scholarly journals Characterization of Thin Chromium Coatings Produced by PVD Sputtering for Optical Applications

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 215
Author(s):  
Andreia A. Ferreira ◽  
Francisco J. G. Silva ◽  
Arnaldo G. Pinto ◽  
Vitor F. C. Sousa
Keyword(s):  
Automotive Industry ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Early Stage ◽  
Chemical Vapor ◽  
Experimental Tests ◽  
Scratch Test ◽  
Industrial Sectors ◽  
Deposition Processes ◽  
Optical Applications

PVD (physical vapor deposition) and CVD (chemical vapor deposition) have gained greater significance in the last two decades with the mandatory shift from electrodeposition processes to clean deposition processes due to environmental, public safety, and health concerns. Due to the frequent use of coatings in several industrial sectors, the importance of studying the chromium coating processes through PVD–sputtering can be realized, investing in a real alternative to electroplated hexavalent chromium, usually denominated by chromium 6, regularly applied in electrodeposition processes of optical products in the automotive industry. At an early stage, experimental tests were carried out to understand which parameters are most suitable for obtaining chromium coatings with optical properties. To study the coating in a broad way, thickness and roughness analysis of the coatings obtained using SEM and AFM, adhesion analyzes with the scratch-test and transmittance by spectrophotometry were carried out. It was possible to determine that the roughness and transmittance decreased with the increase in the number of layers, the thickness of the coating increased linearly, and the adhesion and resistance to climatic tests remained positive throughout the study. Thus, this study allows for the understanding that thin multilayered Cr coatings can be applied successfully to polymeric substrates regarding optical applications in the automotive industry.

scholarly journals Application of a Novel CVD TiN Coating on a Biomedical Co–Cr Alloy: An Evaluation of Coating Layer and Substrate Characteristics

Materials ◽  
2020 ◽  
Vol 13 (5) ◽  
pp. 1145 ◽  
Author(s):  
Si Hoon Song ◽  
Bong Ki Min ◽  
Min-Ho Hong ◽  
Tae-Yub Kwon
Keyword(s):  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Cast Alloy ◽  
Chemical Vapor ◽  
Scratch Test ◽  
Face Centered Cubic ◽  
Cobalt Chromium ◽  
Tin Coating ◽  
Promising Alternative ◽  
Coated Alloy

Titanium nitride (TiN) was deposited on the surface of a cobalt–chromium (Co–Cr) alloy by a hot-wall type chemical vapor deposition (CVD) reactor at 850 °C, and the coating characteristics were compared with those of a physical vapor deposition (PVD) TiN coating deposited on the same alloy at 450 °C. Neither coating showed any reactions at the interface. The face-centered cubic (fcc) structure of the alloy was changed into a hexagonal close-packed (hcp) phase, and recrystallization occurred over at 10 μm of depth from the surface after CVD coating. Characteristic precipitates were also generated incrementally depending on the depth, unlike the precipitates in the matrix of the as-cast alloy. On the other hand, the microstructure and phase of the PVD-coated alloy did not change. Depth-dependent nano-hardness measurements showed a greater increase in hardness in the recrystallization zone of the CVD-coated alloy than in the bulk center of the alloy. The CVD coating showed superior adhesion to the PVD coating in the progressive scratch test. The as-cast, PVD-coated, and CVD-coated alloys all showed negative cytotoxicity. Within the limitations of this study, CVD TiN coating to biomedical Co–Cr alloy may be considered a promising alternative to PVD technique.

Thermodynamic Constraints for the In Situ MOCVD Growth of Superconducting Tl-Ba-Ca-Cu-O Thin Films

1993 ◽  
Vol 335 ◽  
Author(s):  
William L. Holstein
Keyword(s):  
Thin Films ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Mocvd Growth ◽  
Metal Organic ◽  
Deposition Processes ◽  
Organic Chemical Vapor Deposition

