Safety P-Cycle Protection Mechanism for Smart Power Device

2013 ◽  
Vol 804 ◽  
pp. 228-232
Author(s):  
Bin Li ◽  
Ke Qing Xiong ◽  
Yi Sun ◽  
Bing Qi
Keyword(s):  
High Efficiency ◽  
Cooling System ◽  
Power Converter ◽  
Power Device ◽  
Water Cooling ◽  
Power Module ◽  
Smart Power ◽  
Protection Mechanism ◽  
Power Modules ◽  
P Cycle

Power converter with full closed loop water cooling system, works not only use water cooling characteristics of high efficiency, but also the electricity, and reducing the volume to prevent contamination. In this paper, we proposed a novel p-cycle safety protection approach that can provide rapid cycling radiating, and can restore the status of power device. For power cabinet composition, IGBT power modules and reactors is primarary radiating components, in which IGBT power modules that used for water cooling solution is modeled as the cooled automobile engine cooling system using cycling design principle. Besides, machine side and the network side of the power module is installed in separate cabinet to improve the tightness of the entire cabinet, in order to resist sandstorms.

Power Converter and Control Interface for a GEM Fuel Cell Vehicle

2005 ◽  
Author(s):  
Joshua Anzicek ◽  
Mark Thompson
Keyword(s):  
Control System ◽  
Fuel Cell ◽  
High Efficiency ◽  
Cooling System ◽  
Power Level ◽  
Power Converter ◽  
Fuel Cell Vehicle ◽  
Power Module ◽  
Load Range ◽  
And Control

In this paper, we discuss the design and performance of a low cost, fully integrated power conversion and control system for a modified Global Electric Motors (GEM) fuel cell hybrid vehicle. The need for a custom converter and control system has become apparent as the commercial DC-DC market seems to have a void in the ranges of power and voltage required for fuel cell vehicle applications. The system incorporates a custom designed DC-DC boost converter which steps up the nominal 26 VDC fuel cell stack voltage to interface with the 72 VDC vehicle battery bus at an input power level of 1.2 kW. Additionally, several embedded control functions are implemented to integrate a Ballard Nexa™ fuel cell power module into the GEM vehicle. Design equations supported by preliminary performance data indicates that the DC-DC power converter achieves a conversion efficiency approaching 98% for a single fuel cell power module operating at full output power (1.2kW). The high efficiency allows for a simple and flexible air-cooled design with minimal heat sink requirements and cooling system weight. The control system incorporates algorithms to perform battery charging and power ramp rate, as well as fuel cell voltage, and current limiting algorithms. The control system exhibits stable performance characteristics throughout the entire vehicle load range and battery state of charge range, while tracking vehicle transient conditions.

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

2021 ◽  
Author(s):  
Mitsuaki Kato ◽  
Takahiro Omori ◽  
Akihiro Goryu ◽  
Tomoya Fumikura ◽  
Kenji Hirohata
Keyword(s):  
Thermal Stress ◽  
Solder Joint ◽  
Power Output ◽  
Solder Joints ◽  
Vacancy Concentration ◽  
Inelastic Strain ◽  
Power Device ◽  
Power Module ◽  
Power Modules ◽  
Rate Of Increase

Abstract Power modules are being developed to increase power output. The larger current densities accompanying increased power output are expected to degrade solder joints in power modules by electromigration. In previous research, numerical analysis of solder for electromigration has mainly examined ball grid arrays in flip-chip packages in which many solder balls are bonded under the semiconductor device. However, in a power module, a single solder joint is uniformly bonded under the power device. Because of this difference in geometric shape, the effect of electromigration in the solder of power modules may be significantly different from that in the solder of flip chips packages. This report describes an electromigration analysis of solder joints for power modules using an electrical-thermal-stress coupled analysis. First, we validate our numerical implementation and show that it can reproduce the vacancy concentrations and hydrostatic stress almost the same as the analytical solutions. We then simulate a single solder joint to evaluate electromigration in a solder joint in a power module. Once inelastic strain appears, the rate of increase in vacancy concentration slows, while the inelastic strain continuously increases. This phenomenon demonstrates that elastic-plastic-creep analysis is crucial for electromigration analysis of solder joints in power modules. Next, the solder joint with a power device and a substrate as used in power modules was simulated. Plasticity-creep and longitudinal gradient generated by current crowding have a strong effect on significantly reducing the vacancy concentration at the anode edge over a long period of time.

