scholarly journals Lead Selenide Polycrystalline Coatings Sensitized Using Diffusion and Ion Beam Methods for Uncooled Mid-Infrared Photodetection

Coatings ◽  
2018 ◽  
Vol 8 (12) ◽  
pp. 444 ◽  
Author(s):  
Hao Yang ◽  
Xiaojiang Li ◽  
Guodong Wang ◽  
Jianbang Zheng
Keyword(s):  
High Speed ◽  
Large Scale ◽  
Low Cost ◽  
Ion Beam ◽  
Lead Selenide ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Recombination Suppression ◽  
Mid Infrared ◽  
Physical Effects

Polycrystalline lead selenide material that is processed after a sensitization technology offers the additional physical effects of carrier recombination suppression and carrier transport manipulation, making it sufficiently sensitive to mid-infrared radiation at room temperature. Low-cost and large-scale integration with existing electronic platforms such as complementary metal–oxide–semiconductor (CMOS) technology and multi-pixel readout electronics enable a photodetector based on polycrystalline lead selenide coating to work in high-speed, low-cost, and low-power consumption applications. It also shows huge potential to compound with other materials or structures, such as the metasurface for novel optoelectronic devices and more marvelous properties. Here, we provide an overview and evaluation of the preparations, physical effects, properties, and potential applications, as well as the optoelectronic enhancement mechanism, of lead selenide polycrystalline coatings.

Projected Performance of Sub-10 nm GaN-based Double Gate MOSFETs

2017 ◽  
Vol 2 (2) ◽  
pp. 15-19 ◽  
Author(s):  
Md. Saud Al Faisal ◽  
Md. Rokib Hasan ◽  
Marwan Hossain ◽  
Mohammad Saiful Islam
Keyword(s):  
High Speed ◽  
Field Effect Transistors ◽  
Cmos Technology ◽  
Channel Length ◽  
Capacitive Coupling ◽  
Oxide Semiconductor ◽  
Double Gate ◽  
Short Channel ◽  
Channel Effects ◽  
Silvaco Atlas

GaN-based double gate metal-oxide semiconductor field-effect transistors (DG-MOSFETs) in sub-10 nm regime have been designed for the next generation logic applications. To rigorously evaluate the device performance, non-equilibrium Green’s function formalism are performed using SILVACO ATLAS. The device is turn on at gate voltage, VGS =1 V while it is going to off at VGS = 0 V. The ON-state and OFF-state drain currents are found as 12 mA/μm and ~10-8 A/μm, respectively at the drain voltage, VDS = 0.75 V. The sub-threshold slope (SS) and drain induced barrier lowering (DIBL) are ~69 mV/decade and ~43 mV/V, which are very compatible with the CMOS technology. To improve the figure of merits of the proposed device, source to gate (S-G) and gate to drain (G-D) distances are varied which is mentioned as underlap. The lengths are maintained equal for both sides of the gate. The SS and DIBL are decreased with increasing the underlap length (LUN). Though the source to drain resistance is increased for enhancing the channel length, the underlap architectures exhibit better performance due to reduced capacitive coupling between the contacts (S-G and G-D) which minimize the short channel effects. Therefore, the proposed GaN-based DG-MOSFETs as one of the excellent promising candidates to substitute currently used MOSFETs for future high speed applications.

scholarly journals A low-area high-efficiency video coding inverse transform core using resource and time sharing architecture

2020 ◽  
Vol 2020 (1) ◽  
Author(s):  
Yuan-Ho Chen ◽  
Chieh-Yang Liu
Keyword(s):  
Video Coding ◽  
Large Scale ◽  
High Efficiency ◽  
Vlsi Design ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Time Sharing ◽  
High Efficiency Video Coding ◽  
Low Area ◽  
Matrix Products

AbstractIn this paper, a very-large-scale integration (VLSI) design that can support high-efficiency video coding inverse discrete cosine transform (IDCT) for multiple transform sizes is proposed. The proposed two-dimensional (2-D) IDCT is implemented at a low area by using a single one-dimensional (1-D) IDCT core with a transpose memory. The proposed 1-D IDCT core decomposes a 32-point transform into 16-, 8-, and 4-point matrix products according to the symmetric property of the transform coefficient. Moreover, we use the shift-and-add unit to share hardware resources between multiple transform dimension matrix products. The 1-D IDCT core can simultaneously calculate the first- and second-dimensional data. The results indicate that the proposed 2-D IDCT core has a throughput rate of 250 MP/s, with only 110 K gate counts when implemented into the Taiwan semiconductor manufacturing (TSMC) 90-nm complementary metal-oxide-semiconductor (CMOS) technology. The results show the proposed circuit has the smallest area supporting the multiple transform sizes.

