scholarly journals Investigation of the effect of thermal stress on the interface damage of hybrid biocomposite materials

2019 ◽  
Vol 23 (1) ◽  
pp. 253-258
Author(s):  
Salima Sadat ◽  
Allel Mokaddem ◽  
Bendouma Doumi ◽  
Mohamed Berber ◽  
Ahmed Boutaous
Keyword(s):  
Thermal Stress ◽  
Thermal Stresses ◽  
Natural Fibers ◽  
Experimental Tests ◽  
Genetic Modeling ◽  
Axial Tensile ◽  
Acoustic Technique ◽  
Nonlinear Acoustic ◽  
Applied Stresses ◽  
Hybrid Biocomposite

Abstract In this paper, we have studied the effect of thermal stress on the damage of fiber-matrix interface of a hybrid biocomposite composed of two natural fibers, Hemp, Sisal, and Starch matrix. Our genetic modeling used the nonlinear acoustic technique based on Cox’s analytical model, Weibull’s probabilistic model, and Lebrun’s model describing the thermal stress by the two coefficients of expansion. The stress applied to our representative elementary volume is a uni-axial tensile stress. The numerical simulation shows that the Hemp- Sisal/Starch hybrid biocomposite is most resistant to thermal stresses as compared with Hemp/Starch biocomposite. It also shows that hybrid biocomposite materials have a high resistance to applied stresses (mechanical and thermal) compared to traditional materials and biocomposite materials. The results obtained in our study coincide perfectly with the results of Antoine et al., which showed through experimental tests that natural fibers perfectly improve the mechanical properties of biocomposite materials.

Theoretical study of the effect of thermal stress on transversal damage of hybrid biocomposite materials Flax-Hemp / Polyethylene

2021 ◽  
Vol 14 ◽  
Author(s):  
Allel Mokaddem ◽  
Bendouma Doumi ◽  
Mohammed Belkheir ◽  
Ahmed Boutaous ◽  
Elhouari Temimi
Keyword(s):  
Thermal Stress ◽  
Probabilistic Models ◽  
Theoretical Calculations ◽  
Environmental Benefit ◽  
Polyethylene Matrix ◽  
Acoustic Technique ◽  
Nonlinear Acoustic ◽  
Genetic Simulation ◽  
Good Agreement ◽  
Hybrid Biocomposite

Background: The objective of sustainable development in the field of materials necessitates and demands the substitution of the basic constituents of a composite material (carbon, glass, etc.) by natural reinforcements, which have a very important role in the protection of the environment and to subsequently have new materials with good properties compared to so-called traditional materials. Objective: In this context, we have investigated, using genetic modeling based on probabilistic models, the effect of thermal stress on transversal damage of a bio-composite hybrid Flax-Hemp/PE material. Method: Our model genetic is based on probabilistic models of Weibull and the different values of the thermal stress was calculated by the Lebrun equation. We used the nonlinear parameter β in the Hoock law of the nonlinear acoustic technique to trace the curves of the damage under the mechanical and thermal stress to validate our theoretical calculations. Results: The results obtained with a genetic simulation are in good agreement with the results found by Clément GOURIER and Raphaël KUENY, who have shown that flax and hemp fibers (bark/Liberian fibers) are good reinforcements of the Polyethylene matrix, we found also found that our hybrid biocomposite material Flax-Hemp/PE is resistant in particular, a part of this material is of plant origin and gives us environmental benefit. Conclusion: It should be noted that the results obtained by the genetic simulation are in good agreement with the results obtained by the nonlinear acoustic technique mentioned by the green curve in all the figures. In perspective, it would be interesting to see, later, the effect of humidity on the damage of the matrix fiber interface of a hybrid biocomposite.

scholarly journals Effect of Fiber-matrix Interface Decohesion on the Behavior of Thermoset and Thermoplastic Composites Reinforced with Natural Fibers: A Comparative Study

2021 ◽  
Author(s):  
Imene ASSAF ◽  
Mohammed BELKHEIR ◽  
Allel MOKADDEM ◽  
Bendouma DOUMI ◽  
Ahmed BOUTAOUS
Keyword(s):  
Statistical Analysis ◽  
Comparative Study ◽  
Natural Fibers ◽  
Thermoplastic Composites ◽  
Matrix Interface ◽  
Wood Fibers ◽  
Acoustic Technique ◽  
Nonlinear Acoustic ◽  
Fiber Matrix Interface ◽  
Fiber Matrix

