scholarly journals Thermal Analysis of Extended surfaces from the Heat sink of Different shape - A Brief Review

2021 ◽  
pp. 285-292
Author(s):  
Alok Kumar ◽  
Dr. Ajay Singh ◽  
Prof. Ashish Verma
Keyword(s):  
Heat Sink ◽  
Base Plate ◽  
Heat Extraction ◽  
Maximum Temperature ◽  
Base Surface ◽  
Pin Fin ◽  
Surface Contact Area ◽  
Extended Surfaces ◽  
Different Shapes ◽  
Porous Fins

This paper introduces a brief review about the way of heat extraction enhancement from heat sink using fins of different types and different shapes and also with different shape of perforation. Extended surfaces from the base plate or heat sink is nothing but they are FINS. There are various types of fin exits. They are Rectangular, Square, Annular, Elliptical, Cylindrical or Pin fin which is utilized with different geometrical combinations. To achieve maximum temperature droop from the base surface or heat sink by using fins numerous trials are completed or being carried out for designing optimized Fin. The optimization of Fin can be achieved by increasing surface contact area with the atmospheric air. In these days there are numbers of experiment is done on fins like Solid fin, Porous fins and Solid fins with perforation, has also been brought off. The various design modifications which are implemented and studied analytically and experimentally by the researchers using ANSYS Work bench is been discussed in this review paper.

Relating Semiconductor Heat Sink Local and Non-Local Experimental and Simulation Data to Upper Scale Design Goals

2001 ◽  
Author(s):  
V. S. Travkin
Keyword(s):  
Heat Sink ◽  
Solid Phase ◽  
Physical Characteristics ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Pin Fin ◽  
Three Samples ◽  
Non Local ◽  
Scale Design ◽  
Research And Design

Abstract The primary difficulty in semiconductor heat sink (and many other types of heat exchangers) research and design is not a lack of interest or money, but rather confusion with what being looked for and adequacy of the tools used for the search. As recently shown, there are few meaningful parameters (apart from sizes and weight) or physical characteristics of interest in semiconductor cooler design are local values. Even the maximum temperature of the base Tmax or semiconductor temperature are not local. In this work outlined the description in detail of arguments on how, and for what reasons, the measured data are to be simulated or measured and represented in a way that allows design goals to be formulated primarily with bulk physical characteristics. We demonstrate why studies of only averaged local integrated variables are not enough. Four sample semiconductor heat sinks of two morphologies (three samples of round pin fin and one sample of longitudinal rib fin sinks) were studied by different techniques and models. There were changes in by-pass values, external heat flux and flow rate. The results are depicted with using new parameters that better represent the needs of a design process as well as the usual parameters used in the past. Characteristics reported are the heat transfer rate in solid phase, relative fin effectiveness, and influence of only morphology features among others. Some suggestions for heat sink design are discussed.

Thermal Simulation Analysis of High Power LED with Varied Heat Sink Fin Design

2014 ◽  
Vol 1082 ◽  
pp. 332-335
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Hussin Kamarudin ◽  
Muammar Mohamad Isa ◽  
Gan Meng Kuan
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Simulation Analysis ◽  
Input Power ◽  
Junction Temperature ◽  
Single Chip ◽  
Pin Fin ◽  
High Power Led ◽  
Different Shapes ◽  
Fin Design

In this paper, the heat distribution for single chip high power LED package attached with varied heat sink fin shapes were analyzed through simulation. The main focus of this study was to scrutinize the fluctuation of junction temperature with different shapes of heat sink fin designs. The simulation was done using Ansys version 11. The single chip LED was loaded with input power of 0.5 W and 1 W . Simulation was done at ambient temperature of 25°C under three convection coefficient of 5, 10 and 15 W/m2.oC respectively. The obtained results showed that the LED package with pyramid pin fin heat sink has demonstrated a better thermal performance compared to the LED package with cylindrical pin fin heat sink.

scholarly journals Thermal Performance Improvement of a Fin-Arrayed Horizontal Heat Sink Corroborating Optimal Orientation Angle

2020 ◽  
Vol 9 (4) ◽  
pp. 1067-1075
Keyword(s):  
Heat Sink ◽  
Orientation Angle ◽  
Base Plate ◽  
Vertical Axis ◽  
Solid Base ◽  
Pin Fin ◽  
Wide Range ◽  
Pin Fins ◽  
Staggered Arrangement

