inserting a new nozzle in a 1-1/4Cr-1/2Mo reactor. While this material would ordinarily require PWHT, the alteration was proposed to be installed without PWHT. Though accepted by the Jurisdiction, this nozzle installation was ultimately cancelled.

Steady-State Thermal Stresses in Wedge-Shaped Cutting Tools

1975 ◽  
Vol 97 (3) ◽  
pp. 1060-1066
Author(s):  
P. F. Thomason
Keyword(s):  
Thermal Stress ◽  
Steady State ◽  
Metal Cutting ◽  
Thermal Stresses ◽  
Heat Conduction Problem ◽  
Equivalent Stress ◽  
Cutting Tools ◽  
Thermoelastic Stress ◽  
Plastic State ◽  
Steady State Heat

Closed form expressions for the steady-state thermal stresses in a π/2 wedge, subject to constant-temperature heat sources on the rake and flank contact segments, are obtained from a conformal mapping solution to the steady-state heat conduction problem. It is shown, following a theorem of Muskhelishvili, that the only nonzero thermal stress in the plane-strain wedge is that acting normal to the wedge plane. The thermal stress solutions are superimposed on a previously published isothermal cutting-load solution, to give the complete thermoelastic stress distribution at the wedge surfaces. The thermoelastic stresses are then used to determine the distribution of the equivalent stress, and this gives an indication of the regions on a cutting tool which are likely to be in the plastic state. The results are discussed in relation to the problems of flank wear and rakeface crater wear in metal cutting tools.

scholarly journals L’innovation et le modèle du commerce néo-technologique dans l’espace des caractéristiques de Lancaster

2009 ◽  
Vol 55 (3) ◽  
pp. 342-359
Author(s):  
Petr Hanel
Keyword(s):  
Necessary Conditions ◽  
New Product ◽  
Efficient Production ◽  
Numerical Example ◽  
Special Cases ◽  
Welfare Implications ◽  
Efficient Consumption

Lancaster's case of innovation in consumption technology is formalized and extended to include beside of the criterion of efficient consumption also the criterion of efficient production. The two criteria has to be met before an invention can be commercialized economically. Trade provoked by an innovation in consumption technology—a new product—is analyzed on a simple numerical example. Necessary conditions and some welfare implications of the neo-technology trade are presented. The approach is sufficiently general to encompass trade based on cost reducing innovation as well as existing trade models as special cases.

Analysis of Five-Degree-of-Freedom Robot Arms

1983 ◽  
Vol 105 (1) ◽  
pp. 23-27 ◽  
Author(s):  
K. Sugimoto ◽  
J. Duffy
Keyword(s):  
Arc Welding ◽  
Degrees Of Freedom ◽  
Screw Theory ◽  
Industrial Robot ◽  
Degree Of Freedom ◽  
Numerical Example ◽  
Robot Arms ◽  
Special Cases ◽  
Computer Controlled ◽  
Five Axes

Many kinds of robot arms with five degrees of freedom are widely used in industry for arc welding, spray painting, assembling etc. It is necessary to be able to compute joint displacements when such devices are computer controlled. A solution to this problem is presented and the analysis is illustrated by a numerical example using the most common industrial robot with five axes. Further, special cases are discussed using screw theory.

Modelling of Convective Melt Flow and Interface Shape in Commercial Bridgman-Stockbarger Growth of CdZnTe

2000 ◽  
Author(s):  
Toby D. Rule ◽  
Ben Q. Li ◽  
Kelvin G. Lynn
Keyword(s):  
Heat Transfer ◽  
Thermal Stress ◽  
Solute Transport ◽  
Latent Heat ◽  
Thermal Stresses ◽  
Radiation Detector ◽  
Time History ◽  
High Quality ◽  
Melt Convection ◽  
The Impact

Abstract CdZnTe single crystals for radiation detector and IR substrate applications must be of high quality and controlled purity. The growth of such crystals from a melt is very difficult due to the low thermal conductivity and high latent heat of the material, and the ease with which dislocations, twins and precipitates are introduced during crystal growth. These defects may be related to solute transport phenomena and thermal stresses associated with the solidification process. As a result, production of high quality material requires excellent thermal control during the entire growth process. A comprehensive model is being developed to account for radiation and conduction within the furnace, thermal coupling between the furnace and growth crucible, and finally the thermal stress fields within the growing crystal which result from the thermal conditions imposed on the crucible. As part of this effort, the present work examines the heat transfer and fluid flow within the crucible, using thermal boundary conditions obtained from experimental measurements. The 2-D axisymetric numerical model uses the deforming finite element method, with allowance made for melt convection, solidification with latent heat release and conjugate heat transfer between the solid material and the melt. Results are presented for several stages of growth, including a time-history of the solid-liquid interface (1365 K isotherm). The impact of melt convection, thermal end conditions and furnace temperature gradient on the growth interface is evaluated. Future work will extend the present model to include radiation exchange within the furnace, and a transient analysis for studying solute transport and thermal stress.

