scholarly journals Impact of Fluid Flow on CMOS-MEMS Resonators Oriented to Gas Sensing

Sensors ◽  
2020 ◽  
Vol 20 (17) ◽  
pp. 4663
Author(s):  
Rafel Perello-Roig ◽  
Jaume Verd ◽  
Sebastià Bota ◽  
Jaume Segura

Based on experimental data, this paper thoroughly investigates the impact of a gas fluid flow on the behavior of a MEMS resonator specifically oriented to gas sensing. It is demonstrated that the gas stream action itself modifies the device resonance frequency in a way that depends on the resonator clamp shape with a corresponding non-negligible impact on the gravimetric sensor resolution. Results indicate that such an effect must be accounted when designing MEMS resonators with potential applications in the detection of volatile organic compounds (VOCs). In addition, the impact of thermal perturbations was also investigated. Two types of four-anchored CMOS-MEMS plate resonators were designed and fabricated: one with straight anchors, while the other was sustained through folded flexure clamps. The mechanical structures were monolithically integrated together with an embedded readout amplifier to operate as a self-sustained fully integrated oscillator on a commercial CMOS technology, featuring low-cost batch production and easy integration. The folded flexure anchor resonator provided a flow impact reduction of 5× compared to the straight anchor resonator, while the temperature sensitivity was enhanced to −115 ppm/°C, an outstanding result compared to the −2403 ppm/°C measured for the straight anchored structure.

Micromachines ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 82
Author(s):  
Rafel Perelló-Roig ◽  
Jaume Verd ◽  
Sebastià Bota ◽  
Jaume Segura

CMOS-MEMS resonators have become a promising solution thanks to their miniaturization and on-chip integration capabilities. However, using a CMOS technology to fabricate microelectromechanical system (MEMS) devices limits the electromechanical performance otherwise achieved by specific technologies, requiring a challenging readout circuitry. This paper presents a transimpedance amplifier (TIA) fabricated using a commercial 0.35-µm CMOS technology specifically oriented to drive and sense monolithically integrated CMOS-MEMS resonators up to 50 MHz with a tunable transimpedance gain ranging from 112 dB to 121 dB. The output voltage noise is as low as 225 nV/Hz1/2—input-referred current noise of 192 fA/Hz1/2—at 10 MHz, and the power consumption is kept below 1-mW. In addition, the TIA amplifier exhibits an open-loop gain independent of the parasitic input capacitance—mostly associated with the MEMS layout—representing an advantage in MEMS testing compared to other alternatives such as Pierce oscillator schemes. The work presented includes the characterization of three types of MEMS resonators that have been fabricated and experimentally characterized both in open-loop and self-sustained configurations using the integrated TIA amplifier. The experimental characterization includes an accurate extraction of the electromechanical parameters for the three fabricated structures that enables an accurate MEMS-CMOS circuitry co-design.


Proceedings ◽  
2019 ◽  
Vol 2 (13) ◽  
pp. 751
Author(s):  
Bart Vereecke ◽  
Els Van Besien ◽  
Deniz Sabuncuoglu Tezcan ◽  
Nick Spooren ◽  
Nicolaas Tack ◽  
...  

Recent developments in multispectral cameras have demonstrated how compact and low-cost spectral sensors can be made by monolithically integrating filters on top of commercially available image sensors. In this paper, the fabrication of a RGB + NIR variation to such a single-chip imaging system is described, including the integration of a metallic shield to minimize crosstalk, and two interference filters: a NIR blocking filter, and a NIR bandpass filter. This is then combined with standard polymer based RGB colour filters. Fabrication of this chip is done in imec’s 200 mm cleanroom using standard CMOS technology, except for the addition of RGB colour filters and microlenses, which is outsourced.


2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Daniel Popa ◽  
Richard Hopper ◽  
Syed Zeeshan Ali ◽  
Matthew Thomas Cole ◽  
Ye Fan ◽  
...  

AbstractThe gas sensor market is growing fast, driven by many socioeconomic and industrial factors. Mid-infrared (MIR) gas sensors offer excellent performance for an increasing number of sensing applications in healthcare, smart homes, and the automotive sector. Having access to low-cost, miniaturized, energy efficient light sources is of critical importance for the monolithic integration of MIR sensors. Here, we present an on-chip broadband thermal MIR source fabricated by combining a complementary metal oxide semiconductor (CMOS) micro-hotplate with a dielectric-encapsulated carbon nanotube (CNT) blackbody layer. The micro-hotplate was used during fabrication as a micro-reactor to facilitate high temperature (>700 $$^{\circ }$$ ∘ C) growth of the CNT layer and also for post-growth thermal annealing. We demonstrate, for the first time, stable extended operation in air of devices with a dielectric-encapsulated CNT layer at heater temperatures above 600 $$^{\circ }$$ ∘ C. The demonstrated devices exhibit almost unitary emissivity across the entire MIR spectrum, offering an ideal solution for low-cost, highly-integrated MIR spectroscopy for the Internet of Things.


