scholarly journals Instrumenting Polyodon spathula (Paddlefish) Rostra in Flowing Water with Strain Gages and Accelerometers

Biosensors ◽  
2020 ◽  
Vol 10 (4) ◽  
pp. 37
Author(s):  
Clayton R. Thurmer ◽  
Reena R. Patel ◽  
Guilermo A. Riveros ◽  
Quincy G. Alexander ◽  
Jason D. Ray ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Strain Gages ◽  
Physical Force ◽  
Printed Circuit ◽  
The North ◽  
In Vivo Experiments ◽  
In Vivo Testing ◽  
Commercial Off The Shelf

The prominent rostrum of the North American Paddlefish, supported by a lattice-like endoskeleton, is highly durable, making it an important candidate for bio-inspiration studies. Energy dissipation and load-bearing capacity of the structure from extreme physical force has been demonstrated superior to that of man-made systems, but response to continuous hydraulic forces is unknown and requires special instrumentation for in vivo testing on a live fish. A single supply strain gage amplifier circuit has been combined with a digital three-axis accelerometer, implemented in a printed circuit board (PCB), and integrated with the commercial-off-the-shelf Adafruit Feather M0 datalogger with a microSD card. The device is battery powered and enclosed in silicon before attachment around the rostrum with a silicon strap "watch band." As proof-of-concept, we tested the instrumentation on an amputated Paddlefish rostrum in a water-filled swim tunnel and successfully obtained interpretable data. Results indicate that this design could work on live swimming fish in future in vivo experiments.

scholarly journals NotchPUF: Printed Circuit Board PUF Based on Microstrip Notch Filter

Cryptography ◽  
2020 ◽  
Vol 4 (2) ◽  
pp. 11
Author(s):  
Mitchell Martin ◽  
Jim Plusquellic
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Statistical Tests ◽  
Notch Filter ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
In Series ◽  
Commercial Off The Shelf ◽  
Using Data

Physical Unclonable Functions (PUFs) are primitives that are designed to leverage naturally occurring variations to produce a random bitstring. Current PUF designs are typically implemented in silicon or utilize variations found in commercial off-the-shelf (COTS) parts. Because of this, existing designs are insufficient for the authentication of Printed Circuit Boards (PCBs). In this paper, we propose a novel PUF design that leverages board variations in a manufactured PCB to generate unique and stable IDs for each PCB. In particular, a single copper trace is used as a source of randomness for bitstring generation. The trace connects three notch filter structures in series, each of which is designed to reject specific but separate frequencies. The bitstrings generated using data measured from a set of PCBs are analyzed using statistical tests to illustrate that high levels of uniqueness and randomness are achievable.

scholarly journals Design of a continuously tunable reflectarray element for 5G metrology in the k-band

2020 ◽  
Vol 18 ◽  
pp. 1-5
Author(s):  
Thomas Harz ◽  
Thomas Kleine-Ostmann ◽  
Thorsten Schrader
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Simulation Software ◽  
Circuit Board ◽  
Control Voltage ◽  
Wave Excitation ◽  
Varactor Diode ◽  
Printed Circuit ◽  
Commercial Off The Shelf ◽  
K Band

Abstract. We introduce a new tunable reflectarray element for an operation frequency of 26 GHz in the k-band. It is shown that a 340∘ continuous tunning range of the reflected wave can be accomplished by using an aperture-coupled patch antenna with only one single varactor diode. The simplified design and the small needed space make it usable for k-band reflectarrays with many elements. The functionality of the reflectarray element is explained and the crucial parts are analyzed. The approach to get a full phase shift is discussed in detail. A bias-T is developed to provide the control voltage to the varactor diode without interfering with the high frequency path. The high frequency path and the DC-path are decoupled by 39 dB using a bias-T. A commercial off-the-shelf varactor diode is selected and its functionality at 26 GHz is verified. Therefore, a test printed circuit board with through, reflect, line standards is developed to de-embed the varactor diode and to evaluate it with a vector network analyzer. The reflectarray is simulated in a unit cell with plane wave excitation and periodic boundary condition using the simulation software package CST Microwave Studio™.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips

2006 ◽  
Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris
Keyword(s):  
Reliability Analysis ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit ◽  
Root Cause ◽  
Micro Cracks ◽  
Temperature And Humidity

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

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