scholarly journals Investigation of PVT-Aware STT-MRAM Sensing Circuits for Low-VDD Scenario

Micromachines ◽  
2021 ◽  
Vol 12 (5) ◽  
pp. 551
Author(s):  
Zhongjian Bian ◽  
Xiaofeng Hong ◽  
Yanan Guo ◽  
Lirida Naviner ◽  
Wei Ge ◽  
...  
Keyword(s):  
Nonvolatile Memory ◽  
High Speed ◽  
Low Voltage ◽  
Supply Voltage ◽  
Random Access ◽  
Magnetic Tunnel Junction ◽  
Complementary Metal Oxide Semiconductor ◽  
Current Mode ◽  
Cmos Technology ◽  
Oxide Semiconductor

Spintronic based embedded magnetic random access memory (eMRAM) is becoming a foundry validated solution for the next-generation nonvolatile memory applications. The hybrid complementary metal-oxide-semiconductor (CMOS)/magnetic tunnel junction (MTJ) integration has been selected as a proper candidate for energy harvesting, area-constraint and energy-efficiency Internet of Things (IoT) systems-on-chips. Multi-VDD (low supply voltage) techniques were adopted to minimize energy dissipation in MRAM, at the cost of reduced writing/sensing speed and margin. Meanwhile, yield can be severely affected due to variations in process parameters. In this work, we conduct a thorough analysis of MRAM sensing margin and yield. We propose a current-mode sensing amplifier (CSA) named 1D high-sensing 1D margin, high 1D speed and 1D stability (HMSS-SA) with reconfigured reference path and pre-charge transistor. Process-voltage-temperature (PVT) aware analysis is performed based on an MTJ compact model and an industrial 28 nm CMOS technology, explicitly considering low-voltage (0.7 V), low tunneling magnetoresistance (TMR) (50%) and high temperature (85 °C) scenario as the worst sensing case. A case study takes a brief look at sensing circuits, which is applied to in-memory bit-wise computing. Simulation results indicate that the proposed high-sensing margin, high speed and stability sensing-sensing amplifier (HMSS-SA) achieves remarkable performance up to 2.5 GHz sensing frequency. At 0.65 V supply voltage, it can achieve 1 GHz operation frequency with only 0.3% failure rate.

scholarly journals Growth of high-quality semiconducting tellurium films for high-performance p-channel field-effect transistors with wafer-scale uniformity

2022 ◽  
Vol 6 (1) ◽  
Author(s):  
Taikyu Kim ◽  
Cheol Hee Choi ◽  
Pilgyu Byeon ◽  
Miso Lee ◽  
Aeran Song ◽  
...  
Keyword(s):  
Field Effect ◽  
Physical Vapor Deposition ◽  
High Performance ◽  
Supply Voltage ◽  
Field Effect Transistors ◽  
Low Cost ◽  
Three Dimensional ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Wafer Scale

AbstractAchieving high-performance p-type semiconductors has been considered one of the most challenging tasks for three-dimensional vertically integrated nanoelectronics. Although many candidates have been presented to date, the facile and scalable realization of high-mobility p-channel field-effect transistors (FETs) is still elusive. Here, we report a high-performance p-channel tellurium (Te) FET fabricated through physical vapor deposition at room temperature. A growth route involving Te deposition by sputtering, oxidation and subsequent reduction to an elemental Te film through alumina encapsulation allows the resulting p-channel FET to exhibit a high field-effect mobility of 30.9 cm2 V−1 s−1 and an ION/OFF ratio of 5.8 × 105 with 4-inch wafer-scale integrity on a SiO2/Si substrate. Complementary metal-oxide semiconductor (CMOS) inverters using In-Ga-Zn-O and 4-nm-thick Te channels show a remarkably high gain of ~75.2 and great noise margins at small supply voltage of 3 V. We believe that this low-cost and high-performance Te layer can pave the way for future CMOS technology enabling monolithic three-dimensional integration.

