Analysis of Power MOSFET Active Temperature Cycling Failures

2013 ◽  
Author(s):  
Ian Kearney
Keyword(s):  
Development Process ◽  
Failure Mechanisms ◽  
Temperature Cycling ◽  
Power Devices ◽  
Contributing Factors ◽  
Power Mosfet ◽  
Root Cause ◽  
Power Cycling ◽  
Performance Deterioration ◽  
And Performance

Abstract Performance degradation due to fatigue accumulation from the repetitive switching of high load current is critical to understanding robust power MOSFET product design. In this paper, we present a novel high-current-temperature (HCT) characterization system used to investigate real world powercycling failure mechanisms. The effects of electric current Joule heating, non-uniform temperature distribution and performance deterioration of discrete power devices are discussed. Thermal fatigue of solder joints and thick aluminum wire bonding are common weak spots with regard to power-cycling capability. We report performance failure mechanisms and discuss the superposition of contributing factors in defining root cause. Results discuss various package influences as part of a robust power MOSFET development process.

scholarly journals Role of membrane autopsy in enhancing reverse osmosis plant operation

2018 ◽  
Vol 13 (1) ◽  
pp. 106-114 ◽  
Author(s):  
G. Liu ◽  
S. Pattanayak ◽  
P. Navaneethakrishnan ◽  
R. Woodling
Keyword(s):  
Reverse Osmosis ◽  
Asset Management ◽  
Plant Operation ◽  
Performance Loss ◽  
Root Cause ◽  
Routine Monitoring ◽  
Performance Deterioration ◽  
Reverse Osmosis Plant ◽  
And Performance

Abstract Reverse osmosis (RO) has successfully emerged as a broadly-used commercial water purification technology in recent decades. Nevertheless, RO membrane elements, the core component of this purification process, are frequently subjected to premature degradation and performance deterioration, adversely impacting RO plant operation & maintenance. Membrane autopsy is a well-proven yet under-valued procedure for effectively assessing the condition of membranes and determining the root-cause of performance loss. This paper aims to provide a general methodology utilized commercially to perform membrane autopsy and employ three case studies to explicitly demonstrate the value addition to operators and end-users when applying membrane autopsy in (1) failure analysis and trouble-shooting, (2) operation optimization and routine monitoring, and (3) asset management and maintenance enhancement.

Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

2018 ◽  
Author(s):  
Klas Brinkfeldt ◽  
Göran Wetter ◽  
Andreas Lövberg ◽  
Dag Andersson ◽  
Zsolt Toth-Pal ◽  
...  
Keyword(s):  
Power Electronics ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Acoustic Microscopy ◽  
Power Devices ◽  
Switching Losses ◽  
Power Cycling ◽  
Blocking Voltage ◽  
Drive Trains ◽  
Lift Off

As the automotive industry shifts towards the electrification of drive trains, the efficiency of power electronics becomes more important. The use of silicon carbide (SiC) devices in power electronics has shown several benefits in efficiency, blocking voltage and high temperature operation. In addition, the ability of SiC to operate at higher frequencies due to lower switching losses can result in reduced weight and volume of the system, which also are important factors in vehicles. However, the reliability of packaged SiC devices is not yet fully assessed. Previous work has predicted that the different material properties of SiC compared to Si could have a large influence on the failure mechanisms and reliability. For example, the much higher elastic modulus of SiC compared to Si could increase strain on neighboring materials during power cycling. In this work, the failure mechanisms of packaged Si- and SiC-based power devices have been investigated following power cycling tests. The packaged devices were actively cycled in 4.5 s heating and 20 s cooling at ΔT = 60–80 K. A failure analysis using micro-focus X-ray and scanning acoustic microscopy (SAM) was carried out in order to determine the most important failure mechanisms. The results of the analysis indicate that the dominant failure mechanism is wire bond lift-off at the device chip for all of the SiC-based devices. Further analysis is required to determine the exact failure mechanisms of the analyzed Si-based devices. In addition, the SiC-based devices failed before the Si-based devices, which could be a result of the different properties of the SiC material.

Root Cause Analyses of Metal Bridging for Copper Damascene Process

2005 ◽  
Author(s):  
Z. G. Song ◽  
S. P. Neo ◽  
S. K. Loh ◽  
C. K. Oh
Keyword(s):  
Failure Mechanisms ◽  
Copper Corrosion ◽  
Microelectronic Device ◽  
Root Cause ◽  
Damascene Process ◽  
New Process ◽  
Copper Cmp

Abstract New process will introduce new failure mechanisms during microelectronic device manufacturing. Even if the same defect, its root causes can be different for different processes. For aluminum(Al)-tungsten(W) metallization, the root cause of metal bridging is quite simple and mostly it is blocked etch or under-etch. But, for copper damascene process, the root causes of metal bridging are complicated. This paper has discussed the various root causes of metal bridging for copper damascene process, such as those related to litho-etch issue, copper CMP issue, copper corrosion issue and so on.

