Surface process technology: Its application to medico-micromachines.

1990 ◽  
Vol 56 (12) ◽  
pp. 2197-2200 ◽  
Author(s):  
Tatkehtea MATSJOA
Keyword(s):  
Surface Process ◽  
Process Technology

Novel photoreactive surface process technology for fabricated devices

1991 ◽  
pp. 69-75
Author(s):  
Takehisa Matsuda ◽  
Kazuhiko Inoue ◽  
Takashi Sugawara ◽  
Tetsuzo Akutsu
Keyword(s):  
Surface Process ◽  
Process Technology

Microstructural characterization of sol-gel coating on PET films

1994 ◽  
Vol 52 ◽  
pp. 886-887
Author(s):  
R. T. Chen ◽  
R.A. Norwood
Keyword(s):  
Ion Beam ◽  
Sol Gel ◽  
Industrial Applications ◽  
Hard Coatings ◽  
Nanometer Scale ◽  
Ion Beam Sputtering ◽  
Process Technology ◽  
Refractive Index Measurement ◽  
Organically Modified ◽  
Pet Films

Sol-gel processing has been used to control the structure of a material on a nanometer scale in preparing advanced ceramics and glasses. Film coating using the sol-gel process was also found to be a viable process technology in applications such as optical, porous, antireflection and hard coatings. In this study, organically modified silicate (Ormosil) coatings are applied to PET films for various industrial applications. Sol-gel materials are known to exhibit nanometer scale structures which havepreviously been characterized by small-angle X-ray scattering (SAXS), neutron scattering and light scattering. Imaging of the ultrafine sol-gel structures has also been performed using an ultrahigh resolution replica/TEM technique. The objective of this study was to evaluate the ultrafine structures inthe sol gel coatings using a direct imaging technique: atomic force microscopy (AFM). In addition, correlation of microstructures with processing parameters, coating density and other physical properties will be discussed.The materials evaluated are organically modified silicate coatings on PET film substrates. Refractive index measurement by the prism coupling method was used to assess density of the sol-gel coating.AFM imaging was performed on a Nanoscope III AFM (by Digital Instruments) using constant force mode. Solgel coating samples coated with a thin layer of Ft (by ion beam sputtering) were also examined by STM in order to confirm the structures observed in the contact type AFM. In addition, to compare the previous results, sol-gel powder samples were also prepared by ultrasonication followed by Pt/Au shadowing and examined using a JEOL 100CX TEM.

Dairy Farmers Empowerment in Subak Anggabaya Penatih Timur Denpasar Bali Indonesia

2018 ◽  
Vol 9 (05) ◽  
pp. 20218-20223
Author(s):  
I Ketut Arnawa ◽  
I Wayan Runa ◽  
I Made Sukerta ◽  
Putu Sri Astuti ◽  
Dan Luh Kadek Budi Martini
Keyword(s):  
Rice Straw ◽  
Azadirachta Indica ◽  
Nutritional Value ◽  
Organic Fertilizer ◽  
Process Technology ◽  
Dairy Farmers ◽  
Training Activity ◽  
Good Nutrition ◽  
And Training ◽  
Spraying Method

The main purpose for the application of science and technology for livestock group of cow, is to form a group of skilled and professional livestock, as vaccinators, can take advantage of Azadirachta indica leaves a plant insecticide, apply a good cage sanitation, can produce organic fertilizer from feces of cow, can treat hay as feed to good nutritional value. The method used is education and training. Activity results obtained, that 10 percent of members of the group have managed to become vaccinators cadres, able to implement good sanitation stables, feces of cow (Stomoxys calsitrans) can process technology with EM4 into organic fertilizer and can process the rice straw with urea spraying method, to produce feed hay to the value of good nutrition for growing cattle.

TEKNOLOGI PENYEDIAAN AIR MINUM UNTUK KEADAAN TANGGAP DARURAT

2018 ◽  
Vol 6 (1) ◽  
Author(s):  
Arie Herlambang
Keyword(s):  
Water Quality ◽  
Emergency Response ◽  
Distribution Systems ◽  
Treatment Plant ◽  
Piping System ◽  
Process Technology ◽  
Treatment Technology ◽  
Disaster Victims ◽  
Ultra Filtration ◽  
Quality Water