scholarly journals Measurement and Isolation of Thermal Stress in Silicon-On-Glass MEMS Structures

Sensors ◽  
2018 ◽  
Vol 18 (8) ◽  
pp. 2603 ◽  
Author(s):  
Zhiyong Chen ◽  
Meifeng Guo ◽  
Rong Zhang ◽  
Bin Zhou ◽  
Qi Wei
Keyword(s):  
Thermal Stress ◽  
Natural Frequency ◽  
Frequency Conversion ◽  
Thermal Stresses ◽  
Sensors And Actuators ◽  
Stress Variation ◽  
Rigid Frame ◽  
Measured Stress ◽  
Stress Isolation ◽  
Frequency Variations

The mechanical stress in silicon-on-glass MEMS structures and a stress isolation scheme were studied by analysis and experimentation. Double-ended tuning forks (DETFs) were used to measure the stress based on the stress-frequency conversion effect. Considering the coefficients of thermal expansion (CTEs) of silicon and glass and the temperature coefficient of the Young’s modulus of silicon, the sensitivity of the natural frequency to temperature change was analyzed. A stress isolation mechanism composed of annular isolators and a rigid frame is proposed to prevent the structure inside the frame from being subjected to thermal stresses. DETFs without and with one- or two-stage isolation frames with the orientations <110> and <100> were designed, the stress and natural frequency variations with temperature were simulated and measured. The experimental results show that in the temperature range of −50 °C to 85 °C, the stress varied from −18 MPa to 10 MPa in the orientation <110> and −11 MPa to 5 MPa in the orientation <100>. For the 1-stage isolated DETF of <110> orientation, the measured stress variation was only 0.082 MPa. The thermal stress can be mostly rejected by a stress isolation structure, which is applicable in the design of stress-sensitive MEMS sensors and actuators.

Numerical Study of Thermal Stresses in a Planar Solid Oxide Fuel Cell Stack

2017 ◽  
Author(s):  
Cun Wang ◽  
Tao Zhang ◽  
Cheng Zhao ◽  
Jian Pu
Keyword(s):  
Thermal Stress ◽  
Fuel Cell ◽  
Solid Oxide Fuel Cell ◽  
Thermal Stresses ◽  
Coefficient Of Thermal Expansion ◽  
Numerical Study ◽  
Solid Oxide ◽  
Oxide Fuel ◽  
Compressive Loads ◽  
Cte Mismatch

A three dimensional numerical model of a practical planar solid oxide fuel cell (SOFC) stack based on the finite element method is constructed to analyze the thermal stress generated at different uniform temperatures. Effects of cell positions, different compressive loads, and coefficient of thermal expansion (CTE) mismatch of different SOFC components on the thermal stress distribution are investigated in this work. Numerical results indicate that the maximum thermal stress appears at the corner of the interface between ceramic sealants and cells. Meanwhile the maximum thermal stress at high temperature is significantly larger than that at room temperature (RT) and presents linear growth with the increase of operating temperature. Since the SOFC stack is under the combined action of mechanical and thermal loads, the distribution of thermal stress in the components such as interconnects and ceramic sealants are greatly controlled by the CTE mismatch and scarcely influenced by the compressive loads.

Thermal Stresses Due to Disturbance of Uniform Heat Flow by an Insulated Ovaloid Hole

1960 ◽  
Vol 27 (4) ◽  
pp. 635-639 ◽  
Author(s):  
A. L. Florence ◽  
J. N. Goodier
Keyword(s):  
Heat Flow ◽  
Closed Form ◽  
Thermal Stresses ◽  
Thermoelastic Problem ◽  
Uniform Heat ◽  
Special Cases

The linear thermoelastic problem is solved for a uniform heat flow disturbed by a hole of ovaloid form, which includes the ellipse and circle as special cases. Results for stress and displacement are found in closed form, by reducing the problem to one of boundary loading solvable by a method of Muskhelishvili.

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