Preparation and Property of SnXCuNiBi Solder Alloy

2010 ◽  
Vol 146-147 ◽  
pp. 485-490
Author(s):  
Hai Yan Chen ◽  
Xiao Hua Jie ◽  
Hai Yan Zhang ◽  
Yu Long Chen ◽  
Li Guo
Keyword(s):  
Melting Point ◽  
Solder Alloy ◽  
High Performance ◽  
Low Cost ◽  
Weld Interface ◽  
Lead Free ◽  
Joint Interface ◽  
Lead Free Solder ◽  
Free Solder ◽  
Main Component

Lead-free solder is meeting the requirement of environmental protection, but the property performance of existing lead-free solder is hardly comparable to those of lead solder. In this paper, 0.6% Bi was added into SnXCuNi solder alloy to produce lead-free solder at low cost and high performance. Microstructure, phase composition, melting point, wettability and characteristics of weld interface have been studied and analyzed. The results show that SnXCuNiBi solder alloy are mainly composed of βSn, SnX, Cu6Sn5 and SnBi. The addition of Bi reduces the melting point and improves the wettability of the solder. The main component of the joint interface of SnXCuNiBi/Cu system is Cu6Sn5, which has shown the capability to keep relatively high shear strength at the joint interface.

Physical and Mechanical Behaviors of SnCu-Based Lead-Free Solder Alloys with an Addition of Aluminium

2015 ◽  
Vol 815 ◽  
pp. 64-68 ◽  
Author(s):  
Nisrin Adli ◽  
Nurul Razliana Abdul Razak ◽  
Norainiza Saud
Keyword(s):  
Melting Point ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Mechanical Behaviors ◽  
Solder Alloys ◽  
Al Content ◽  
Homogenous Distribution ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of Al addition on the microstructure, melting point and microhardness of SnCu-Al lead-free solder alloys were investigated with two different compositions of Al which were 1 wt% and 5 wt%. These solder alloys were fabricated through powder metallurgy (PM) method. The results showed that the melting point and the microhardness value of the SnCu-Al lead-free solder alloy were increased as the Al content increased from 1 wt% to 5 wt%. The grain growth of SnCu-Al lead-free solder alloy also tends to be retarded due to the homogenous distribution of Al at the grain boundaries.

Next-Generation Copper, Nickel and Lead-Free Metallization Products for Next-Generation Devices and Applications

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 000611-000638
Author(s):  
Jonathan Prange ◽  
Yi Qin ◽  
Matthew Thorseth ◽  
Inho Lee ◽  
Masaaki Imanari ◽  
...  
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
Low Cost ◽  
Lead Free ◽  
Lead Free Solder ◽  
Next Generation ◽  
Copper Nickel ◽  
Microelectronic Devices ◽  
Architectural Features ◽  
Free Solder

Flip-chip interconnect and 3-D packaging applications must utilize reliable, high-performance metallization products in order to produce highly-efficient, low-cost microelectronic devices. As the market moves to shrinking device architectural features and increasingly difficult pattern layouts, more demand is placed on the plating performance of the copper, nickel and lead-free solder products used to create these interconnects. Additionally, the move from traditional C4 bumping processes with lead-free solder to capping processes utilizing copper pillars with lead-free solder requires metal interfaces that are highly compatible in order to avoid defects that could occur. In this paper, next-generation products developed for copper pillar, nickel barrier, and lead-free solder plating will be introduced that are capable of delivering high-performance and highly reliable metallic interconnects. The additive packages that were selected and optimized allowing for increased rate of electrodeposition, uniform height control with controllable pillar shape and smooth surface morphology will be discussed. Furthermore, compatibility will be shown for a lead-free solder cap electrodeposited onto copper pillar structures, both with and without nickel barrier layers, on large pore features (≥50 μm diameter) and micro pore features (≤20 μm diameter) for both bumping and capping applications.

Interfacial Reaction and Solderability of Zn20SnxCu Solder

2011 ◽  
Vol 337 ◽  
pp. 402-405
Author(s):  
Kuai Le Zhao ◽  
Yan Fu Yan ◽  
Yang Yang Sheng ◽  
Ning Du ◽  
Zhan Lei Liu
Keyword(s):  
High Temperature ◽  
Melting Point ◽  
Intermetallic Compound ◽  
Interfacial Reaction ◽  
Low Cost ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder

Zn20Sn solder with the melting point of 383.9°C and a low cost is considered as an ideal high-temperature lead-free solder. In the paper a new solder alloys were made by adding trace Cu into Zn20Sn alloy through alloying principle. Interfacial reaction and solderability of Zn20SnxCu (x=0 wt.%, 2 wt.%, 4 wt.% and 6 wt.%) solder on the copper substrate were investigated. Results showed that β’-CuZn, γ-Cu5Zn8 and ε-CuZn5 IMC layers were formed at the interface of Zn20SnxCu/Cu. The spreading areas of the Zn20SnxCu solders were reduced linearly with the increasing of the content of copper. The spreading aera of Zn20Sn solder was 52.88 mm2 while that of Zn20Sn6Cu was 50.82mm2 which was approximately 3.9% smaller than that of matrix solder. It is mainly related to the formation of ε-CuZn5 phase and the metal intermetallic compound between the solder and the substrate.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode

2011 ◽  
Author(s):  
Takahiro Kano ◽  
Ikuo Shohji ◽  
Tetsuyuki Tsuchida ◽  
Toshikazu Ookubo
Keyword(s):  
Reaction Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Lead Free ◽  
Joint Interface ◽  
Lead Free Solder ◽  
Solder Balls ◽  
Free Solder ◽  
Ball Joints ◽  
Electroless Ni

An electroless Ni/Pd/Au plated electrode is expected to be used as an electrode material for lead-free solder to improve joint reliability. The aim of this study is to investigate the effect of the thickness of the Pd layer on joint properties of the lead-free solder joint with the electroless Ni/Pd/Au plated electrode. Solder ball joints were fabricated with Sn-3Ag-0.5Cu (mass%) lead-free solder balls and electroless Ni/Pd/Au and Ni/Au plated electrodes. Ball shear force and microstructure of the joint were investigated. The (Cu,Ni)6Sn5 reaction layer formed in the joint interface in all specimens. The thickness of the reaction layer decreased with increasing the thickness of the Pd layer. In the joint with a Pd layer 0.36 μm thick, the remained Pd layer was observed in the joint interface. In the joint, impact shear force decreased compared with that of the joint without the remained Pd layer. On the contrary, when the thickness of the Pd layer was less than 0.36 μm, the Pd layer was not remained in the joint interface and impact shear force improved. Impact shear force of the joint with the electroless Ni/Pd/Au plated electrode was higher than that with the electroless Ni/Au one.

scholarly journals Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix

2020 ◽  
Author(s):  
Manoj Kumar Pal ◽  
Gréta Gergely ◽  
Dániel Koncz-Horváth ◽  
Zoltán Gácsi
Keyword(s):  
Silicon Carbide ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Solder Matrix ◽  
Microstructure Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sac305 Solder ◽  
Small Change ◽  
Free Solder

Abstract The Sn-3.0Ag-0.5Cu solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today’s electronic enterprise. In this study, the formation of intermetallic compounds (Cu6Sn5 and Ag3Sn) at the interface, average neighbour’s particle distance, and the morphological mosaic are examined by the addition of SiC and nickel-coated silicon carbide reinforcements within Sn-3.0Ag-0.5Cu solder. Results revealed that the addition of SiC and SiC(Ni) particles are associated with a small change to the average neighbor’s particle distance and a decrease of clustering rate to a certain limit of the Sn-3.0Ag-0.5Cu solder composites. Moreover, the development of the Cu6Sn5 and the structure of the Ag3Sn are improved with the addition of SiC and Ni coated SiC.

Study of a Low Cost Reballing of BGA Method with Lead-Free Solder Paste

2019 ◽  
Vol 14 (1) ◽  
pp. 651-657
Author(s):  
Talita Mazon ◽  
Guilherme E. Prevedel ◽  
Egont A. Schenkel ◽  
Marcio T. Biasoli
Keyword(s):  
Low Cost ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Free Solder

Evaluation of Emerging High Melting Point Lead-free Solder and Hybrid Sinter Paste as Attaching Material for Clip Bond Package

2020 ◽  
Vol 2020 (1) ◽  
pp. 000235-000241
Author(s):  
Fred Fuliang Le ◽  
Rinse van der Meulen ◽  
Yoon Kheong Leong ◽  
Manoj Balakrishnan ◽  
Zunyu Guan
Keyword(s):  
Melting Point ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reliability Testing ◽  
High Melting ◽  
High Melting Point ◽  
Basic Scheme ◽  
Free Solder ◽  
Lead Free Solders ◽  
High Lead

Abstract High melting point (HMP) lead-free solder, hybrid sinter and transient liquidus phase sinter (TLPS) are the emerging lead-free alternatives for the potential replacement of high-lead solder. Lead-free solder is perfectly compatible with existing high-lead soldering processes for clip bond packages. The benefit of hybrid sinter is that it has much higher thermal and electrical conductivity than lead-free or high-lead solder. In this study, ten materials (including lead-free solders, hybrid sinter paste and TLPS) were first evaluated via die shear test. With the initial material screening, two lead-free solders (solder 1 and 2), two hybrid Ag sinter pastes (sinter i and ii) and one TLPS proceeded to internal sample assembly. For the lead-free solders, a process optimization with the aid of vacuum reflow was made to reduce void rate. Due to the slow and unbalanced inter-diffusion of Ag-Cu sintering than Ag-Ag sintering, optimizations to enhance the hybrid Ag sintering include Ag finishing for the die metallization and Ag plating for the clip and bond area of the leadframe. In 0-hour package electrical test, solder 1 and sinter i passed and were sent for reliability testing while solder 2, sinter ii and TLPS failed due to intermetallic compound (IMC) cracking, material bleeding and die cracking, respectively. In the reliability testing, a basic scheme of thermal cycling (TC) 1000 cycles, intermittent operating life (IOL) 750 hrs and highly accelerated temperature and humidity stress test (HAST) 96 hrs was defined for the early feasibility study. 1 of 75 sinter i units failed by TC 1000 cycles due to separation between silver sinter structure and die bottom metallization. Solder 1 passed the basic scheme without defects, and next the material workability and clip bond strength need to be improved to the equivalent level of high-lead solders.

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