scholarly journals Stretchable Carbon and Silver Inks for Wearable Applications

Nanomaterials ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 1200
Author(s):  
Andrew Claypole ◽  
James Claypole ◽  
Liam Kilduff ◽  
David Gethin ◽  
Tim Claypole
Keyword(s):  
Low Cost ◽  
Thermoplastic Polyurethane ◽  
Mechanical Strain ◽  
Electrical Performance ◽  
Electrical Network ◽  
Conductive Ink ◽  
Graphite Nanoplatelets ◽  
Nominal Strain ◽  
Silver Flakes ◽  
Consistent Performance

For wearable electronic devices to be fully integrated into garments, without restricting or impeding movement, requires flexible and stretchable inks and coatings, which must have consistent performance and recover from mechanical strain. Combining Carbon Black (CB) and ammonia plasma functionalized Graphite Nanoplatelets (GNPs) in a Thermoplastic Polyurethane (TPU) resin created a conductive ink that could stretch to substrate failure (>300% nominal strain) and cyclic strains of up to 100% while maintaining an electrical network. This highly stretchable, conductive screen-printable ink was developed using relatively low-cost carbon materials and scalable processes making it a candidate for future wearable developments. The electromechanical performance of the carbon ink for wearable technology is compared to a screen-printable silver as a control. After initial plastic deformation and the alignment of the nano carbons in the matrix, the electrical performance was consistent under cycling to 100% nominal strain. Although the GNP flakes are pulled further apart a consistent, but less conductive path remains through the CB/TPU matrix. In contrast to the nano carbon ink, a more conductive ink made using silver flakes lost conductivity at 166% nominal strain falling short of the substrate failure strain. This was attributed to the failure of direct contact between the silver flakes.

scholarly journals The effect of plasma functionalization on the print performance and time stability of graphite nanoplatelet electrically conducting inks

2020 ◽  
Author(s):  
Andrew Claypole ◽  
James Claypole ◽  
Tim Claypole ◽  
David Gethin ◽  
Liam Kilduff
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Electrical Performance ◽  
Graphite Nanoplatelets ◽  
Interparticle Interactions ◽  
Electrically Conducting ◽  
Wide Range ◽  
Oscillatory Rheology ◽  
The Stability ◽  
Plasma Functionalization

Abstract Carbon-based pastes and inks are used extensively in a wide range of printed electronics because of their widespread availability, electrical conductivity and low cost. Overcoming the inherent tendency of the nano-carbon to agglomerate to form a stable dispersion is necessary if these inks are to be taken from the lab scale to industrial production. Plasma functionalization of graphite nanoplatelets (GNP) adds functional groups to their surface to improve their interaction with the polymer resin. This offers an attractive method to overcome these problems when creating next generation inks. Both dynamic and oscillatory rheology were used to evaluate the stability of inks made with different loadings of functionalized and unfunctionalized GNP in a thin resin, typical of a production ink. The rheology and the printability tests showed the same level of dispersion and electrical performance had been achieved with both functionalized and unfunctionalized GNPs. The unfunctionalized GNPs agglomerate to form larger, lower aspect particles, reducing interparticle interactions and particle–medium interactions. Over a 12-week period, the viscosity, shear thinning behavior and viscoelastic properties of the unfunctionalized GNP inks fell, with decreases in viscosity at 1.17 s−1 of 24, 30, 39% for the ϕ = 0.071, 0.098, 0.127 GNP suspensions, respectively. However, the rheological properties of the functionalized GNP suspensions remained stable as the GNPs interacted better with the polymer in the resin to create a steric barrier which prevented the GNPs from approaching close enough for van der Waals forces to be effective.