In this article, a comparative study was carried out on two types of thermosetting and thermoplastic matrices to study the effect of the fiber-matrix interface damage on the behavior of thermosetting and thermoplastic composites reinforced by the same natural alfa and wood fibers. The genetic modeling was based on the probabilistic formalism of Weibull. The results have been compared with those obtained by the nonlinear acoustic technique, the two results found to coincide perfectly. The numerical simulation also shows a good concordance with the real behavior of the materials studied, and shows that thermosetting composites are the most resistant to applied thermal stress by 21% compared to thermoplastic composites. Statistical analysis demonstrates that the correlation coefficient values found are very close to 1 (0.964 and 0.973), these values are very satisfactory, and confirm that the results obtained by the genetic model and the nonlinear acoustic technique are in very good agreement with the statistical analysis data. The experimental work presented by Antoine Le Duigou et al. and the work of Bodros et al. have shown that the use of natural fibers greatly improves the mechanical properties of composite materials.

Thermal Stress Analysis for Differential Pressure Sensors

2005 ◽  
Author(s):  
J. Albert Chiou ◽  
Steven Chen
Keyword(s):  
Thermal Stress ◽  
Thermal Stresses ◽  
Thermal Hysteresis ◽  
Pressure Sensors ◽  
Experimental Tests ◽  
Temperature Cycling ◽  
Finite Element Analyses ◽  
Sensing Element ◽  
Pressure Sensing ◽  
Temperature Environment

Pressure sensors should be capable of measuring pressure accurately and consistently without being disturbed by the temperature environment. With silicon’s better thermal material properties, silicon micormachined pressure sensors are mass-produced and widely used. However, a silicon pressure sensing element has to be packaged and protected. The thermal mismatching between the sensing element and packaging may generate stresses on the transducer of a sensing element and create thermal hysteresis and voltage shift during temperature cycling. The induced thermal stresses can easily deteriorate performance reliability. In this paper, finite element analyses and experimental tests were conducted to reduce the thermal stress and thermal hysteresis. With the glass substrate to isolate the stress from plastic housing, the thermal hysteresis can be significantly improved. The die placement and dispense pattern can be also optimized to further improve the thermal hysteresis.

Three Turnaround Heat Treating Studies

2003 ◽  
Author(s):  
Jaan Taagepera ◽  
Marty Clift ◽  
D. Mike DeHart ◽  
Keneth Marden
Keyword(s):  
Heat Treatment ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Stress ◽  
Thermal Stresses ◽  
Heat Treating ◽  
Element Analysis ◽  
Stress Profiles ◽  
Insight Into

Three vessel modifications requiring heat treatment were analyzed prior to and during a planned turnaround at a refinery. One was a thick nozzle that required weld build up. This nozzle had been in hydrogen service and required bake-out to reduce the potential for cracking during the weld build up. Finite element analysis was used to study the thermal stresses involved in the bake-out. Another heat treatment studied was a PWHT of a nozzle replacement. The heat treatment band and temperature were varied with location in order to minimize cost and reduction in remaining strength of the vessel. Again, FEA was used to provide insight into the thermal stress profiles during heat treatment. The fmal heat treatment study was for inserting a new nozzle in a 1-1/4Cr-1/2Mo reactor. While this material would ordinarily require PWHT, the alteration was proposed to be installed without PWHT. Though accepted by the Jurisdiction, this nozzle installation was ultimately cancelled.