AbstractIn spite of several attempts, superconducting Tl-Ba-Ca-Cu-O thin films have not been successfully prepared in situ by metal organic chemical vapor deposition (MOCVD). Preparation of a phase by MOCVD requires that it be thermodynamically stable with respect to its decomposition into volatile species and other condensed phases. For MOCVD growth of Tl-Ba- Ca-Cu-O compounds in the presence of oxygen from reagents containing only C-H or C-H-O ligands, Tl2O(g) and TIOH(g) exhibit appreciable volatility. If reagents with ligands containing fluorine are used, the formation of volatile TIF(g) must also be considered. Thermodynamic data for these materials are compiled, and thermodynamic relationships between these gases, H2O(g) and HF(g) are established. The thermodynamic stability of TIOH(g) and TIF(g) makes the in situ growth of Tl-Ba-Ca-Cu-O compounds by MOCVD more difficult than their in situ growth by physical vapor deposition processes, for which Tl2O(g) is the only volatile TI-containing species present.

scholarly journals Deposition Methods for Microstructured and Nanostructured Coatings on Metallic Bone Implants: A Review

2017 ◽  
Vol 2017 ◽  
pp. 1-9 ◽  
Author(s):  
Bailey Moore ◽  
Ebrahim Asadi ◽  
Gladius Lewis
Keyword(s):  
Plasma Spray ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Aerosol Deposition ◽  
Deposition Process ◽  
Future Research ◽  
Bone Implants ◽  
Implant Surface ◽  
Deposition Processes

A review of current deposition processes is presented as they relate to osseointegration of metallic bone implants. The objective is to present a comprehensive review of different deposition processes used to apply microstructured and nanostructured osteoconductive coatings on metallic bone implants. Implant surface topography required for optimal osseointegration is presented. Five of the most widely used osteoconductive coating deposition processes are reviewed in terms of their microstructure and nanostructure, usable thickness, and cost, all of which are summarized in tables and charts. Plasma spray techniques offer cost-effective coatings but exhibit deficiencies with regard to osseointegration such as high-density, amorphous coatings. Electrodeposition and aerosol deposition techniques facilitate the development of a controlled-microstructure coating at a similar cost. Nanoscale physical vapor deposition and chemical vapor deposition offer an alternative approach by allowing the coating of a highly structured surface without significantly affecting the microstructure. Various biomedical studies on each deposition process are reviewed along with applicable results. Suggested directions for future research include further optimization of the process-microstructure relation, crystalline plasma spray coatings, and the deposition of discrete coatings by additive manufacturing.

Laser Chemical Vapor Deposition of Thick Oxide Coatings

2006 ◽  
Vol 317-318 ◽  
pp. 495-500 ◽  
Author(s):  
Takashi Goto ◽  
Teiichi Kimura
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
High Speed ◽  
Chemical Vapor ◽  
Oxide Coatings ◽  
Laser Chemical Vapor Deposition ◽  
Deposition Rates ◽  
Thin Film Coatings ◽  
Deposition Processes

Thick oxide coatings have wide-ranged applications typically thermal barrier coatings. Although high speed deposition processes, often plasma spray or electron-beam physical vapor deposition, have been employed for these applications, another route has been pursued to improve the performance of coatings. We have proposed laser chemical vapor deposition (LCVD) for high-speed and thick oxide coatings. Conventional CVD can fabricate coatings at deposition rates of several to several 10 μm/h, and conventional LCVD has been mainly focused on thin film coatings and low temperature deposition. In the present LCVD, high-speed deposition rates ranging from 300 to 3000 μm/h have been achieved for several oxide coatings such as yttria stabilized zirconia (YSZ), TiO2, Al2O3 and Y2O3. This paper describes the effect of deposition conditions on the morphology and deposition rates for the preparation of YSZ and TiO2 by LCVD.

scholarly journals Noble Metals for Modern Implant Materials: MOCVD of Film Structures and Cytotoxical, Antibacterial, and Histological Studies

Biomedicines ◽  
2021 ◽  
Vol 9 (8) ◽  
pp. 851
Author(s):  
Svetlana I. Dorovskikh ◽  
Evgeniia S. Vikulova ◽  
Elena V. Chepeleva ◽  
Maria B. Vasilieva ◽  
Dmitriy A. Nasimov ◽  
...  
Keyword(s):  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Noble Metals ◽  
Mononuclear Cells ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Ti Alloy ◽  
Peripheral Blood Mononuclear ◽  
Histological Studies

