scholarly journals Acoustic microscopy in orthodontology

2017 ◽  
Vol 98 (3) ◽  
pp. 452-456
Author(s):  
Z V Gasymova
Keyword(s):  
Tooth Enamel ◽  
Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Medical Interventions ◽  
Time Points ◽  
Acoustic Images ◽  
Novel Method ◽  
Scanning Acoustic Microscope ◽  
Tooth Tissue

Aim. Assessment of the possibility to use the method of ultrasound acoustic microscopy to control the state of microstructure of hard tooth tissues under the brackets. Methods. The study was conducted with the use of scanning acoustic microscope ELSAM (Leitz, Germany) in Emanuel Institute of biochemical physics, Moscow. The studied material for acoustic microscopy corresponds to 34 teeth (premolars) with brackets fixed to them, which were removed due to orthodontic indications at different time points after brackets placement. Results. In most cases on acoustic images of the removed teeth there were no revealed changes of physical and mechanical enamel properties, fissures or excess porosity both directly under the brackets and in the areas adjacent to the sealer margin. But in some cases along with good enamel state after long-term brackets placement minor changes in the structure of hard tooth tissues were revealed. In particular, the method of acoustic microscopy allowed to detect in the tooth enamel such minor defects as fissures and areas of reduced mineralization and increased porosity. Conclusion. Acoustic microscopy as a novel method to obtain clear structural images of hard tooth tissue state allows detecting minimal changes of the structure of hard tissues and performing medical interventions based on them.

Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy

1996 ◽  
Author(s):  
O. Diaz de Leon ◽  
M. Nassirian ◽  
C. Todd ◽  
R. Chowdhury
Keyword(s):  
Failure Analysis ◽  
Large Scale ◽  
Flip Chip ◽  
Ultrasonic Waves ◽  
Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Chip Technology ◽  
Ball Joints ◽  
Non Destructive ◽  
Scanning Acoustic Microscope

Abstract Integration of circuits on semiconductor devices with resulting increase in pin counts is driving the need for improvements in packaging for functionality and reliability. One solution to this demand is the Flip- Chip concept in Ultra Large Scale Integration (ULSI) applications [1]. The flip-chip technology is based on the direct attach principle of die to substrate interconnection.. The absence of bondwires clearly enables packages to become more slim and compact, and also provides higher pin counts and higher-speeds [2]. However, due to its construction, with inherent hidden structures the Flip-Chip technology presents a challenge for non-destructive Failure Analysis (F/A). The scanning acoustic microscope (SAM) has recently emerged as a valuable evaluation tool for this purpose [3]. C-mode scanning acoustic microscope (C-SAM), has the ability to demonstrate non-destructive package analysis while imaging the internal features of this package. Ultrasonic waves are very sensitive, particularly when they encounter density variations at surfaces, e.g. variations such as voids or delaminations similar to air gaps. These two anomalies are common to flip-chips. The primary issue with this package technology is the non-uniformity of the die attach through solder ball joints and epoxy underfill. The ball joints also present defects as open contacts, voids or cracks. In our acoustic microscopy study packages with known defects are considered. It includes C-SCAN analysis giving top views at a particular package interface and a B-SCAN analysis that provides cross-sectional views at a desired point of interest. The cross-section analysis capability gives confidence to the failure analyst in obtaining information from a failing area without physically sectioning the sample and destroying its electrical integrity. Our results presented here prove that appropriate selection of acoustic scanning modes and frequency parameters leads to good reliable correlation between the physical defects in the devices and the information given by the acoustic microscope.

Stacked Die Analysis Using C-mode Scanning Acoustic Microscope

2005 ◽  
Author(s):  
Li Na ◽  
Jawed Khan ◽  
Lonnie Adams
Keyword(s):  
Data Acquisition ◽  
Image Interpretation ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Analysis Mode ◽  
Scanning Acoustic Microscope

Abstract For stacked die package delamination inspection using C-mode acoustic microscope, traditional interface and thorough scan techniques cannot give enough of information when the delamination occurs in multi-interfaces, and echoes from adjacent interfaces are not sufficiently separated from each other. A thinner thickness in the stacked-die package could complicate C-mode scanning acoustic microscopy (CSAM) analysis and sometimes may lead to false interpretations. The first objective of this paper is to briefly explain the CSAM mechanism. Based on that, some of the drawbacks of current settings in detecting the delamination for stacked-die packages are presented. The last objective is to introduce quantitative B-scan analysis mode (Q-BAM) and Zip-Slice technologies in order to better understand and improve the reliability of detecting the delamination in stacked-die packages. Therefore, a large portion of this paper focuses on the Q-BAM and Zip-Slice data acquisition and image interpretation.