The present study deals with a simple but effective technique for improving the forced convective cooling of a horizontal heat sink with vertical pin-fin-array.The pin fins are embedded in a staggered arrangement on thebase-plate of the horizontal sink. Air, while passing through the fin-array, convects the heat conducted from the solid base-plate to the fins’ surface. The objective of this paper is to examine the role of the orientation angle (  ) on the performance of the heat sink.  is varied from  0 to  360 by rotating the horizontal sink about a vertical axis passing through the center of the sink. A detailed CFD (computational fluid dynamics) study is coordinated over a wide range of inflow Reynolds number ( Re ) to explore the possibility for obtaining an optimum orientation angle (  ) for which Nusselt number ( Nu ) would be the maximum. Results indicate that optimum angle hovers around    120 regardless of the values of Re .

A Novel Concept to Improve the Performance of LED Panel Using Drilled Holes

2005 ◽  
Author(s):  
S. B. Chiang ◽  
C. C. Wang
Keyword(s):  
Heat Transfer ◽  
Surface Area ◽  
Heat Sink ◽  
Maximum Temperature ◽  
Transfer Coefficients ◽  
Pin Fin ◽  
Heat Transfer Coefficients ◽  
Pin Fins ◽  
Overall Performance ◽  
Novel Concept

In this study, the concept of the thermal module of LEDs cooling by use of drilled hole to entrain air flow was examined. It is found that the drilled hole does not necessarily improve the overall performance. It depends on the size of the drilled hole, the number of drilled holes, and the locations. The heat transfer coefficients are generally increased with the number of drilled holes and the diameter of the drilled hole. In this paper, the plate fin heat sink has a higher heat transfer coefficients than pin fins, but the overall performance of the LED panel having pin fin outperforms that of plate fin. This is because the pin fin provides much larger surface area. For decrease the maximum temperature of the LED panel, placement of the drilled holes along the hot region will be more effective.

Thermo-Mechanical Fatigue Life Prediction of Orthotropic Composite Pin Fin Heat Sinks for Electronic Packaging

2011 ◽  
Author(s):  
Sulaman Pashah ◽  
Abul Fazal M. Arif
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Packaging ◽  
Base Plate ◽  
Heat Sinks ◽  
Metallic Base ◽  
Plate Interface ◽  
Pin Fin ◽  
Pin Fins ◽  
Reliability Performance

Heat sinks are used in modern electronic packaging system to enhance and sustain system thermal performance by dissipating heat away from IC components. Pin fins are commonly used in heat sink applications. Conventional metallic pins fins are efficient in low Biot number range whereas high thermal performance can be achieved in high Biot number regions with orthotropic composite pin fins due to their adjustable thermal properties. However, several challenges related to performance as well as manufacturing need to be addressed before they can be successfully implemented in a heat sink design. A heat sink assembly with metallic base plate and polymer composite pin fins is a solution to address manufacturing constraints. During the service life of an electronic packaging, the heat sink assembly is subjected to power cycles. Cyclic thermal stresses will be important at the pin-fin and base-plate interface due to thermal mismatch. The cyclic nature of stresses can lead to fatigue failure that will affect the reliability of the heat sink and electronic packaging. A finite element model of the heat sink is used to investigate the thermal stress cyclic effect on thermo-mechanical reliability performance. The aim is to assess the reliability performance of the epoxy bond at the polymer composite pin fins and metallic base plate interface in a heat-sink assembly.

scholarly journals Hybrid Nanofluid-Based Thermal Fluid–Structure Interaction (FSI) Investigations for the Thermal Management System of a Computer Microprocessor

2021 ◽  
Vol 12 (1) ◽  
pp. 30
Author(s):  
Waseem Amjad ◽  
Adil Nawaz ◽  
Anjum Munir ◽  
Faisal Mahmood
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Thermal Stresses ◽  
Temperature Drop ◽  
Thermal Characteristics ◽  
Heat Sinks ◽  
Heat Extraction ◽  
Hybrid Nanofluid ◽  
Pin Fin ◽  
Wear And Tear