Preparation and application of water-based nano-silver conductive ink in paper-based 3D printing

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Chenfei Zhao ◽  
Jun Wang ◽  
Lini Lu
Keyword(s):  
Flexible Electronics ◽  
Low Cost ◽  
Methyl Cellulose ◽  
Conductive Ink ◽  
Content Type ◽  
Nano Silver ◽  
Printed Circuit ◽  
Silver Ink ◽  
Sintering Time ◽  
Water Based

Purpose In flexible electronics applications, organic inks are mostly used for inkjet printing. Three-dimensional (3 D) printing technology has the advantages of low cost, high speed and good precision in modern electronic printing. The purpose of this study is to solve the high cost of traditional printing and the pollution emissions of organic ink. It is necessary to develop a water-based conductive ink that is easily degradable and can be 3 D printed. A nano-silver ink printed circuit pattern with high precision, high conductivity and good mechanical properties is a promising strategy. Design/methodology/approach The researched nano-silver conductive ink is mainly composed of silver nanoparticles and resin. The effect of adding methyl cellulose on the ink was also explored. A simple 3 D circuit pattern was printed on photographic paper. The line width, line length, line thickness and conductivity of the printed circuit were tested. The influence of sintering temperature and sintering time on pattern resistivity was studied. The relationship between circuit pattern bending performance and electrical conductivity is analyzed. Findings The experimental results show that the ink has the characteristics of low silver content and good environmental protection effect. The printing feasibility of 3 D printing circuit patterns on paper substrates was confirmed. The best printing temperature is 160°C–180°C, and the best sintering time is 30 min. The circuit pattern can be folded 120°, and the cycle is folded more than 60 times. The minimum resistivity of the circuit pattern is 6.07 µΩ·cm. Methyl cellulose can control the viscosity of the ink. The mechanical properties of the pattern have been improved. The printing method of 3 D printing can significantly reduce the sintering time and temperature of the conductive ink. These findings may provide innovation for the flexible electronics industry and pave the way for alternatives to cost-effective solutions. Originality/value In this study, direct ink writing technology was used to print circuit patterns on paper substrates. This process is simple and convenient and can control the thickness of the ink layer. The ink material is nonpolluting to the environment. Nano-silver ink has suitable viscosity and pH value. It can meet the requirements of pneumatic 3 D printers. The method has the characteristics of simple process, fast forming, low cost and high environmental friendliness.

Fabrication of low cost and scalable carbon-based conductive ink for E-textile applications

2019 ◽  
Vol 19 ◽  
pp. 32-38 ◽  
Author(s):  
Rashedul Islam ◽  
Nipa Khair ◽  
Dewan Murshed Ahmed ◽  
Hasan Shahariar
Keyword(s):  
Low Cost ◽  
Conductive Ink ◽  
Carbon Based

PLA conductive filament for 3D printed smart sensing applications

2018 ◽  
Vol 24 (4) ◽  
pp. 739-743 ◽  
Author(s):  
Simone Luigi Marasso ◽  
Matteo Cocuzza ◽  
Valentina Bertana ◽  
Francesco Perrucci ◽  
Alessio Tommasi ◽  
...  
Keyword(s):  
Temperature Sensor ◽  
Low Cost ◽  
Conductive Polymer ◽  
Temperature Characteristic ◽  
Temperature Sensors ◽  
Electrical Performance ◽  
Content Type ◽  
Sensing Applications ◽  
3D Printed

Purpose This paper aims to present a study on a commercial conductive polylactic acid (PLA) filament and its potential application in a three-dimensional (3D) printed smart cap embedding a resistive temperature sensor made of this material. The final aim of this study is to add a fundamental block to the electrical characterization of printed conductive polymers, which are promising to mimic the electrical performance of metals and semiconductors. The studied PLA filament demonstrates not only to be suitable for a simple 3D printed concept but also to show peculiar characteristics that can be exploited to fabricate freeform low-cost temperature sensors. Design/methodology/approach The first part is focused on the conductive properties of the PLA filament and its temperature dependency. After obtaining a resistance temperature characteristic of this material, the same was used to fabricate a part of a 3D printed smart cap. Findings An approach to the characterization of the 3D printed conductive polymer has been presented. The major results are related to the definition of resistance vs temperature characteristic of the material. This model was then exploited to design a temperature sensor embedded in a 3D printed smart cap. Practical implications This study demonstrates that commercial conductive PLA filaments can be suitable materials for 3D printed low-cost temperature sensors or constitutive parts of a 3D printed smart object. Originality/value The paper clearly demonstrates that a new generation of 3D printed smart objects can already be obtained using low-cost commercial materials.

