scholarly journals A Simple and Robust Fabrication Process for SU-8 In-Plane MEMS Structures

Micromachines ◽  
2020 ◽  
Vol 11 (3) ◽  
pp. 317
Author(s):  
Chang Ge ◽  
Edmond Cretu

In this paper, a simple fabrication process for SU-8 in-plane micro electro-mechanical systems (MEMS) structures, called “border-bulk micromachining”, is introduced. It aims to enhance the potential of SU-8 MEMS structures for applications such as low-cost/disposable microsystems and wearable MEMS. The fabrication process is robust and uses only four processing steps to fabricate SU-8 in-plane MEMS structures, simplifying the fabrication flow in comparison with other reported attempts. The whole fabrication process has been implemented on copper-polyimide composites. A new processing method enables the direct, laser-based micromachining of polyimide in a practical way, bringing in extra processing safety and simplicity. After forming the polymeric in-plane MEMS structures through SU-8 lithography, a copper wet etching masked by the SU-8 structure layers is carried out. After the wet etching, fabricated in-plane MEMS structures are suspended within an open window on the substrate, similar to the final status of in-plane MEMS devices made from industrial silicon micromachining methods (such as SOIMUMPS). The last step of the fabrication flow is a magnetron sputtering of aluminum. The border-bulk micromachining process has been experimentally evaluated through the fabrication and the characterization of simple in-plane electrically actuated MEMS test structures. The characterization results of these simple test structures have verified the following process qualities: controllability, reproducibility, predictability and general robustness.

2014 ◽  
Vol 68 (5) ◽  
pp. 629-641 ◽  
Author(s):  
Tatjana Djakov ◽  
Ivanka Popovic ◽  
Ljubinka Rajakovic

Micro-electro-mechanical systems (MEMS) are miniturized devices that can sense the environment, process and analyze information, and respond with a variety of mechanical and electrical actuators. MEMS consists of mechanical elements, sensors, actuators, electrical and electronics devices on a common silicon substrate. Micro-electro-mechanical systems are becoming a vital technology for modern society. Some of the advantages of MEMS devices are: very small size, very low power consumption, low cost, easy to integrate into systems or modify, small thermal constant, high resistance to vibration, shock and radiation, batch fabricated in large arrays, improved thermal expansion tolerance. MEMS technology is increasingly penetrating into our lives and improving quality of life, similar to what we experienced in the microelectronics revolution. Commercial opportunities for MEMS are rapidly growing in broad application areas, including biomedical, telecommunication, security, entertainment, aerospace, and more in both the consumer and industrial sectors on a global scale. As a breakthrough technology, MEMS is building synergy between previously unrelated fields such as biology and microelectronics. Many new MEMS and nanotechnology applications will emerge, expanding beyond that which is currently identified or known. MEMS are definitely technology for 21st century.


Author(s):  
Anis Nurashikin Nordin

Today’s high-tech consumer market demand complex, portable personal wireless consumer devices that are low-cost and have small sizes. Creative methods of combining mature integrated circuit (IC) fabrication techniques with innovative radio-frequency micro-electro-mechanical systems (RF-MEMS) devices has given birth to wireless transceiver components, which operate at higher frequencies but are manufactured at the low-cost of standard ICs. Oscillators, RF bandpass filters, and low noise amplifiers are the most critical and important modules of any wireless transceiver. Their individual characteristics determine the overall performance of a transceiver. This chapter illustrates RF-oscillators that utilize MEMS devices such as resonators, varactors, and inductors for frequency generation. Emphasis will be given on state of the art RF-MEMS components such as film bulk acoustic wave, surface acoustic wave, flexural mode resonators, lateral and vertical varactors, and solenoid and planar inductors. The advantages and disadvantages of each device structure are described, with reference to the most recent work published in the field.


2016 ◽  
Vol 857 ◽  
pp. 578-582 ◽  
Author(s):  
Q. Humayun ◽  
Uda Hashim ◽  
Che Mohd Ruzaidi

To perform the entire laboratory activities on a centimeter limit scale electronic chip, the most important aspect is to fabricate a device which persist sensitive and selective for the delivery of fluids flow and have the ability to execute a fast mixing of distinctive chemicals and bio samples. To resolve this issues the current paper is one of the good struggle, therefore the objective was arranged in according to the scope of research such as; to design and fabricate a polydimethylsiloxane (PDMS) material made, micro channel and its structure characterization for the investigation of internal subterranean area. By using an AutoCAD software the channel was first designed, however for the fabrication process the design was transferred to mask. Starting from SU-8 resist the pattern was transferred, and then by using the polydimethylsiloxane (PDMS) the mold was fabricated by adopting a low cost photolithography technique. Finally by employing Hawk 3 D surface nanoprofiler the structure was characterized. In our forthcoming research the device will be tested for real biological samples using a simple hand-operated inoculation technique.


2000 ◽  
Vol 638 ◽  
Author(s):  
Jan W. De Blauwe ◽  
Marty L. Green ◽  
Tom W. Sorsch ◽  
Garry R. Weber ◽  
Jeff D. Bude ◽  
...  