Low Switching Energy 1200V Normally-Off SiC VJFET Power Modules

2011 ◽  
Vol 679-680 ◽  
pp. 583-586 ◽  
Author(s):  
David C. Sheridan ◽  
Andrew Ritenour ◽  
Volodymyr Bondarenko ◽  
Jeff B. Casady ◽  
Robin L. Kelley
Keyword(s):  
High Frequency ◽  
High Efficiency ◽  
Bridge Circuit ◽  
Schottky Diodes ◽  
Power Module ◽  
Enhancement Mode ◽  
Switching Losses ◽  
Power Modules ◽  
Standard Module ◽  
Gate Driver

This work presents the progress in developing an all SiC based power module for use in high frequency and high efficiency applications. Using parallel combinations of 1200V enhancement mode SiC VJFETs (36mm2) and Schottky diodes (23mm2), a total on-resistance of only 10mOhm (2.7m-cm2) was achieved at ID=100A in a commercially available standard module configured as a half-bridge circuit. Careful attention to module layout, gate driver design, and the addition of optimized snubbers resulted in excellent switching waveforms with low total switching losses of 1.25mJ when switching 100A at 150oC.

Design and Testing of a High Temperature Inverter

2016 ◽  
Vol 2016 (HiTEC) ◽  
pp. 000175-000179
Author(s):  
Shashank Krishnamurthy ◽  
Stephen Savulak ◽  
Yang Wang
Keyword(s):  
High Temperature ◽  
Cooling System ◽  
Wide Band ◽  
Power Converter ◽  
Power Module ◽  
Paper Test ◽  
Drive Power ◽  
Component Selection ◽  
Variable Voltage ◽  
Functional Components

Abstract The emergence of wide band gap devices has pushed the boundaries of power converter operations and high power density applications. It is desirable to operate a power inverter at high switching frequencies to reduce passive filter weight and at high temperature to reduce the cooling system requirement. The paper describes the design and test of a power electronic inverter that converts a fixed input DC voltage to a variable voltage variable frequency three phase output. The component selection and design were constrained such that the inverter can operate at an ambient temperature of 170°C. The design of the key functional components such as the gate drive, power module, controller and communication will be discussed in the paper. Test results for the inverter at high temperature will also be presented.

scholarly journals Study on Water Cooling Performance of IGBT Module in Wind Power Converter

2021 ◽  
Author(s):  
Fei Yang ◽  
Shengting Kuai ◽  
Zhe Wang
Keyword(s):  
Wind Power ◽  
Heat Dissipation ◽  
Cooling System ◽  
Simulation Models ◽  
Mathematic Model ◽  
Cooling Capacity ◽  
Power Converter ◽  
Thermal Design ◽  
Water Cooling ◽  
Outlet Channel

Thermal design of IGBT is the key technology on wind power converter design. This paper introduced a theoretical calculation method of IGBT power loss which is applicable in wind power converter engineering applications. Meantime, the corresponding mathematic model was established. Considering the divergence of application environments as well as the characteristics of water-cooling heat dissipation, simulation models of two different inlet and outlet position radiators were built in Ansys software. And then the cooling capacity of these two types of radiators was analyzed though simulation. According to the simulation results, the ipsilateral inlet and outlet channel mode radiator was selected. After the sample production of the water cooling plate is completed, the experimental platform is built and the sample was verified. Finally, the experiment results indicated the rationality and practicability of the thermal design and simulation, which provided critical references of IGBT water cooling system design. In this paper, the performance of water cooling radiators is studied, which also provides a reference for the design of other high power electronic products.

scholarly journals Improving the cooling system of ship equipment

2020 ◽  
Author(s):  
А.В. Фомин ◽  
Е.В. Фомин
Keyword(s):  
Power Plants ◽  
High Efficiency ◽  
Cooling System ◽  
Heat Removal ◽  
Normal Operation ◽  
Water Cooling ◽  
Cooling Systems ◽  
Start Up ◽  
Membrane Type ◽  
Water Cooling System

