Cement-Bonded Chip Boards Using Hemp and Energy by-Products in Civil Engineering
2012 ◽
Vol 512-515
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pp. 2956-2960
Keyword(s):
X Ray
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The aim of the research presented in this article was studying the basic physico-mechanical parameters of cement-bonded chip boards with hemp used as filler and by-products of energy production applied when modifying the bonding component. Determining and evaluating the basic parameters of boards of modified composition allowed for assessment of the effect of adding or substituting the bonding component within the cement chip board matrix. The work focused on the flexural strength, modulus of elasticity and density. In terms of anomalies in the cement matrix, i.e. uncommon crystalline phases in cement composites, representative samples were selected for differentially thermal and X-ray diffraction analysis.