scholarly journals Process Design Kit and Design Automation for Flexible Hybrid Electronics

2019 ◽  
Vol 16 (3) ◽  
pp. 117-123
Author(s):  
Tsung-Ching Huang ◽  
Ting Lei ◽  
Leilai Shao ◽  
Sridhar Sivapurapu ◽  
Madhavan Swaminathan ◽  
...  
Keyword(s):  
Process Design ◽  
Design Automation ◽  
High Performance ◽  
Large Scale ◽  
Low Cost ◽  
Thin Film Transistor ◽  
Solution Process ◽  
Oxide Semiconductor ◽  
Wearable Electronics ◽  
Wide Range

Abstract High-performance low-cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things and wearable electronics. Carbon nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE because of its high carrier mobility, superior mechanical flexibility, and material compatibility with low-cost printing and solution processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers, and sense amplifiers, can be printed and hybrid-integrated with thinned (<50 μm) silicon chips on soft, thin, and flexible substrates for a wide range of applications, from flexible displays to wearable medical devices. Here, we report (1) a process design kit (PDK) to enable FHE design automation for large-scale FHE circuits and (2) solution process-proven intellectual property blocks for TFT circuits design, including Pseudo-Complementary Metal-Oxide-Semiconductor (Pseudo-CMOS) flexible digital logic and analog amplifiers. The FHE-PDK is fully compatible with popular silicon design tools for design and simulation of hybrid-integrated flexible circuits.

The Effect of Strain on the Formation of Dislocations at the SiGe/Si Interface

MRS Bulletin ◽  
1996 ◽  
Vol 21 (4) ◽  
pp. 38-44 ◽  
Author(s):  
F.K. LeGoues
Keyword(s):  
Metal Oxide ◽  
High Speed ◽  
High Performance ◽  
Field Effect Transistors ◽  
Low Cost ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Design Rule ◽  
Strained Si

Recently much interest has been devoted to Si-based heteroepitaxy, and in particular, to the SiGe/Si system. This is mostly for economical reasons: Si-based technology is much more advanced, is widely available, and is cheaper than GaAs-based technology. SiGe opens the door to the exciting (and lucrative) area of Si-based high-performance devices, although optical applications are still limited to GaAs-based technology. Strained SiGe layers form the base of heterojunction bipolar transistors (HBTs), which are currently used in commercial high-speed analogue applications. They promise to be low-cost compared to their GaAs counterparts and give comparable performance in the 2-20-GHz regime. More recently we have started to investigate the use of relaxed SiGe layers, which opens the door to a wider range of application and to the use of SiGe in complementary metal oxide semiconductor (CMOS) devices, which comprise strained Si and SiGe layers. Some recent successes include record-breaking low-temperature electron mobility in modulation-doped layers where the mobility was found to be up to 50 times better than standard Si-based metal-oxide-semiconductor field-effect transistors (MOSFETs). Even more recently, SiGe-basedp-type MOSFETS were built with oscillation frequency of up to 50 GHz, which is a new record, in anyp-type material for the same design rule.

Ultrasensitive broadband photodetectors based on two-dimensional Bi2O2Te films

2021 ◽  
Author(s):  
Pin Tian ◽  
Hongbo Wu ◽  
Libin Tang ◽  
Jinzhong Xiang ◽  
Rongbin Ji ◽  
...  
Keyword(s):  
Large Scale ◽  
2D Materials ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Photocurrent Density ◽  
Short Wave ◽  
Oxide Semiconductor ◽  
Light Illumination ◽  
Two Dimensional ◽  
Weak Light

Abstract Two-dimensional (2D) materials exhibit many unique optical and electronic properties that are highly desirable for application in optoelectronics. Here, we report the study of photodetector based on 2D Bi2O2Te grown on n-Si substrate. The 2D Bi2O2Te material was transformed from sputtered Bi2Te3 ultrathin film after rapid annealing at 400 ℃ for 10 min in air atmosphere. The photodetector was capable of detecting a broad wavelength from 210 nm to 2.4 μm with excellent responsivity of up to 3x105 and 2x104 AW-1, and detectivity of 4x1015 and 2x1014 Jones at deep ultraviolet (UV) and short-wave infrared (SWIR) under weak light illumination, respectively. The effectiveness of 2D materials in weak light detection was investigated by analysis of the photocurrent density contribution. Importantly, the facile growth process with low annealing temperature would allow direct large-scale integration of the 2D Bi2O2Te materials with complementary metal-oxide–semiconductor (CMOS) technology.