3D Integrated Power—A Discrete Perspective

2015 ◽  
Author(s):  
Ian Kearney ◽  
Stephen Brink
Keyword(s):  
Heat Dissipation ◽  
Automatic Test Equipment ◽  
Systematic Analysis ◽  
Power Mosfet ◽  
Root Cause ◽  
Industry Standard ◽  
Bona Fide ◽  
Process Issue ◽  
Board Level ◽  
3D Package

Abstract The shift in power conversion and power management applications to thick copper clip technologies and thinner silicon dies enable high-current connections (overcoming limitations of common wire bond) and enhance the heat dissipation properties of System-in-Package solutions. Powerstage innovation integrates enhanced gate drivers with two MOSFETs combining vertical current flow with a lateral power MOSFET. It provides a low on-resistance and requires an extremely low gate charge with industry-standard package outlines - a combination not previously possible with existing silicon platforms. These advancements in both silicon and 3D Multi-Chip- Module packaging complexity present multifaceted challenges to the failure analyst. The various height levels and assembly interfaces can be difficult to deprocess while maintaining all the critical evidence. Further complicating failure isolation within the system is the integration of multiple chips, which can lead to false positives. Most importantly, the discrete MOSFET all too often gets overlooked as just a simple threeterminal device leading to incorrect deductions in determining true root cause. This paper presents the discrete power MOSFET perspective amidst the competing forces of the system-to-board-level failure analysis. It underlines the requirement for diligent analysis at every step and the importance as an analyst to contest the conflicting assumptions of challenging customers. Automatic Test Equipment (ATE) data-logs reported elevated power MOSFET leakage. Initial assumptions believed a MOSFET silicon process issue existed. Through methodical anamnesis and systematic analysis, the true failure was correctly isolated and the power MOSFET vindicated. The authors emphasize the importance of investigating all available evidence, from a macro to micro 3D package perspective, to achieve the bona fide path forward and true root cause.

Mass School Shootings in the United States: A Novel Root Cause Analysis Using Lay Press Reports

2019 ◽  
Vol 58 (13) ◽  
pp. 1423-1428 ◽  
Author(s):  
Chris A. Rees ◽  
Lois K. Lee ◽  
Eric W. Fleegler ◽  
Rebekah Mannix
Keyword(s):  
United States ◽  
Environmental Factors ◽  
Root Cause Analysis ◽  
The United States ◽  
School Shootings ◽  
Contributing Factors ◽  
Mass Shootings ◽  
Cause Analysis ◽  
Factors Associated ◽  
Root Cause

School shootings comprise a small proportion of childhood deaths from firearms; however, these shootings receive a disproportionately large share of media attention. We conducted a root cause analysis of 2 recent school shootings in the United States using lay press reports. We reviewed 1760 and analyzed 282 articles from the 10 most trusted news sources. We identified 356 factors associated with the school shootings. Policy-level factors, including a paucity of adequate legislation controlling firearm purchase and ownership, were the most common contributing factors to school shootings. Mental illness was a commonly cited person-level factor, and access to firearms in the home and availability of large-capacity firearms were commonly cited environmental factors. Novel approaches, including root cause analyses using lay media, can identify factors contributing to mass shootings. The policy, person, and environmental factors associated with these school shootings should be addressed as part of a multipronged effort to prevent future mass shootings.

Low-Temperature Joining Technique as Interconnection Technology for Power Electronics

2011 ◽  
Vol 324 ◽  
pp. 437-440
Author(s):  
Raed Amro
Keyword(s):  
Low Temperature ◽  
Power Electronics ◽  
Life Time ◽  
Junction Temperature ◽  
Limiting Factors ◽  
Power Devices ◽  
Packaging Technology ◽  
Power Cycling ◽  
Power Modules ◽  
Bond Wires

There is a demand for higher junction temperatures in power devices, but the existing packaging technology is limiting the power cycling capability if the junction temperature is increased. Limiting factors are solder interconnections and bond wires. With Replacing the chip-substrate soldering by low temperature joining technique, the power cycling capability of power modules can be increased widely. Replacing also the bond wires and using a double-sided low temperature joining technique, a further significant increase in the life-time of power devices is achieved.

scholarly journals Analysis of the degradation mechanisms occurring in the topside interconnections of IGBT power devices during power cycling

2018 ◽  
Vol 88-90 ◽  
pp. 462-469 ◽  
Author(s):  
N. Dornic ◽  
A. Ibrahim ◽  
Z. Khatir ◽  
S.H. Tran ◽  
J.-P. Ousten ◽  
...  
Keyword(s):  
Degradation Mechanisms ◽  
Power Devices ◽  
Power Cycling

scholarly journals Design and Development of Weatherproof Seals for Prefabricated Construction: A Methodological Approach