The heat extraction from and cooling of computer microprocessors are challenging tasks in the modern era. Previously, the microprocessors were usually cooled by air, but now industry is shifting towards using nanofluids, as their properties are more thermo-physically stable. The experimental and numerical studies have revealed that the rate of heat transfer depends both on the thermal characteristics of the coolant and the geometry of the heat sink. For optimized results, it is recommended to analyze the combined effect of nanofluids and the geometry of the heat sink. Mini-channel heat sinks in combination with a nanofluid offered an excellent rate of heat transfer. However, passing nanofluids continuously through the system causes various problems over time; for example, the thermal stresses on the components are increased, which may lead to wear and tear of the system. In this study, a numerical investigation of mini-channel heat sinks was conducted through thermal-FSI. A numerical model was established with airfoil and Savonius pin-fin mini channel heat sinks, and they were analyzed at different flow rates from 0.25 LPM to 0.75 LPM with an increment of 0.25 LPM with different fluids, i.e., water, Al2O3–H2O, and Fe2O3–H2O nanofluids, varying their volumetric concentration. The minimum stresses were obtained while increasing the temperature drop and decreasing the pressure drop. The thermal stresses were calculated using the thermal-FSI technique and were found to be in the threshold range, and hence the material was within the yield limit at 0.75 LPM when using the Fe2O3-H2O Nanofluid at a 0° angle using the Savonius heat sink.

EFFECT OF SHORT PIN FIN WITH DIFFERENT SHAPES AND ARRANGEMENTS ON THERMAL RESISTANCE OF MICRO HEAT SINK

2020 ◽  
Vol 27 (6) ◽  
pp. 491-503
Author(s):  
Gagan V. Kewalramani ◽  
Gaurav Hedau ◽  
Sandip Kumar Saha ◽  
Amit Agrawal
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Pin Fin ◽  
Different Shapes

Experimental Investigation of Thermal Performance of Vapor Chamber Heat Sinks

2010 ◽  
Author(s):  
Hung-Yi Li ◽  
Ming-Hung Chiang ◽  
Chih-I Lee ◽  
Wen-Jei Yang
Keyword(s):  
Experimental Investigation ◽  
Reynolds Number ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Base Plate ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Vapor Chamber ◽  
Lower Reynolds Number

This work experimentally studies the thermal performance of plate-fin vapor chamber heat sinks using infrared thermography. The effects of the fin width, the fin height and the Reynolds number on the thermal performance are considered. The results show that generated heat is transferred more uniformly to the base plate by a vapor chamber heat sink than by a similar aluminum heat sink. Therefore, the maximum temperature is effectively reduced. The overall thermal resistance of the vapor chamber heat sink declines as the Reynolds number increases, but the strength of the effect falls. The effect of the fin dimensions on the thermal performance is stronger at a lower Reynolds number.

Hydrodynamics and Heat Transfer Characteristics of a Miniature Plate Pin-Fin Heat Sink Utilizing Al2O3–Water and TiO2–Water Nanofluids

2015 ◽  
Vol 7 (3) ◽  
Author(s):  
Majid Roshani ◽  
Seyed Ziaeddin Miry ◽  
Pedram Hanafizadeh ◽  
Mehdi Ashjaee
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Sink ◽  
Base Plate ◽  
Constant Heat Flux ◽  
Hydrodynamic Performance ◽  
Bottom Surface ◽  
Inlet Temperature ◽  
Transfer Coefficients ◽  
Pin Fin

In this paper, the hydrodynamic and thermal performance of a miniature plate pin-finned heat sink is investigated experimentally by utilizing two widely used nanofluids, Al2O3–water and TiO2–water. The heat sink base plate, which is used in the cooling process of electronic devices, has the dimensions of 42 mm (L) × 42 mm (W) × 14 mm (H) and is made of aluminum and placed in a plexiglass case which is isolated from the environment using an insulator foam. The thermal performance of the heat sink is investigated by passing the nanofluid at constant inlet temperature while applying a constant heat flux of 124.8 kW/m2 to the bottom surface of the heat sink. The nanofluids are prepared in volume concentrations of 0.5, 1, 1.5, and 2% and their performances are measured considering water as the base fluid. Measuring the pressure difference between the entrance and exit of the heat sink made it possible to study the hydrodynamic performance of the heat sink. Although the measurements showed 15% and 30% increase in the pumping power for the volume concentration of 2% of Al2O3–water and TiO2–water nanofluids, respectively, the average heat transfer coefficients increased by 16% and 14% and the thermal resistance decreased by 17% and 14% for each nanofluid.

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