Estimation of Curing Profile's Parameters for Flip Chip Packaging Using DSC and TGA

2011 ◽  
Vol 467-469 ◽  
pp. 950-955
Author(s):  
Zainudin Kornain ◽  
A. Jalar ◽  
Rozaidi Rasid ◽  
C.S. Foong ◽  
T.L. Wong
Keyword(s):  
Weight Loss ◽  
Temperature Rise ◽  
Flip Chip ◽  
Cure Kinetics ◽  
Weight Loss Curve ◽  
Gravimetric Analysis ◽  
Curing Process ◽  
Fixed Temperature ◽  
Weight Percentage ◽  
Epoxy Material

This paper presents the method to estimate curing profile's parameters for curing process of Moisture Resistance Cyanate Ester (MRCE) based underfill used in Flip Chip Ceramic Ball Grid Array (FC-CBGA). The two steps curing profile was found to eliminate voids formation in underfill during curing process. The important parameters in two steps curing profile such as first fixed temperature and duration of second temperature rise were estimated by superimposed of cure initiation curve and weight percentage loss curve of underfill epoxy material. Differential Scanning Calorimeter (DSC) analysis was carried out to characterize the cure kinetics reaction of underfill epoxy and produced the cure initiation curve. Thermal Gravimetric Analysis (TGA) was performed to characterize the weight loss of underfill and produced the weight loss curve. It was estimated that the first fixed temperature and duration of second temperature rise for two steps curing profile were 100 oC and 60-80 minutes respectively. The simulation experiment was conducted to verify the profile and no voids formation observed along this curing process.

The Mechanical Properties of Poly(Methyl Methacrylate) (PMMA)/ZrO2 Nanocomposite Polymer Films

2018 ◽  
Vol 24 (8) ◽  
pp. 5614-5617 ◽  
Author(s):  
Anita Rajkumar Ghandhe ◽  
Basavaraja Sannakki
Keyword(s):  
Mechanical Properties ◽  
Weight Loss ◽  
Composite Film ◽  
Melting Temperature ◽  
Electron Irradiation ◽  
Thermo Gravimetric Analysis ◽  
Testing Machine ◽  
Composite Films ◽  
Gravimetric Analysis ◽  
Weight Percentage

The composite films of Polymethylmethacrylate (PMMA) with ZrO2 at different weight percentage have been used for measurement of Mechanical properties such as stress, strain, and Young’s modulus at room temperature using the Universal Testing Machine. The value of stress is increased linearly with strain up to the stress at break and afterwards shown discontinuity. The properties of stress and strain increased as weight percentage of ZrO2 increased with PMMA and at 60 weight percent the stress in increased linearly up to 2.18 MPa with strain. The tensile strength, load at break and stress at break of the composite film of PMMA with ZrO2 is increased as weight percentage increased. Further, the weight loss and melting temperature of the composite films for pristine and for irradiation by electron beam at dose rate of 100 kGy were measured using Thermo Gravimetric Analysis and Differential Scanning Calorimeter. The weight loss of the composite film after electron irradiation is higher than that of its pristine. It is observed from DSC that melting peak is occurred at temperature 397.52 °C for pristine and at 395.94 °C after electron irradiation. Hence change in melting temperature is found to be 1.58 °C. The prepared composite films are characterized by using FTIR over the range of 3500– 500 wavenumbers (cm−1).

The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging

2011 ◽  
Vol 462-463 ◽  
pp. 1194-1199
Author(s):  
Zainudin Kornain ◽  
Azman Jalar ◽  
Rozaidi Rashid ◽  
Shahrum Abdullah
Keyword(s):  
Thermal Expansion ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Process Time ◽  
Curing Process ◽  
Curing Time ◽  
Hold Temperature ◽  
Flip Chip Packaging ◽  
Time Cycle ◽  
The Impact

Underfilling is the vital process to reduce the impact of the thermal stress that results from the mismatch in the co-efficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. This paper reported the pattern of underfill’s hardness during curing process for large die Ceramic Flip Chip Ball Grid Array (FC-CBGA). A commercial amine based underfill epoxy was dispensed into HiCTE FC-CBGA and cured in curing oven under a new method of two-step curing profile. Nano-identation test was employed to investigate the hardness of underfill epoxy during curing steps. The result has shown the almost similar hardness of fillet area and centre of the package after cured which presented uniformity of curing states. The total curing time/cycle in production was potentially reduced due to no significant different of hardness after 60 min and 120 min during the period of second hold temperature.