Steady-State Thermal Stresses in Wedge-Shaped Cutting Tools

1975 ◽  
Vol 97 (3) ◽  
pp. 1060-1066
Author(s):  
P. F. Thomason
Keyword(s):  
Thermal Stress ◽  
Steady State ◽  
Metal Cutting ◽  
Thermal Stresses ◽  
Heat Conduction Problem ◽  
Equivalent Stress ◽  
Cutting Tools ◽  
Thermoelastic Stress ◽  
Plastic State ◽  
Steady State Heat

Closed form expressions for the steady-state thermal stresses in a π/2 wedge, subject to constant-temperature heat sources on the rake and flank contact segments, are obtained from a conformal mapping solution to the steady-state heat conduction problem. It is shown, following a theorem of Muskhelishvili, that the only nonzero thermal stress in the plane-strain wedge is that acting normal to the wedge plane. The thermal stress solutions are superimposed on a previously published isothermal cutting-load solution, to give the complete thermoelastic stress distribution at the wedge surfaces. The thermoelastic stresses are then used to determine the distribution of the equivalent stress, and this gives an indication of the regions on a cutting tool which are likely to be in the plastic state. The results are discussed in relation to the problems of flank wear and rakeface crater wear in metal cutting tools.

Modelling of Convective Melt Flow and Interface Shape in Commercial Bridgman-Stockbarger Growth of CdZnTe

2000 ◽  
Author(s):  
Toby D. Rule ◽  
Ben Q. Li ◽  
Kelvin G. Lynn
Keyword(s):  
Heat Transfer ◽  
Thermal Stress ◽  
Solute Transport ◽  
Latent Heat ◽  
Thermal Stresses ◽  
Radiation Detector ◽  
Time History ◽  
High Quality ◽  
Melt Convection ◽  
The Impact

Abstract CdZnTe single crystals for radiation detector and IR substrate applications must be of high quality and controlled purity. The growth of such crystals from a melt is very difficult due to the low thermal conductivity and high latent heat of the material, and the ease with which dislocations, twins and precipitates are introduced during crystal growth. These defects may be related to solute transport phenomena and thermal stresses associated with the solidification process. As a result, production of high quality material requires excellent thermal control during the entire growth process. A comprehensive model is being developed to account for radiation and conduction within the furnace, thermal coupling between the furnace and growth crucible, and finally the thermal stress fields within the growing crystal which result from the thermal conditions imposed on the crucible. As part of this effort, the present work examines the heat transfer and fluid flow within the crucible, using thermal boundary conditions obtained from experimental measurements. The 2-D axisymetric numerical model uses the deforming finite element method, with allowance made for melt convection, solidification with latent heat release and conjugate heat transfer between the solid material and the melt. Results are presented for several stages of growth, including a time-history of the solid-liquid interface (1365 K isotherm). The impact of melt convection, thermal end conditions and furnace temperature gradient on the growth interface is evaluated. Future work will extend the present model to include radiation exchange within the furnace, and a transient analysis for studying solute transport and thermal stress.

Numerical Investigation of Ductile Fracture in Pipelines Under Complex Loading Using a Phenomenological Damage Model

2021 ◽  
Author(s):  
Iago S. Santos ◽  
Diego F. B. Sarzosa
Keyword(s):  
Ductile Fracture ◽  
Mechanical Response ◽  
Numerical Study ◽  
Damage Model ◽  
Stress Triaxiality ◽  
Numerical Procedure ◽  
Complex Loading ◽  
Experimental Tests ◽  
Compact Tension ◽  
Axial Tensile

Abstract This paper presents a numerical study on pipes ductile fracture mechanical response using a phenomenological computational damage model. The damage is controlled by an initiation criterion dependent on the stress triaxiality and the Lode angle parameter, and a post-initiation damage law to eliminate each finite element from the mesh. Experimental tests were carried out to calibrate the elastoplastic response, damage parameters and validate the FEM models. The tested geometries were round bars having smooth and notched cross-section, flat notched specimens under axial tensile loads, and fracture toughness tests in deeply cracked bending specimens SE(B) and compact tension samples C(T). The calibrated numerical procedure was applied to execute a parametric study in pipes with circumferential surface cracks subjected to tensile and internal pressure loads simultaneously. The effects of the variation of geometric parameters and the load applications on the pipes strain capacity were investigated. The influence of longitudinal misalignment between adjacent pipes was also investigated.

scholarly journals Measurement and Isolation of Thermal Stress in Silicon-On-Glass MEMS Structures