2021 ◽  
Author(s):  
Daniel Popa ◽  
Richard Hopper ◽  
Syed Zeeshan Ali ◽  
Matthew Cole ◽  
Ye Fan ◽  
...  

Abstract The gas sensor market is growing fast, driven by many socioeconomic and industrial factors. Mid-infrared (MIR) gas sensors offer excellent performance for an increasing number of sensing applications in healthcare, smart homes, and the automotive sector. Having access to low-cost, miniaturized, energy efficient light sources is of critical importance for the monolithic integration of MIR sensors. Here, we present an on-chip broadband thermal MIR source fabricated by combining a complementary metal oxide semiconductor (CMOS) micro-hotplate with a dielectric-encapsulated carbon nanotube (CNT) blackbody layer. The micro-hotplate was used during fabrication as a micro-reactor to facilitate high temperature (>700 • C) growth of the CNT layer and also for post-growth thermal annealing. We demonstrate, for the first time, stable extended operation in air of devices with a dielectric-encapsulated CNT layer at heater temperatures above 600 • C. The demonstrated devices exhibit almost unitary emissivity across the entire MIR spectrum, offering an ideal solution for low-cost, highly-integrated MIR spectroscopy for the Internet of Sensors.


2021 ◽  
Author(s):  
◽  
Morgan G. Blevins

Global temperature rise and increased atmospheric carbon dioxide (CO2) levels have affected the health of the world’s ocean and water ecosystems, impacting the balances of natural carbon cycling and causing ocean acidification. Additionally, as global temperatures rise, thawing permafrost has stimulated increased release of methane (CH4), a gas with a shorter lifetime in the atmosphere but with even more heat trapping ability than CO2. In situ analysis of dissolved gas content in surface waters is currently performed with large, expensive instruments, such as spectrometers, which are coupled with gas equilibration systems, which extract dissolved gas from water and feed it to the sensor. Accurate, low cost, and portable sensors are needed to measure the dissolved CH4 and CO2 concentration in water systems to quantify their release and understand their relationship to the global carbon budget. At the same time, while greenhouse gases are well established threats to water ecosystems, the ubiquity and potential consequences of microplastics in aqueous environments are just beginning to be recognized by the environmental research community. Microplastics (MPs) are small particles of polymer debris, commonly defined as being between 1 μm and 1000 μm. Despite the pervasiveness of MPs, our ability to characterize MPs in the environment is limited by the lack of technologies for rapidly and accurately identifying and quantifying MPs. This thesis is concerned with the engineering challenges prompted by the need for high quality and quantity environmental data to better study and the impact, cycling, and prevalence of these pollutants in aqueous environments. Three distinct investigations are presented here. First, the design of the Low-Cost Gas Extraction and Measurement System (LC-GEMS) for dissolved CO2 is presented. At just under $600 dollar to build, the LC-GEMS is an ultra-portable, toolbox-sized instrument for dissolved gas sensing in near-surface waters. The LCGEMS was characterized in the lab and demonstrated linear relationships with dissolved CO2 as well as temperature. Lab calibrations and subsequent field testing in the Little Sippewissett Marsh, in Falmouth, Massachusetts showed that the LCGEMS captures both diurnal and minute-time scale trends in dissolved CO2. Second, this thesis presents the novel design of three simple and low-cost planar nanophotonic and plasmonic structures as optical transducers for measuring dissolved CH4. Through simulations, the sensitivity of the structures are evaluated and found to exhibit superior performance in the reflectance intensity readout mode to that of the standard surface-plasmon-polariton-mode Spreeta sensor. A practical, small, and low-cost implementation of this chip with a simple intensity-based measurement scheme is proposed. This design is novel in the space of dissolved gas monitoring because it shows potential to measure directly in the water phase while being robust and low-cost to implement. Finally, this thesis presents a literature review and perspective to motivate the development of field-deployable microplastic sensing techniques. A framework for field-deployable microplastic sensing is presented and seeks to inform the MP community of the potential in both traditional MP analysis techniques and unconventional methods for creating rapid and automated MP sensors. The field-deployabilty framework addresses a full scope of practical/technological trade-offs to be considered for portable MP detection.