Nanorods of Cobalt Oxide: Study on its Morphology with Varied Sonication Time

2013 ◽  
Vol 678 ◽  
pp. 203-206
Author(s):  
A. Alex John Thangapaul ◽  
V. Sherly Arpuda Kiruba ◽  
R. Nivea ◽  
T. Viji ◽  
K. Thiyagarajan ◽  
...  
Keyword(s):  
Cobalt Oxide ◽  
Materials Science ◽  
Metal Oxide Nanoparticles ◽  
Thermo Gravimetric Analysis ◽  
Cost Effective ◽  
Oxide Nanoparticles ◽  
Gravimetric Analysis ◽  
Sonication Time ◽  
Cobalt Oxide Nanoparticles ◽  
Weight Percentage

Nanomaterials research has become a major attraction in the field of advanced materials research in the area of Physics, Chemistry, and Materials Science. Biocompatible and chemically stable magnetic metal oxide nanoparticles have biomedical applications that includes drug delivery, cell and DNA separation, gene cloning, magnetic resonance imaging (MRI). This research is aimed at the fabrication of magnetic cobalt oxide nanoparticles using a safe, cost effective, and easy to handle technique that is capable of producing nanoparticles free of any contamination. Nanostructured Cobalt oxide powder was prepared by sonication method using ultrasonicator. Effect of sonication for different time intervals, on the morphology of cobalt oxide nanostructures was extensively studied. The morphology of the nanorods were very much affected by the sonication time, it was found that with an increase in sonication time, the length of the nanorods seem to considerably increase at the same time an agglomeration effect comes in to action and the rods form bundle like structures. These cobalt oxide nanorods were characterized using X-ray Diffraction characterization (XRD) and it revealed a cubic structure. Weight percentage of cobalt oxide was confirmed by thermo gravimetric analysis (TGA).

scholarly journals Cure Kinetics and Inverse Analysis of Epoxy-Amine Based Adhesive Used for Fastening Systems

Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 3853
Author(s):  
Bilen Emek Abali ◽  
Michele Zecchini ◽  
Gilda Daissè ◽  
Ivana Czabany ◽  
Wolfgang Gindl-Altmutter ◽  
...  
Keyword(s):  
Inverse Analysis ◽  
Building Materials ◽  
Cure Kinetics ◽  
Accurate Estimation ◽  
Curing Process ◽  
Degree Of Cure ◽  
Material Parameters ◽  
Epoxy Amine ◽  
Thermosetting Polymers ◽  
Material Equation

Thermosetting polymers are used in building materials, for example adhesives in fastening systems. They harden in environmental conditions with a daily temperature depending on the season and location. This curing process takes hours or even days effected by the relatively low ambient temperature necessary for a fast and complete curing. As material properties depend on the degree of cure, its accurate estimation is of paramount interest and the main objective in this work. Thus, we develop an approach for modeling the curing process for epoxy based thermosetting polymers. Specifically, we perform experiments and demonstrate an inverse analysis for determining parameters in the curing model. By using calorimetry measurements and implementing an inverse analysis algorithm by using open-source packages, we obtain 10 material parameters describing the curing process. We present the methodology for two commercial, epoxy based products, where a statistical analysis provides independence of material parameters leading to the conclusion that the material equation is adequately describing the material response.

Optimization of Curing Conditions and Nanofiller Incorporation for Production of High Performance Laminated Kevlar/Epoxy Nanocomposites

2018 ◽  
Author(s):  
Abdel-Hamid I. Mourad ◽  
Mouza S. Al Mansoori ◽  
Lamia A. Al Marzooqi ◽  
Farah A. Genena ◽  
Nizamudeen Cherupurakal
Keyword(s):  
Oil And Gas ◽  
Mechanical Performance ◽  
Thermo Gravimetric Analysis ◽  
Applied Pressure ◽  
Curing Temperature ◽  
Gravimetric Analysis ◽  
Epoxy Nanocomposites ◽  
Scanning Calorimetry ◽  
Curing Conditions ◽  
Weight Percentage

Kevlar composite materials are getting scientific interest in repairing of oil and gas pipelines in both offshore and onshore due to their unique properties. Curing is one of the major factor in deciding the final mechanical performance of laminated Kevlar/epoxy nanocomposites. The parameters such as curing time, temperature and applied pressure during the hot pressing will affect chemistry of crosslinking of the epoxy matrix and interaction of epoxy with the Kevlar fiber. The present study is carried out to evaluate the optimal curing conditions of the Kevlar/epoxy nanocomposites. Three different nanofillers (namely Multi walled Carbon nanotubes (MWCNT), Silicon Carbide (SiC) and Aluminum Oxide (Al2O3)) are incorporated in different weight percentage. Differential Scanning Calorimetry (DSC) and Thermo-Gravimetric Analysis (TGA) tests are carried out to determine the thermal stability and optimal curing conditions. Mechanical performance is investigated by conducting flexure, and drop weight tests. The results show that, the optimal curing temperature for maximizing the mechanical properties is at 170°C. Peeling off the Kevlar layers are observed for nanocomposite samples cured under 100°C. Mechanical strength of the composites is enhanced by optimizing the curing conditions and nanofiller contents.