scholarly journals Neuromorphic Spiking Neural Networks and Their Memristor-CMOS Hardware Implementations

Materials ◽  
2019 ◽  
Vol 12 (17) ◽  
pp. 2745 ◽  
Author(s):  
Luis Camuñas-Mesa ◽  
Bernabé Linares-Barranco ◽  
Teresa Serrano-Gotarredona
Keyword(s):  
Neural Networks ◽  
Learning Strategies ◽  
Large Scale ◽  
Sensory Information ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Hardware Implementations ◽  
Learning Capabilities ◽  
Promising Solution

Inspired by biology, neuromorphic systems have been trying to emulate the human brain for decades, taking advantage of its massive parallelism and sparse information coding. Recently, several large-scale hardware projects have demonstrated the outstanding capabilities of this paradigm for applications related to sensory information processing. These systems allow for the implementation of massive neural networks with millions of neurons and billions of synapses. However, the realization of learning strategies in these systems consumes an important proportion of resources in terms of area and power. The recent development of nanoscale memristors that can be integrated with Complementary Metal–Oxide–Semiconductor (CMOS) technology opens a very promising solution to emulate the behavior of biological synapses. Therefore, hybrid memristor-CMOS approaches have been proposed to implement large-scale neural networks with learning capabilities, offering a scalable and lower-cost alternative to existing CMOS systems.

Large-scale drop test on perlite–metal syntactic foam

2018 ◽  
Vol 53 (4) ◽  
pp. 515-520 ◽  
Author(s):  
T Fiedler ◽  
M Taherishargh
Keyword(s):  
High Speed ◽  
Large Scale ◽  
Low Cost ◽  
Syntactic Foam ◽  
Drop Test ◽  
Passenger Vehicle ◽  
High Speed Imaging ◽  
Cellular Metal ◽  
Energy Absorbing ◽  
Impact Mass

Perlite–metal syntactic foam is a low-cost cellular metal intended for use in automotive impact protection. To test the viability of the material a 2.5 ton drop test was conducted. Impact mass and energy were selected to replicate the conditions of a frontal impact between a large passenger vehicle and a crash cushion. A hollow syntactic foam cylinder was manufactured to decelerate the drop weight in a controlled manner. Accelerometers and high-speed imaging were utilized to evaluate the performance of the energy absorbing element.

A Low-Cost Highly Reliable Spintronic True Random Number Generator Circuit for Secure Cryptography

SPIN ◽  
2019 ◽  
Vol 10 (01) ◽  
pp. 2050003 ◽  
Author(s):  
Iman Alibeigi ◽  
Abdolah Amirany ◽  
Ramin Rajaei ◽  
Mahmoud Tabandeh ◽  
Saeed Bagheri Shouraki
Keyword(s):  
High Speed ◽  
High Performance ◽  
Random Number ◽  
Low Cost ◽  
Random Number Generator ◽  
Magnetic Tunnel Junction ◽  
Random Number Generation ◽  
Cmos Technology ◽  
Random Numbers ◽  
Number Generation

Generation of random numbers is one of the most important steps in cryptographic algorithms. High endurance, high performance and low energy consumption are the attractive features offered by the Magnetic Tunnel Junction (MTJ) devices. Therefore, they have been considered as one of the promising candidates for next-generation digital integrated circuits. In this paper, a new circuit design for true random number generation using MTJs is proposed. Our proposed circuit offers a high speed, low power and a truly random number generation. In our design, we employed two MTJs that are configured in special states. Generated random bit at the output of the proposed circuit is returned to the write circuit to be written in the relevant cell for the next random generation. In a random bitstream, all bits must have the same chance of being “0”or “1”. We have proposed a new XOR-based method in this paper to resolve this issue in multiple random generators that produce truly random numbers with a different number of ones and zeros in the output stream. The simulation results using a 45[Formula: see text]nm CMOS technology with a special model of MTJ validated the advantages offered by the proposed circuit.

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