Buildings ◽  
2018 ◽  
Vol 8 (9) ◽  
pp. 117 ◽  
Author(s):  
Kristopher Orlowski ◽  
Kasun Shanaka ◽  
Priyan Mendis
Keyword(s):  
Development Process ◽  
Methodological Approach ◽  
Building Industry ◽  
Practical Application ◽  
Design And Development ◽  
Modular Systems ◽  
Design Life ◽  
Flow Charts ◽  
And Performance ◽  
Careful Design

Satisfactory weatherproofing of buildings is vital to maximise their design life and performance which requires the careful design of external sealing technologies. Systems commonly available have served well in conventional construction however with many prefabricated systems emerging in the building industry new and novel means of weatherproofing between panels and modules need to be developed purpose specific to this application. This paper presents a holistic and fundamental methodological approach to Design and Development of waterproof seals and has been applied specific for prefabricated panelised and modular systems. Two purpose specific weatherproof seals are finally presented. Flow charts of the overview of the suggested methodological approach and the processes within which include DfMA that have been incorporated into understanding and developing seals for this practical application. These strategies have enabled a resourceful and holistic set of processes that can be adapted and used for similar forms of product research in new and developing areas of construction such as prefabrication. The design and development process is thoroughly investigated and has resulted in an exploration of the technical challenges and potential solutions which take into consideration factors from installation limitations to building tolerances.

Perceiving Humor in Traditional Chinese Peking Opera

2018 ◽  
Vol 14 (3) ◽  
pp. 371-391
Author(s):  
Zhiyi Zhang ◽  
Xiaobing Jin
Keyword(s):  
Performing Arts ◽  
Negative Influence ◽  
Contributing Factors ◽  
Comprehension Difficulty ◽  
Inverse Proportion ◽  
Peking Opera ◽  
And Performance ◽  
Interview Analysis

Abstract Peking opera epitomizes the traditional Chinese performing arts, and all six factors concerning the story and performance of Peking opera, namely plot, role type, song, speech, acting, and combat, can produce humorous effects among the audience. The present paper is a tentative study on humor and sensing humor in Peking opera. The scale study testified that all six factors were able to produce humorous effects and that they had different degrees of comprehension difficulty and humor for different contributing factors. The degree of comprehension difficulty can assert negative influence upon the degree of humor. Different from the traditionally held nonmonotonic (inverted-U) correlation between the two, a monotonic inverse proportion between the two has been detected. The interview analyses revealed that the humorous effects had something to do with incongruity but that resolution might not necessarily be involved. The scale study and the interview analysis both support this finding.

scholarly journals Effect of Virechana Karma along with Guggulu Kalpanas in the management of Medoroga - A Double Arm Study

2020 ◽  
Vol 5 (05) ◽  
pp. 89-95
Author(s):  
Pooja Abhrange ◽  
S. G. Chavan ◽  
Prashanth A.S.
Keyword(s):  
Metabolic Disease ◽  
Prime Factor ◽  
Natural Process ◽  
The Body ◽  
Inclusion Criteria ◽  
Contributing Factors ◽  
Root Cause ◽  
Individual Person ◽  
Group A ◽  
Group B

Metabolism is the natural process of the body, which is necessary to maintenance of the homeostasis of an individual person. Everybody constitutions are always in the process of metabolism, which is a combination of Anabolism (Construction) and Catabolism (Deterioration). As Agni is prime factor for all the Chayapachayakriya. Medoroga, is one of the Metabolic disease, in which contributing factors are Agni, Ama along with Kaphapradhana Tridosha, Medodhathu. Due to various types of etiological factors, the Agni in the body gets vitiated and Jatharagnimandya occurs. By this Jatharagnimandya, Dhathuparinama will not occur properly. This will lead to Medoroga and further many other Upadravas. To correct these conditions, Ayurveda has many modes of therapies like Samshodhana, Samshamana. By these we can correct the metabolism from the root cause. Here 40 Subjects diagnosed with Medoroga w.s.r. to Hyperlipidemia fulfilling the Inclusion criteria were selected for study and randomly categorized into two groups as Group A and Group B each consisting of 20 subjects. For both groups Amapachana with Chitrakadi Vati, Sadhyosnehapana with Murchita Sarshapa Taila, Sarvanga Abhyanga with Murchita Tila Taila followed by Swedana. And Virechana was administered with Virechana Gulika. Than each group received two different Shamanoushadhi. So, the objective of the study is to establish the efficacy of Virechana along with Dashanga Guggulu and Virechana along with Shadushana Guggulu in the management of Medoroga.

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