Scanning acoustic microscopy investigation of melted collagen in thermoplastic leather

1999 ◽  
Vol 14 (6) ◽  
pp. 2446-2448
Author(s):  
A. Wyler ◽  
G. Golan
Keyword(s):  
High Pressure ◽  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Microscopy Investigation ◽  
The Matrix ◽  
Scanning Acoustic Microscope ◽  
Scanning Electron

A scanning acoustic microscope (SAM) has been used to investigate the structure of thermoplastic leather. This material is formed by pressing fibers of leather under high pressure and moderate temperature. The result is a matrix from transformed, melted fibers in which leftover fibers act as reinforcement. Unlike the scanning electron microscope (SEM), the SAM is able to distinguish between completely and incompletely transformed fibers and also to penetrate the material beneath the surface. The results show that the matrix is built as a domain structure. The advantages of the SAM over the SEM for organic materials are indicated.

scholarly journals The Reference Phase Correction for the Fluctuated Scanning Lines and the Slope of the Stage in Tissue Characterization by Scanning Acoustic Microscope

2019 ◽  
Vol 9 (22) ◽  
pp. 4883
Author(s):  
Nguyen Thanh Phong Truong ◽  
Hyehyun Kim ◽  
Donghae Lee ◽  
Yeon-Hee Kang ◽  
Sungsoo Na ◽  
...  
Keyword(s):  
Tissue Characterization ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Acoustic Microscope ◽  
New Approach ◽  
Fluctuation Pattern ◽  
Hematoxylin And Eosin ◽  
Scanning Acoustic Microscope ◽  
Reference Phase

In this study, a new approach was investigated to extract reference phases from the scanning acoustic microscope to calculate the speed of sound when dealing with the slope of the stage and fluctuation of the scanning lines. To capture the slope and the fluctuation pattern, data of the first lines along the horizontal and vertical axes on the stage were used. A corrective function was then utilized to improve the accuracy of reference phase extraction. The method was then corroborated by demonstrating tumor discrimination in mice skin by means of scanning acoustic microscopy (SAM). B16-F10 melanoma cells were used to grow the tumor. Hematoxylin and eosin (H&E) staining was applied for histology characterization of the sample. A comparison of both acoustics and histology was conducted. Phase analysis was performed to examine the effects of both slope and fluctuation. The results showed that our approach significantly improved the tumor detection and accuracy of scanning acoustic microscopy.

Mechanical basis of cell shape: investigations with the scanning acoustic microscope

1995 ◽  
Vol 73 (7-8) ◽  
pp. 337-348 ◽  
Author(s):  
Jürgen Bereiter-Hahn ◽  
Llonka Karl ◽  
Holger Lüers ◽  
Monika Vöth
Keyword(s):  
Low Temperature ◽  
Cell Shape ◽  
Giant Cells ◽  
Bulk Flow ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Mechanical Basis ◽  
Scanning Acoustic Microscope

The shape of cells during interphase in sparse cultures often resembles that of fried eggs. XTH-2 cells, which have been derived from tadpole heart endothelia, provide a typical example of this type of shape. To understand the physical basis of this shape, the cytoskeleton of these cells has been investigated in detail. Subcellular elasticity data have been achieved by scanning acoustic microscopy (SAM). Their changes were observed during treatment of the cells with microtubule-disrupting agents (colcemid and low temperature), and shape generation in giant cells produced by electro-fusion was observed with SAM, revealing the role of the nucleus as a force centering organelle. From these observations combined with well-documented observations on cellular dynamics described in the literature, a model is developed explaining the fried-egg shape of cells by means of interacting forces and fluxes (cortical flow, bulk flow of cytoplasm, microtubule-mediated transport of cytoplasm) of cytoplasm. The model also allows the comprehension of the increase of tension in cells treated with colcemid.Key words: cell shape, elasticity, grant cells, microtubules, acoustic microscopy.

scholarly journals Acoustic microscopy of red blood cells.

1988 ◽  
Vol 36 (10) ◽  
pp. 1341-1351 ◽  
Author(s):  
E A Schenk ◽  
R W Waag ◽  
A B Schenk ◽  
J P Aubuchon
Keyword(s):  
Red Blood Cells ◽  
Blood Cells ◽  
Signal Amplitude ◽  
Image Features ◽  
Acoustic Microscopy ◽  
Cell Deformation ◽  
Red Cell ◽  
Hemoglobin Content ◽  
Acoustic Microscope ◽  
Scanning Acoustic Microscope

We used a scanning acoustic microscope to image normal and outdated red blood cells, cells with different hemoglobin content, red cell ghosts, and cells treated with various drugs that induce echinocyte-stomatocyte transformation. Images were obtained at different planes of focus within the cells, corresponding to maxima and minima of signal intensity. Digitization and gray scale amplitude mapping were used to create axonometric plots that display signal amplitude variations within the cells. The images of red cells contain features produced by differences in topology, density, elasticity, and absorption. Both hemoglobin content and the cell cytoskeleton contribute to image features, and various deformations, characterized by the formation of blebs and vacuoles, are displayed in cells undergoing echinocyte-stomatocyte transformation. These preliminary findings, although mainly descriptive, indicate that acoustic microscopy may be a useful new method for evaluating red cell deformation and associated changes in mechanical properties.