Sensors ◽  
2018 ◽  
Vol 18 (8) ◽  
pp. 2603 ◽  
Author(s):  
Zhiyong Chen ◽  
Meifeng Guo ◽  
Rong Zhang ◽  
Bin Zhou ◽  
Qi Wei
Keyword(s):  
Thermal Stress ◽  
Natural Frequency ◽  
Frequency Conversion ◽  
Thermal Stresses ◽  
Sensors And Actuators ◽  
Stress Variation ◽  
Rigid Frame ◽  
Measured Stress ◽  
Stress Isolation ◽  
Frequency Variations

The mechanical stress in silicon-on-glass MEMS structures and a stress isolation scheme were studied by analysis and experimentation. Double-ended tuning forks (DETFs) were used to measure the stress based on the stress-frequency conversion effect. Considering the coefficients of thermal expansion (CTEs) of silicon and glass and the temperature coefficient of the Young’s modulus of silicon, the sensitivity of the natural frequency to temperature change was analyzed. A stress isolation mechanism composed of annular isolators and a rigid frame is proposed to prevent the structure inside the frame from being subjected to thermal stresses. DETFs without and with one- or two-stage isolation frames with the orientations <110> and <100> were designed, the stress and natural frequency variations with temperature were simulated and measured. The experimental results show that in the temperature range of −50 °C to 85 °C, the stress varied from −18 MPa to 10 MPa in the orientation <110> and −11 MPa to 5 MPa in the orientation <100>. For the 1-stage isolated DETF of <110> orientation, the measured stress variation was only 0.082 MPa. The thermal stress can be mostly rejected by a stress isolation structure, which is applicable in the design of stress-sensitive MEMS sensors and actuators.

Numerical Study of Thermal Stresses in a Planar Solid Oxide Fuel Cell Stack

2017 ◽  
Author(s):  
Cun Wang ◽  
Tao Zhang ◽  
Cheng Zhao ◽  
Jian Pu
Keyword(s):  
Thermal Stress ◽  
Fuel Cell ◽  
Solid Oxide Fuel Cell ◽  
Thermal Stresses ◽  
Coefficient Of Thermal Expansion ◽  
Numerical Study ◽  
Solid Oxide ◽  
Oxide Fuel ◽  
Compressive Loads ◽  
Cte Mismatch

A three dimensional numerical model of a practical planar solid oxide fuel cell (SOFC) stack based on the finite element method is constructed to analyze the thermal stress generated at different uniform temperatures. Effects of cell positions, different compressive loads, and coefficient of thermal expansion (CTE) mismatch of different SOFC components on the thermal stress distribution are investigated in this work. Numerical results indicate that the maximum thermal stress appears at the corner of the interface between ceramic sealants and cells. Meanwhile the maximum thermal stress at high temperature is significantly larger than that at room temperature (RT) and presents linear growth with the increase of operating temperature. Since the SOFC stack is under the combined action of mechanical and thermal loads, the distribution of thermal stress in the components such as interconnects and ceramic sealants are greatly controlled by the CTE mismatch and scarcely influenced by the compressive loads.

scholarly journals Numerical Simulation Study on the Front Shape and Thermal Stresses in Growing Multicrystalline Silicon Ingot: Process and Structural Design

Crystals ◽  
2020 ◽  
Vol 10 (11) ◽  
pp. 1053
Author(s):  
Chengmin Chen ◽  
Guangxia Liu ◽  
Lei Zhang ◽  
Guodong Wang ◽  
Yanjin Hou ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Thermal Stress ◽  
Thermal Stresses ◽  
Simulation Method ◽  
Power Ratio ◽  
Radial Temperature ◽  
Front Shape ◽  
Simulation Results ◽  
Insulation Block ◽  
Transient Numerical Simulation

In this paper, a transient numerical simulation method is used to investigate the effects of the two furnace configurations on the thermal field: the shape of the melt–crystal (M/C) interface and the thermal stress in the growing multicrystalline ingot. First, four different power ratios (top power to side power) are investigated, and then three positions (i.e., the vertical, angled, and horizontal positions) of the insulation block are compared with the conventional setup. The power ratio simulation results show that with a descending power ratio, the M/C interface becomes flatter and the thermal stress in the solidified ingot is lower. In our cases, a power ratio of 1:3–1:4 is more feasible for high-quality ingot. The block’s position simulation results indicate that the horizontal block can more effectively reduce the radial temperature gradient, resulting in a flatter M/C interface and lower thermal stress.

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