In the event of natural disasters such as earthquakes, tsunamis, landslides, floods and droughts, water occupies a key role in disaster relief. The presence of water is important for drinking, cooking and support the refugee areas of environmental sanitation and avoiding disaster victims of diseases waterborn disease. Water problem in disaster conditions may occur partly as a result: the disturbance of water sources because change of water quality, to become turbid or salty, the destruction of a piping system, treatment plant damage, disruption of distribution systems, or the scarcity of water in evacuation areas. Introduction of water quality becomes important to determine which process technology will be used and saved investments in emergency conditions. Priority handling of clean water usually comes first in the refugee areas with communal system, because the need of water for bathing, washing and toilet is big enough, while for a drink in the early events during disaster dominated by bottled water, but for their long-term, they have to boil water. For remote areas and difficult to reach individuals who usually use  system more simple and easily operated. Water Supply Technology for emergency response has the characteristic 1). Able to operate with all sorts of water conditions (flexible adaptable), 2). Can be operated easily, 3). Does not require much maintenance, 4). Little use of chemicals, and 5). Portable and easy removable (Mobile System). Keywords :  Water Quality, Water Treatment Technology, Drinking Water, Emergency Response, filtration, ceramic filtration, Ultra filtration, Reverse Osmosis, Ultraviolet Sterilizer, Ozonizer, Disinfection.

Application of KOH Electrochemical Etch and Passive Voltage Contrast Techniques for Deep Sub-Micron CMOS Leaky Gate Detection

2000 ◽  
Author(s):  
Fred Y. Chang ◽  
Victer Chan
Keyword(s):  
Case Studies ◽  
Detection Technique ◽  
Cobalt Silicide ◽  
Process Technology ◽  
Process Flow ◽  
Voltage Contrast ◽  
Emission Detection ◽  
Wet Etch ◽  
Direct Confirmation

Abstract This paper describes a novel de-process flow by combining cobalt silicide / nitride wet etch with KOH electrochemical wet etch (ECW) to identify leaky gate in silicided deep sub-micron process technology. Traditionally, leaky gate identification requires direct confirmation by gate level electrical or emission detection technique. Ohtani [1] used KOH electrochemical etch application to identify nonsilicided leaky gate capacitor in DRAM without using the above confirmation. The result of the case study demonstrates the expanded application of ECW etch to both silicided 0.18um logic and SRAM devices. Voltage contrast at metal 1 to assist leaky gate localization is also proposed. By combining both techniques, the possibility for isolating gate related defects are greatly enhanced. Case studies also show the advantages of the proposed technique over conventional poly level voltage contrast in leaky gate identification especially with devices that use local interconnect and nitride liner process.

Interpreting Laser-Based Fault Localization Results: Case Studies

2019 ◽  
Author(s):  
Sukho Lee ◽  
John van den Biggelaar ◽  
Marc van Veenhuizen
Keyword(s):  
Case Studies ◽  
Circuit Design ◽  
High Sensitivity ◽  
Failure Behavior ◽  
Process Technology ◽  
Resistance Change ◽  
Voltage Imaging ◽  
Root Cause ◽  
First Case ◽  
Proper Interpretation

Abstract Laser-based dynamic analysis has become a very important tool for analyzing advanced process technology and complex circuit design. Thus, many good reference papers discuss high resolution, high sensitivity, and useful applications. However, proper interpretation of the measurement is important as well to understand the failure behavior and find the root cause. This paper demonstrates this importance by describing two insightful case studies with unique observations from laser voltage imaging/laser voltage probing (LVP), optical beam induced resistance change, and soft defect localization (SDL) analysis, which required an in-depth interpretation of the failure analysis (FA) results. The first case is a sawtooth LVP signal induced by a metal short. The second case, a mismatched result between an LVP and SDL analysis, is a good case of unusual LVP data induced by a very sensitive response to laser light. The two cases provide a good reference on how to properly explain FA results.

Application of AFP in Resolving Systematic Issue in Wafer Fabrication

2013 ◽  
Author(s):  
Hui Peng Ng ◽  
Ghim Boon Ang ◽  
Chang Qing Chen ◽  
Alfred Quah ◽  
Angela Teo ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Failure Mechanisms ◽  
Critical Role ◽  
Electrical Characterization ◽  
Process Technology ◽  
Atomic Force ◽  
Defect Localization ◽  
Non Volatile Memory ◽  
Visual Failure

Abstract With the evolution of advanced process technology, failure analysis is becoming much more challenging and difficult particularly with an increase in more erratic defect types arising from non-visual failure mechanisms. Conventional FA techniques work well in failure analysis on defectively related issue. However, for soft defect localization such as S/D leakage or short due to design related, it may not be simple to identify it. AFP and its applications have been successfully engaged to overcome such shortcoming, In this paper, two case studies on systematic issues due to soft failures were discussed to illustrate the AFP critical role in current failure analysis field on these areas. In other words, these two case studies will demonstrate how Atomic Force Probing combined with Scanning Capacitance Microscopy were used to characterize failing transistors in non-volatile memory, identify possible failure mechanisms and enable device/ process engineers to make adjustment on process based on the electrical characterization result. [1]

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