Detection and Image Processing of Interfacial Micro-Delamination in the Thin-Layered Structure by Using Nonlinear Ultrasonic Effect

2006 ◽  
Vol 321-323 ◽  
pp. 1513-1516
Author(s):  
Job Ha ◽  
Kyung Young Jhang
Keyword(s):  
Layered Structure ◽  
High Performance ◽  
Electronic Device ◽  
Field Application ◽  
Nonlinear Parameter ◽  
Acoustic Microscope ◽  
Electronic Package ◽  
Nonlinear Ultrasonic ◽  
Novel Method ◽  
Scanning Acoustic Microscope

The detection of interfacial micro-delamination in the thin-layered structure such as the electronic package becomes very important as the electronic device becomes smaller and thinner. The conventional method used to detect the delamination in an electronic package is to use a scanning acoustic microscope (SAM). However, despite its high performance qualities, SAM is often faced with a tricky decision when a delaminated gap is too small. In this paper, a novel method based on ultrasonic nonlinearity is proposed to overcome this limit. The proposed method is integrated into the conventional SAM equipment, and its effectiveness is verified by experiments for the Newton Ring and the real semiconductor package that have micro-delaminations. The results showed that the nonlinear parameter had good correlation with the gap size of delamination. A method of imaging the nonlinear parameter is also proposed to assure the feasibility of the proposed method in the field application.

Application of Scanning Acoustic Microscopy to Electric and Electronic Parts

2000 ◽  
Author(s):  
C. Miyasaka ◽  
B. R. Tittmann
Keyword(s):  
Surface Roughness ◽  
Background Noise ◽  
Spherical Aberration ◽  
Current Trend ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Acoustic Lens ◽  
Electronic Parts ◽  
Scanning Acoustic Microscope

Abstract Ever since the invention of the scanning acoustic microscope (SAM), a key objective has been the enhancement of the resolution in an interior image. Thus, an acoustic lens that can form an interior image with a shear wave has been designed. The use of this lens gives benefits such as an increase of lateral resolution in the interior image, a reduction in background noise caused by surface roughness, and a reduction of spherical aberration. Significantly, with the current trend towards microminiaturization of microelectronic packages, acoustic microscopy with higher resolution and removal of surface roughness can play an important role in diagnostic examinations and failure analysis. In this paper, applications for the lens in microelectronic IC packages will be summarized.

Properties of Films Characterized by Scanning Acoustic Microscope

2014 ◽  
Vol 1061-1062 ◽  
pp. 961-965
Author(s):  
Hong Juan Yan ◽  
Chun Guang Xu ◽  
Ding Guo Xiao ◽  
Qi Lin
Keyword(s):  
Elastic Modulus ◽  
Sound Velocity ◽  
Ultrasonic Wave ◽  
Acoustic Impedance ◽  
Extreme Values ◽  
Amplitude Spectrum ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Scanning Acoustic Microscope

The scanning acoustic microscope is used to detect the properties of films. The ultrasonic wave propagates in the films with thickness h, acoustic impedance Z2 between medium with acoustic impedance Z1. The echoes from upper and lower interfaces overlap and interfere. The echoes are transformed by FFT. The interference phenomena are observed in amplitude spectrum of echoes. The spectrum has periodic extreme values at fn, fn=nc/2h. When thickness h is known, sound velocity c2 of film can be calculated. According to the principle, the properties of films such as thickness, acoustic impendence and elastic modulus are evaluated by scanning acoustic microscopy. The experimental results are good accorded with the actual properties of specimens.

Nondestructive Measurement of C4 BLM Undercut by Scanning Acoustic Microscope

2007 ◽  
Author(s):  
Minhua Lu ◽  
Carla Bailey ◽  
Hsichang Liu ◽  
Krystyna Semkow
Keyword(s):  
Cross Section ◽  
Acoustic Microscopy ◽  
Cross Section Data ◽  
Nondestructive Measurement ◽  
Acoustic Microscope ◽  
Section Data ◽  
Monitoring Process ◽  
Destructive Measurement ◽  
Non Destructive ◽  
Scanning Acoustic Microscope

A non-destructive measurement of ball limiting metallurgy (BLM) undercut is demonstrated by using C-mode scanning acoustic microscopy. The results from CSAM measurements agree well with the optical and cross-section data. The implementation of the method in manufacturing will not only save time and cost on destructive failure analysis such as cross section and chemical un-layering, but also provide a way for monitoring process trend for early detection and correction of process abnormalities.

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