AbstractThis paper describes the fabrication, and structural and electrical characterization of a new, aerosol-nanocrystal floating-gate FET, aimed at non-volatile memory (NVM) applications. This aerosol- nanocrystal NVM device features program/erase characteristics comparable to conventional stacked gate NVM devices, excellent endurance (>105 P/E cycles), and long-term non-volatility in spite of a thin bottom oxide (55-60Å). In addition, a very simple fabrication process makes this aerosol-nanocrystal NVM device a potential candidate for low cost NVM applications.


Membranes ◽  
2020 ◽  
Vol 10 (11) ◽  
pp. 361 ◽  
Author(s):  
Mario Versaci ◽  
Paolo di Barba ◽  
Francesco Carlo Morabito

The evolution of engineering applications is increasingly shifting towards the embedded nature, resulting in low-cost solutions, micro/nano dimensional and actuators being exploited as fundamental components to connect the physical nature of information with the abstract one, which is represented in the logical form in a machine. In this context, the scientific community has gained interest in modeling membrane Micro-Electro-Mechanical-Systems (MEMS), leading to a wide diffusion on an industrial level owing to their ease of modeling and realization. Physically, once the external voltage is applied, an electrostatic field, orthogonal to the tangent line of the membrane, is established inside the device, producing an electrostatic pressure that acts on the membrane, deforming it. Evidently, the greater the amplitude of the electrostatic field is, the greater the curvature of the membrane. Thus, it seems natural to consider the amplitude of the electrostatic field proportional to the curvature of the membrane. Starting with this principle, the authors are actively involved in developing a second-order semi-linear elliptic model in 1D and 2D geometries, obtaining important results regarding the existence, uniqueness and stability of solutions as well as evaluating the particular operating conditions of use of membrane MEMS devices. In this context, the idea of providing a survey matures to discussing the similarities and differences between the analytical and numerical results in detail, thereby supporting the choice of certain membrane MEMS devices according to the industrial application. Finally, some original results about the stability of the membrane in 2D geometry are presented and discussed.


2012 ◽  
Vol 503 ◽  
pp. 122-127 ◽  
Author(s):  
Xing Hua Wang ◽  
Zhi Hua Chen ◽  
Ding Bang Xiao ◽  
Xue Zhong Wu

Due to many inherently problems of accelerometers on market, such as complex fabrication process and low precision, a monolithic three-axis accelerometer is proposed and fabricated. The 3-axis accelerometer consists of four individual seismic mass, each has a wafer-thick of 240μm and is fabricated by anisotropic wet etching technology. In this paper, the design, fabrication, and characterization of the 3-axis accelerometer are presented. The performance is characterized and demonstrated.


2013 ◽  
Vol 5 (3) ◽  
pp. 197-204 ◽  
Author(s):  
Riccardo Moro ◽  
Sangkil Kim ◽  
Maurizio Bozzi ◽  
Manos Tentzeris

This paper presents a novel technology for the implementation of substrate-integrated waveguide (SIW) structures, based on a paper substrate and realized by an inkjet-printing fabrication process. The use of paper permits to implement low-cost microwave structures and components, by adopting a completely eco-friendly implementation technology. SIW structures appear particularly suitable for implementation on paper, due to the possibility to easily realize multilayered topologies and conformal geometries. In this paper, SIW passive components, and antennas (including straight interconnects, band-pass filters, and slotted-waveguide antennas) are proposed for the first time. The design of the components, the steps of the fabrication process, and the experimental characterization of the prototypes are reported in this paper.


2006 ◽  
Vol 12 (10-11) ◽  
pp. 1053-1061 ◽  
Author(s):  
Eleonora Ferraris ◽  
Irene Fassi ◽  
Biagio De Masi ◽  
Richard Rosing ◽  
Andrew Richardson

TecnoLógicas ◽  
2017 ◽  
Vol 20 (39) ◽  
pp. 141-155 ◽  
Author(s):  
Artur Zarzycki ◽  
Wiktor L. Gambin ◽  
Sylwester Bargiel ◽  
Christophe Gorecki

This paper presents the working principle, design, and fabrication of a silicon-based scanning micromirror with a new type of action mechanism as an example of MEMS (Micro-Electro-Mechanical Systems). Micromirrors can be found in barcode readers as well as micro-projectors, optical coherence tomography, or spectrometers’ adjustable filters. The fabrication process of the device prompted us to describe and discuss the problems related to the manufacture of MEMS. The article starts with some terminology and a brief introduction to the field of microsystems. Afterwards, the concept of a new scanning micromirror is explained. The device is operated by two pairs of thermal bimorphs. A special design enables to maintain a constant distance from the center of the mirror to the light source during the scanning process. The device was implemented in a one degree-of-freedom micromirror and a two degree-of-freedom micromirror. The fabrication process of both types is described. For each case, a different type of substrate was used. The first type of substrate was a standard silicon wafer; the second one, SOI (Silicon-On-Insulator). The process with the first one was complicated and caused many problems. Replacing this substrate with SOI solved some of the issues, but did not prevent new ones from arising. Nevertheless, the SOI substrate produces much better results and it is preferable to manufacture this type of MEMS devices.


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