scholarly journals Microstrip Array Ring FETs with 2D p-Ga2O3 Channels Grown by MOCVD

Photonics ◽  
2021 ◽  
Vol 8 (12) ◽  
pp. 578
Author(s):  
Manijeh Razeghi ◽  
Junhee Lee ◽  
Lakshay Gautam ◽  
Jean-Pierre Leburton ◽  
Ferechteh H. Teherani ◽  
...  
Keyword(s):  
Field Effect Transistors ◽  
Chemical Vapor ◽  
Drain Current ◽  
Significant Advance ◽  
Growth Time ◽  
Organic Chemical ◽  
Transmission Electron ◽  
Metal Organic ◽  
P Type ◽  
Type Conduction

Gallium oxide (Ga2O3) thin films of various thicknesses were grown on sapphire (0001) substrates by metal organic chemical vapor deposition (MOCVD) using trimethylgallium (TMGa), high purity deionized water, and silane (SiH4) as gallium, oxygen, and silicon precursors, respectively. N2 was used as carrier gas. Hall measurements revealed that films grown with a lower VI/III ratio had a dominant p-type conduction with room temperature mobilities up to 7 cm2/Vs and carrier concentrations up to ~1020 cm−3 for thinner layers. High resolution transmission electron microscopy suggested that the layers were mainly κ phase. Microstrip field-effect transistors (FETs) were fabricated using 2D p-type Ga2O3:Si, channels. They achieved a maximum drain current of 2.19 mA and an on/off ratio as high as ~108. A phenomenological model for the p-type conduction was also presented. As the first demonstration of a p-type Ga2O3, this work represents a significant advance which is state of the art, which would allow the fabrication of p-n junction based devices which could be smaller/thinner and bring both cost (more devices/wafer and less growth time) and operating speed (due to miniaturization) advantages. Moreover, the first scaling down to 2D device channels opens the prospect of faster devices and improved heat evacuation.

scholarly journals Fabrication and Characterization of GaN Junctionfield Effect Transistors

2000 ◽  
Vol 5 (S1) ◽  
pp. 376-383
Author(s):  
L. Zhang ◽  
L. F. Lester ◽  
A. G. Baca ◽  
R. J. Shul ◽  
P. C. Chang ◽  
...  
Keyword(s):  
Elevated Temperatures ◽  
Field Effect Transistors ◽  
Chemical Vapor ◽  
Drain Current ◽  
Organic Chemical ◽  
Microwave Measurement ◽  
Theoretical Predictions ◽  
Metal Organic ◽  
Current Reduction ◽  
Increasing Temperature

Junction field effect transistors (JFET) were fabricated on a GaN epitaxial structure grown by metal organic chemical vapor deposition. The DC and microwave characteristics, as well as the high temperature performance of the devices were studied. These devices exhibited excellent pinch-off and a breakdown voltage that agreed with theoretical predictions. An extrinsic transconductance (gm) of 48 mS/mm was obtained with a maximum drain current (ID) of 270 mA/mm. The microwave measurement showed an fT of 6 GHz and an fmax of 12 GHz. Both the ID and the gm were found to decrease with increasing temperature, possibly due to lower electron mobility at elevated temperatures. These JFETs exhibited a significant current reduction after a high drain bias was applied, which was attributed to a partially depleted channel caused by trapped electrons in the semi-insulating GaN buffer layer.

scholarly journals Fabrication and Characterization of GaN Junctionfield Effect Transistors

1999 ◽  
Vol 595 ◽  
Author(s):  
L. Zhang ◽  
L. F. Lester ◽  
A. G. Baca ◽  
R. J. Shul ◽  
P. C. Chang ◽  
...  
Keyword(s):  
Elevated Temperatures ◽  
Field Effect Transistors ◽  
Chemical Vapor ◽  
Drain Current ◽  
Organic Chemical ◽  
Microwave Measurement ◽  
Theoretical Predictions ◽  
Metal Organic ◽  
Current Reduction ◽  
Increasing Temperature

AbstractJunction field effect transistors (JFET) were fabricated on a GaN epitaxial structure grown by metal organic chemical vapor deposition. The DC and microwave characteristics, as well as the high temperature performance of the devices were studied. These devices exhibited excellent pinch-off and a breakdown voltage that agreed with theoretical predictions. An extrinsic transconductance (gm) of 48 mS/mm was obtained with a maximum drain current (ID) of 270 mA/mm. The microwave measurement showed an fr of 6 GHz and an fmax of 12 GHz. Both the ID and the gm were found to decrease with increasing temperature, possibly due to lower electron mobility at elevated temperatures. These JFETs exhibited a significant current reduction after a high drain bias was applied, which was attributed to a partially depleted channel caused by trapped electrons in the semi-insulating GaN buffer layer.