В статье представлены результаты исследования эффективности работы системы охлаждения корабельного оборудования и предложены конструктивные решения, позволяющие модернизировать данную систему. В настоящее время, для обеспечения нормальной работы корабельного оборудования, применяются системы охлаждения. В корабельных энергетических установках распространены системы водяного охлаждения из-за целого ряда преимуществ. К ним относится и высокая эффективность теплоотвода, и меньшее влияние внешней среды, а также более надежный пуск и возможность использования энергии отводимого тепла для других нужд. Одним из основных элементов в таких системах является расширительный бак гравитационного типа, обеспечивающий правильную циркуляцию дистиллированной воды во внутреннем контуре и расположенный в верхней точке системы. Однако практика испытаний и эксплуатации показала, что есть и серьезный недостаток в таком расположении бака – в случаи его перелива или разрыва может пострадать дорогостоящее оборудование, расположенное ниже. В связи с этим, определены направления по совершенствованию системы водяного охлаждения корабельного оборудования, которые связаны с применением расширительного бака мембранного типа и использования воздухоудаляющих клапанов. The article presents the results of a study of the efficiency of the cooling system of ship equipment and offers design solutions that allow to modernize this system. Currently, to ensure the normal operation of ship's equipment, cooling systems are used. Water cooling systems are common in ship power plants due to a number of advantages. These include high efficiency of heat removal, less influence of the external environment, as well as more reliable start-up and the ability to use the energy of the heat being withdrawn for other needs. One of the main elements in such systems is a gravity-type expansion tank that ensures proper circulation of distilled water in the internal circuit and is located at the top of the system. However, the practice of testing and operation has shown that there is a serious drawback in this arrangement of the tank – in cases of overflow or rupture, expensive equipment located below may suffer. In this regard, the directions for improving the water cooling system of ship equipment, which are associated with the use of an expansion tank of the membrane type and the use of air-removing valves, have been identified.

scholarly journals Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

2021 ◽  
Author(s):  
Raj Sahu ◽  
Emre Gurpinar ◽  
Burak Ozpineci
Keyword(s):  
Thermal Loading ◽  
Cooling System ◽  
Wide Bandgap ◽  
Heat Sinks ◽  
Power Module ◽  
Power Semiconductor ◽  
Power Modules ◽  
Significant Temperature ◽  
Thermal Imbalance ◽  
Heat Spreading

Abstract Power semiconductor die placement on substrates used in high-power modules is generally optimized to minimize electrical parasitic (e.g., stray inductance, common-mode capacitance), taking into account the minimum spacing between semiconductor dies for thermal decoupling. The layout assumes sufficient heat spreading and transfer from dies to the cooling structure. Insulated metal substrate-based power module designs may lead to asymmetrical thermal resistance across the dies, which may cause significant temperature differences among the devices. Such unintentional thermal asymmetries can lead to over sizing the cooling system design or under-using the semiconductor power processing capability. This article proposes a thermal imbalance mitigation method that uses evolutionary optimized liquid-cooled heat sinks to improve the thermal loading among devices.

Bonding strength of Cu/Cu joints using sintering process of micro-sized Cu particles for high-temperature application

2019 ◽  
Vol 2019 (HiTen) ◽  
pp. 000085-000090
Author(s):  
Hiroshi Nishikawa ◽  
Xiangdong Liu
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
High Efficiency ◽  
Reduction Process ◽  
Power Device ◽  
Sintering Process ◽  
Oxidation Reduction ◽  
Die Attach ◽  
Power Modules ◽  
Temperature Application

Abstract Recently the new SiC power device provides the possibility to develop the next-generation power conversion circuit with high efficiency and high power density. The SiC power device can operate with significant lower power loss and higher operating temperature, which contributes to miniaturization and higher performance of power modules. To assemble these power modules, the high temperature packaging technology such as die attach process is needed. As a die attach process, we have proposed a simple oxidation-reduction bonding (ORB) process to achieve good Cu-to-Cu joints using micro-sized Cu particles. In this study, the effect of the oxidation-reduction process on the surface morphology of Cu particles was evaluated by SEM observation, and the shear strength of the Cu-to-Cu joints was investigated. As a result, the bonding using micro-sized Cu particles was successfully achieved and the shear test results showed that the joints by ORB process had a shear strength of more than 20 MPa.

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