Tensile properties of the FFF-processed thermoplastic polyurethane (TPU) elastomer

2021 ◽  
Author(s):  
Budi Arifvianto ◽  
Teguh Nur Iman ◽  
Benidiktus Tulung Prayoga ◽  
Rini Dharmastiti ◽  
Urip Agus Salim ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Low Cost ◽  
Thermoplastic Polyurethane ◽  
High Strength ◽  
Tensile Tests ◽  
Uniaxial Tensile ◽  
Fused Filament Fabrication ◽  
Raster Angle ◽  
Manufacturing Techniques

Abstract Fused filament fabrication (FFF) has become one of the most popular, practical, and low-cost additive manufacturing techniques for fabricating geometrically-complex thermoplastic polyurethane (TPU) elastomer. However, there are still some uncertainties concerning the relationship between several operating parameters applied in this technique and the mechanical properties of the processed material. In this research, the influences of extruder temperature and raster orientation on the mechanical properties of the FFF-processed TPU elastomer were studied. A series of uniaxial tensile tests was carried out to determine tensile strength, strain, and elastic modulus of TPU elastomer that had been printed with various extruder temperatures, i.e., 190–230 °C, and raster angles, i.e., 0–90°. Thermal and chemical characterizations were also conducted to support the analysis in this research. The results obviously showed the ductile and elastic characteristics of the FFF-processed TPU, with specific tensile strength and strain that could reach up to 39 MPa and 600%, respectively. The failure mechanisms operating on the FFF-processed TPU and the result of stress analysis by using the developed Mohr’s circle are also discussed in this paper. In conclusion, the extrusion temperature of 200 °C and raster angle of 0° could be preferred to be applied in the FFF process to achieve high strength and ductile TPU elastomer.

A TXV-less Packaging Platform for the Era of IoTs

2015 ◽  
Vol 2015 (1) ◽  
pp. 1-5 ◽  
Author(s):  
Dyi-Chung Hu ◽  
Yu-Min Lin ◽  
Hsiang Hung Chang ◽  
Tao-Chih Chang ◽  
Wei-Chung Lo ◽  
...  
Keyword(s):  
Low Cost ◽  
High Density ◽  
The Other ◽  
Electrical Performance ◽  
Test Vehicle ◽  
Technology Infrastructure ◽  
Fine Line ◽  
Large Panel ◽  
Line Technology ◽  
Test Chips

A new concept of packaging platform calls eHDF (embedded high density film), that without any TXVs is been proposed. The eHDF uses the technology from two categories; one utilize the semiconductor fine line technology infrastructure and the other takes the advantage of laminate organic large panel process infrastructure. Hence, the fine line, better electrical performance and low cost requirements can be addressed at the same time by the eHDF packaging platform. In this paper, a test vehicle based on eHDF structure will be built and modules assembly with test chips on eHDF substrate will be performed.

Effect of Mechanical Strain on Electrical Performance of Flexible P-Type SnO Thin-Film Transistors

2019 ◽  
Vol 66 (12) ◽  
pp. 5183-5186
Author(s):  
Shu-Ming Hsu ◽  
Jyun-Ci He ◽  
Yun-Shiuan Li ◽  
Dung-Yue Su ◽  
Feng-Yu Tsai ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Film Transistors ◽  
Mechanical Strain ◽  
Electrical Performance ◽  
P Type

scholarly journals Design, Manufacturing, and Characterization of High-Performance Lightweight Bipolar Plates Based on Carbon Nanotube-Exfoliated Graphite Nanoplatelet Hybrid Nanocomposites