Electronics ◽  
2021 ◽  
Vol 10 (11) ◽  
pp. 1256
Author(s):  
Seyedehsomayeh Hatefinasab ◽  
Noel Rodriguez ◽  
Antonio García ◽  
Encarnacion Castillo

In this paper, a Soft Error Hardened D-latch with improved performance is proposed, also featuring Single Event Upset (SEU) and Single Event Transient (SET) immunity. This novel D-latch can tolerate particles as charge injection in different internal nodes, as well as the input and output nodes. The performance of the new circuit has been assessed through different key parameters, such as power consumption, delay, Power-Delay Product (PDP) at various frequencies, voltage, temperature, and process variations. A set of simulations has been set up to benchmark the new proposed D-latch in comparison to previous D-latches, such as the Static D-latch, TPDICE-based D-latch, LSEH-1 and DICE D-latches. A comparison between these simulations proves that the proposed D-latch not only has a better immunity, but also features lower power consumption, delay, PDP, and area footprint. Moreover, the impact of temperature and process variations, such as aspect ratio (W/L) and threshold voltage transistor variability, on the proposed D-latch with regard to previous D-latches is investigated. Specifically, the delay and PDP of the proposed D-latch improves by 60.3% and 3.67%, respectively, when compared to the reference Static D-latch. Furthermore, the standard deviation of the threshold voltage transistor variability impact on the delay improved by 3.2%, while its impact on the power consumption improves by 9.1%. Finally, it is shown that the standard deviation of the (W/L) transistor variability on the power consumption is improved by 56.2%.


Micromachines ◽  
2018 ◽  
Vol 9 (11) ◽  
pp. 579 ◽  
Author(s):  
Martín Riverola ◽  
Francesc Torres ◽  
Arantxa Uranga ◽  
Núria Barniol

In this paper, a seesaw torsional relay monolithically integrated in a standard 0.35 μm complementary metal oxide semiconductor (CMOS) technology is presented. The seesaw relay is fabricated using the Back-End-Of-Line (BEOL) layers available, specifically using the tungsten VIA3 layer of a 0.35 μm CMOS technology. Three different contact materials are studied to discriminate which is the most adequate as a mechanical relay. The robustness of the relay is proved, and its main characteristics as a relay for the three different contact interfaces are provided. The seesaw relay is capable of a double hysteretic switching cycle, providing compactness for mechanical logic processing. The low contact resistance achieved with the TiN/W mechanical contact with high cycling life time is competitive in comparison with the state-of-the art.


Sensors ◽  
2018 ◽  
Vol 18 (9) ◽  
pp. 3124 ◽  
Author(s):  
Rafel Perelló-Roig ◽  
Jaume Verd ◽  
Sebastià Bota ◽  
Jaume Segura

We analyzed experimentally the noise characteristics of fully integrated CMOS-MEMS resonators to determine the overall thermomechanical noise and its impact on the limit of detection at the system level. Measurements from four MEMS resonator geometries designed for ultrasensitive detection operating between 2-MHz and 8-MHz monolithically integrated with a low-noise CMOS capacitive readout circuit were analyzed and used to determine the resolution achieved in terms of displacement and capacitance variation. The CMOS-MEMS system provides unprecedented detection resolution of 11 yF·Hz−1/2 equivalent to a minimum detectable displacement (MDD) of 13 fm·Hz−1/2, enabling noise characterization that is experimentally demonstrated by thermomechanical noise detection and compared to theoretical model values.


2019 ◽  
Vol 277 ◽  
pp. 02017
Author(s):  
C Akin ◽  
R Samuel Devadoss ◽  
V Vandhana Devi

Every year the impact on natural environment is more due to consumption of natural resources for large infrastructure and construction projects. Even though by implementing modern construction techniques and low cost effective materials the volume of impact reduction is not efficient. India is a country which has enormous natural resources and it has been utilized for large infrastructure and construction projects which makes an environmental impact. This present paper focuses on planning and formulation of Environmental Management System (EMS) to reduce the environmental impact due to large infrastructure and construction projects. The planning of EMS is done based on the environmental impact checklist provided by Ministry of Environmental and Forest Climate change (MoEF&CC) under Government of India and the Formulation is done through PERT and CPM techniques which is to implement EMS in short duration to reduce environmental impact through large infrastructure and construction projects. Finally, the Planning and Formulation of EMS gives solution to reduce more volume of environmental impacts due to large infrastructure and construction projects.


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