Structural and electronic properties of defects in semiconductors

1995 ◽  
Vol 53 ◽  
pp. 4-5
Author(s):  
J.L. Batstone
Keyword(s):  
Semiconductor Device ◽  
Chemical Vapor ◽  
Misfit Strain ◽  
Organic Chemical ◽  
Extended Defects ◽  
Transmission Electron ◽  
Semiconductor Thin Films ◽  
Wide Range ◽  
Metal Organic ◽  
Film Substrate

The development of growth techniques such as metal organic chemical vapor deposition (MOCVD) and molecular beam epitaxy during the last fifteen years has resulted in the growth of high quality epitaxial semiconductor thin films for the semiconductor device industry. The III-V and II-VI semiconductors exhibit a wide range of fundamental band gap energies, enabling the fabrication of sophisticated optoelectronic devices such as lasers and electroluminescent displays. However, the radiative efficiency of such devices is strongly affected by the presence of optically and electrically active defects within the epitaxial layer; thus an understanding of factors influencing the defect densities is required.Extended defects such as dislocations, twins, stacking faults and grain boundaries can occur during epitaxial growth to relieve the misfit strain that builds up. Such defects can nucleate either at surfaces or thin film/substrate interfaces and the growth and nucleation events can be determined by in situ transmission electron microscopy (TEM).

Surface Morphology of AlN Nucleation Layer Grown on Si by MOCVD

2015 ◽  
Vol 1120-1121 ◽  
pp. 391-395 ◽  
Author(s):  
Shu Fan ◽  
Le Yu ◽  
Xiao Long He ◽  
Ping Han ◽  
Cai Chuan Wu ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Growth Time ◽  
Organic Chemical ◽  
Nucleation Layer ◽  
Coverage Ratio ◽  
3 Dimensional ◽  
Aln Film ◽  
Metal Organic ◽  
Dimensional Growth ◽  
Organic Chemical Vapor Deposition

The AlN nucleation layer (NL) has been deposited on Si (111) substrate by metal-organic chemical vapor deposition (MOCVD). The result indicates that the growth mode of the AlN NL is in the form of 2-dimensional plane and 3-dimensional island. The proportion of 3-dimensional region increases gradually and the 2-dimensional region reduces correspondingly with the increase of growth time. The decrease of the coverage ratio of AlN grains in the 2-dimensional growth region is due to the effect of etching. AlN film with the single crystal orientation has been deposited on the optimized AlN NL.

Microstructural Characterization of GaN Grown on SiC

2019 ◽  
Vol 25 (6) ◽  
pp. 1383-1393
Author(s):  
Sabyasachi Saha ◽  
Deepak Kumar ◽  
Chandan K. Sharma ◽  
Vikash K. Singh ◽  
Samartha Channagiri ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Raman Spectroscopy ◽  
Surface Morphology ◽  
Chemical Vapor ◽  
Microstructural Characterization ◽  
Organic Chemical ◽  
Nucleation Layer ◽  
Transmission Electron ◽  
Vapor Deposition Technique ◽  
Metal Organic

AbstractGaN films have been grown on SiC substrates with an AlN nucleation layer by using a metal organic chemical vapor deposition technique. Micro-cracking of the GaN films has been observed in some of the grown samples. In order to investigate the micro-cracking and microstructure, the samples have been studied using various characterization techniques such as optical microscopy, atomic force microscopy, Raman spectroscopy, scanning electron microscopy and transmission electron microscopy (TEM). The surface morphology of the AlN nucleation layer is related to the stress evolution in subsequent overgrown GaN epilayers. It is determined via TEM evidence that, if the AlN nucleation layer has a rough surface morphology, this leads to tensile stresses in the GaN films, which finally results in cracking. Raman spectroscopy results also suggest this, by showing the existence of considerable tensile residual stress in the AlN nucleation layer. Based on these various observations and results, conclusions or propositions relating to the microstructure are presented.

scholarly journals O-Band Emitting InAs Quantum Dots Grown by MOCVD on a 300 mm Ge-Buffered Si (001) Substrate

Nanomaterials ◽  
2020 ◽  
Vol 10 (12) ◽  
pp. 2450
Author(s):  
Oumaima Abouzaid ◽  
Hussein Mehdi ◽  
Mickael Martin ◽  
Jérémy Moeyaert ◽  
Bassem Salem ◽  
...  
Keyword(s):  
Quantum Dots ◽  
Chemical Vapor ◽  
Lattice Parameter ◽  
Organic Chemical ◽  
Silicon Substrates ◽  
Wafer Level ◽  
Si Substrate ◽  
Si Substrates ◽  
Transmission Electron ◽  
Metal Organic

The epitaxy of III-V semiconductors on silicon substrates remains challenging because of lattice parameter and material polarity differences. In this work, we report on the Metal Organic Chemical Vapor Deposition (MOCVD) and characterization of InAs/GaAs Quantum Dots (QDs) epitaxially grown on quasi-nominal 300 mm Ge/Si(001) and GaAs(001) substrates. QD properties were studied by Atomic Force Microscopy (AFM) and Photoluminescence (PL) spectroscopy. A wafer level µPL mapping of the entire 300 mm Ge/Si substrate shows the homogeneity of the three-stacked InAs QDs emitting at 1.30 ± 0.04 µm at room temperature. The correlation between PL spectroscopy and numerical modeling revealed, in accordance with transmission electron microscopy images, that buried QDs had a truncated pyramidal shape with base sides and heights around 29 and 4 nm, respectively. InAs QDs on Ge/Si substrate had the same shape as QDs on GaAs substrates, with a slightly increased size and reduced luminescence intensity. Our results suggest that 1.3 μm emitting InAs QDs quantum dots can be successfully grown on CMOS compatible Ge/Si substrates.

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