This work is aimed at developing the modification of the surface of medical implants with film materials based on noble metals in order to improve their biological characteristics. Gas-phase transportation methods were proposed to obtain such materials. To determine the effect of the material of the bottom layer of heterometallic structures, Ir, Pt, and PtIr coatings with a thickness of 1.4–1.5 μm were deposited by metal–organic chemical vapor deposition (MOCVD) on Ti6Al4V alloy discs. Two types of antibacterial components, namely, gold nanoparticles (AuNPs) and discontinuous Ag coatings, were deposited on the surface of these coatings. AuNPs (11–14 nm) were deposited by a pulsed MOCVD method, while Ag films (35–40 nm in thickness) were obtained by physical vapor deposition (PVD). The cytotoxic (24 h and 48 h, toward peripheral blood mononuclear cells (PBMCs)) and antibacterial (24 h) properties of monophase (Ag, Ir, Pt, and PtIr) and heterophase (Ag/Pt, Ag/Ir, Ag/PtIr, Au/Pt, Au/Ir, and Au/PtIr) film materials deposited on Ti-alloy samples were studied in vitro and compared with those of uncoated Ti-alloy samples. Studies of the cytokine production by PBMCs in response to incubation of the samples for 24 and 48 h and histological studies at 1 and 3 months after subcutaneous implantation in rats were also performed. Despite the comparable thickness of the fibrous capsule after 3 months, a faster completion of the active phase of encapsulation was observed for the coated implants compared to the Ti alloy analogs. For the Ag-containing samples, growth inhibition of S. epidermidis, S. aureus, Str. pyogenes, P. aeruginosa, and Ent. faecium was observed.

scholarly journals CVD and PVD coating process modelling by using artificial neural networks

2012 ◽  
Vol 1 (1) ◽  
pp. 46 ◽  
Author(s):  
Amir Mahyar Khorasani ◽  
Mohammad Reza Solymany yazdi ◽  
Mehdi Faraji ◽  
Alex Kootsookos
Keyword(s):  
Thin Film ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Film Coating ◽  
Deposition Process ◽  
Thin Film Coating ◽  
Mlp Neural Network ◽  
Titanium Thin Film ◽  
Pvd Coating

Thin-film coating plays a prominent role on the manufacture of many industrial devices. Coating can increase material performance due to the deposition process. Having adequate and precise model that can predict the hardness of PVD and CVD processes is so helpful for manufacturers and engineers to choose suitable parameters in order to obtain the best hardness and decreasing cost and time of industrial productions. This paper proposes the estimation of hardness of titanium thin-film layers as protective industrial tools by using multi-layer perceptron (MLP) neural network. Based on the experimental data that was obtained during the process of chemical vapor deposition (CVD) and physical vapor deposition (PVD), the modeling of the coating variables for predicting hardness of titanium thin-film layers, is performed. Then, the obtained results are experimentally verified and very accurate outcomes had been attained.

Effectiveness and Reliability of Metal Diffusion Barriers for Copper Interconnects

1995 ◽  
Vol 403 ◽  
Author(s):  
G. Bai ◽  
S. Wittenbrock ◽  
V. Ochoa ◽  
R. Villasol ◽  
C. Chiang ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Diffusion Barriers ◽  
Copper Interconnects ◽  
Time To Failure ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron

AbstractCu has two advantages over Al for sub-quarter micron interconnect application: (1) higher conductivity and (2) improved electromigration reliability. However, Cu diffuses quickly in SiO2and Si, and must be encapsulated. Polycrystalline films of Physical Vapor Deposition (PVD) Ta, W, Mo, TiN, and Metal-Organo Chemical Vapor Deposition (MOCVD) TiN and Ti-Si-N have been evaluated as Cu diffusion barriers using electrically biased-thermal-stressing tests. Barrier effectiveness of these thin films were correlated with their physical properties from Atomic Force Microscopy (AFM), Transmission Electron Microscopy (TEM), Secondary Electron Microscopy (SEM), and Auger Electron Spectroscopy (AES) analysis. The barrier failure is dominated by “micro-defects” in the barrier film that serve as easy pathways for Cu diffusion. An ideal barrier system should be free of such micro-defects (e.g., amorphous Ti-Si-N and annealed Ta). The median-time-to-failure (MTTF) of a Ta barrier (30 nm) has been measured at different bias electrical fields and stressing temperatures, and the extrapolated MTTF of such a barrier is > 100 year at an operating condition of 200C and 0.1 MV/cm.

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