2012 ◽  
Vol 2012 ◽  
pp. 1-8 ◽  
Author(s):  
Myungsoo Kim ◽  
Gu-Hyeok Kang ◽  
Hyung Wook Park ◽  
Young-Bin Park ◽  
Yeon Ho Park ◽  
...  
Keyword(s):  
High Performance ◽  
Processing Parameters ◽  
Hybrid Nanocomposites ◽  
Exfoliated Graphite ◽  
Electrical Performance ◽  
Dominant Factor ◽  
Graphite Nanoplatelets ◽  
Bipolar Plates ◽  
Alternative Material

We report a study on manufacturing and characterization of a platform material for high-performance lightweight bipolar plates for fuel cells based on nanocomposites consisting of carbon nanotubes (CNTs) and exfoliated graphite nanoplatelets (xGnPs). The experiments were designed and performed in three steps. In the preexperimental stage, xGnP-epoxy composite samples were prepared at various xGnP weight percentages to determine the maximum processable nanofiller concentration. The main part of the experiment employed the statistics-based design of experiments (DOE) methodology to identify improved processing conditions and CNT : xGnP ratio for minimized electrical resistivity. In the postexperimental stage, optimized combinations of material and processing parameters were investigated. With the aid of a reactive diluent, 20 wt.% was determined to the be maximum processable carbon nanomaterial content in the epoxy. The DOE analyses revealed that the CNT : xGnP ratio is the most dominant factor that governs the electrical properties, and its implications in relation to CNT-xGnP interactions and microstructure are elucidated. In addition, samples fabricated near the optimized condition revealed that there exists an optimal CNT : xGnP ratio at which the electrical performance can be maximized. The electrical and mechanical properties of optimal samples suggest that CNT-xGnP hybrid nanocomposites can serve as an alternative material platform for affordable, lightweight bipolar plates.

scholarly journals Ball-Milled Recycled Lead-Graphite Pencils as Highly Stretchable and Low-Cost Thermal-Interface Materials

Polymers ◽  
2018 ◽  
Vol 10 (7) ◽  
pp. 799 ◽  
Author(s):  
Chun-An Liao ◽  
Yee-Kwan Kwan ◽  
Tien-Chan Chang ◽  
Yiin-Kuen Fuh
Keyword(s):  
Low Cost ◽  
Exfoliated Graphite ◽  
Thermal Interface Materials ◽  
Graphite Nanoplatelets ◽  
Thermal Interface ◽  
Thermally Conductive ◽  
Highly Stretchable ◽  
Exfoliated Graphite Nanoplatelets ◽  
Interface Materials ◽  
Thermal Conductivities

A simple and sustainable production of nanoplatelet graphite at low cost is presented using carbon-based materials, including the recycled lead-graphite pencils. In this work, exfoliated graphite nanoplatelets (EGNs), ball-milled exfoliated graphite nanoplatelets (BMEGNs) and recycled lead-graphite pencils (recycled 2B), as well as thermally cured polydimethylsiloxane (PDMS), are used to fabricate highly stretchable thermal-interface materials (TIMs) with good thermally conductive and mechanically robust properties. Several characterization techniques including scanning electron microscopy (SEM) and thermogravimetric analysis (TGA) showed that recycled nanoplatelet graphite with lateral size of tens of micrometers can be reliably produced. Experimentally, the thermal conductivity was measured for EGNs, BMEGNs and recycled 2B fillers with/without the effect of ball milling. The in-plane thermal conductivities of 12.97 W/mK (EGN), 13.53 W/mK (recycled 2B) and 14.56 W/mK (BMEGN) and through-plane thermal conductivities of 0.76 W/mK (EGN), 0.84 W/mK (recycled 2B) and 0.95 W/mK (BMEGN) were experimentally measured. Anisotropies were calculated as 15.31, 15.98 and 16.95 for EGN, recycled 2B and BMEGN, respectively. In addition, the mechanical robustness of the developed TIMs is such that they are capable of repeatedly bending at 180 degrees with outstanding flexibility, including the low-cost renewable material of recycled lead-graphite pencils. For heat dissipating application in high-power electronics, the TIMs of recycled 2B are capable of effectively reducing temperatures to approximately 6.2 °C as favorably compared with thermal grease alone.

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