One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing

2014 ◽  
Vol 2014 (1) ◽  
pp. 000262-000267
Author(s):  
Daniel J. Duffy ◽  
Lin Xin ◽  
Jean Liu ◽  
Bruno Tolla
Keyword(s):  
Flip Chip ◽  
Polymeric Materials ◽  
Cure Kinetics ◽  
Filler Loading ◽  
Single Step ◽  
Seamless Integration ◽  
Device Reliability ◽  
One Step ◽  
Traditional Processing

One step chip attach (OSCA) materials are dispensable polymeric materials for flip chip assembly, which are designed to flux metallic interconnections and subsequently turn into an underfill upon curing. OSCA materials enable a drastic simplification of the assembly process by combining the reflow (fluxing/soldering), defluxing and capillary underfilling steps used in traditional processing into a single step. One key challenge for the design of OSCA materials is timing the cure kinetics with fluxing activity and solder reflow during processing. A second key challenge is to factor a process-friendly rheological design into the formulation. The OSCA material rheology must allow for high filler loading levels, seamless integration with standard dispensing equipment, flow control during and after dispense (avoid keep out zones), flow during die placement (elimination of voids), after placement (fillet formation) and during reflow. The final key requirements for a functional device are defect-free interconnections combined with optimal thermo-mechanical and water resistant properties of the final underfill to guarantee the long-term reliability of the assembly in various environmental conditions. This paper presents the properties of materials designed by Kester for use in mass reflow processing (OSCA-R). The rheological design principles behind a seamless integration into customer-friendly processes will be presented In addition results illustrating the timing of cure kinetics with fluxing and soldering events during processing will be discussed. Preliminary device reliability results will also be presented for several types of test vehicles including; Si-Si and Si-FR4.

Curing Process and Heat-Resistance of Polyethersulfone Toughened Epoxy Resins

2017 ◽  
Vol 898 ◽  
pp. 2302-2308
Author(s):  
Jin Li Zhou ◽  
Shu Zhu ◽  
Wen Pin Jia ◽  
Chao Cheng ◽  
Elwathig A.M. Hassan ◽  
...  
Keyword(s):  
Heat Resistance ◽  
Epoxy Resin ◽  
Thermo Gravimetric Analysis ◽  
Exothermic Peak ◽  
Curing Temperature ◽  
Gravimetric Analysis ◽  
Curing Process ◽  
Thermo Gravimetric ◽  
Rich Phase ◽  
Curing Reaction

In order to improve the toughness of epoxy resin, hydroxyl-terminated polyethersulfone (PES) with various amounts (0 wt.%, 5 wt.%, 10 wt.%, 15 wt.%, 20 wt.%) were added to bisphenol A epoxy resin (DER331)/ curing agent DETDA (E100) systems, and the influence of PES contents on curing process and heat-resistance was studied. Non-isothermal DSC was used to determine the curing process of uncured DER331/E100/PES systems at heating rate of 2°C/min, 5°C/min, 7°C/min, 10°C/min and 15°C/min separately, and the apparent activation energy was calculated based on Kissinger method. The morphology of the etched cured DER331/E100/PES systems with different PES contents was observed by SEM. The heat-resistance of these systems was investigated by DSC and TGA. The results showed that with the increasing of PES content the curing exothermic peak, the heat of curing reaction, the initial and final curing temperature all decreased at the first and then increased, indicating that when the PES content was low (5 wt.%, 10 wt.%), PES can facilitate the curing process, while, when PES content up to 15 wt.%, PES can prevent or weaken the curing reaction. SEM results indicated that the phase structure changed drastically depending on the PES content. The systems with 5 wt.% and 10 wt.% PES were epoxy-rich phase, with 15 wt.% PES was co-continuity phase, and with 20 wt.% PES showed complete phase inversion (PES rich phase). The glass transition temperature and thermo gravimetric analysis demonstrated that the addition of PES can increase the heat resistance of cured DER331/E100/PES systems.

Temperature rise and weight loss characteristics of wheat straw under microwave heating

2014 ◽  
Vol 107 ◽  
pp. 59-66 ◽  
Author(s):  
Zhao Xiqiang ◽  
Wang Wenlong ◽  
Liu Hongzhen ◽  
Mao Yanpeng ◽  
Ma Chunyuan ◽  
...  
Keyword(s):  
Weight Loss ◽  
Wheat Straw ◽  
Microwave Heating ◽  
Temperature Rise

Characterization of Au and Pd nanoparticles by high-temperature TGA–MS

2006 ◽  
Vol 84 (7) ◽  
pp. 998-1005 ◽  
Author(s):  
Weijuan Jia ◽  
Jessica McLachlan ◽  
Jiayan Xu ◽  
Seyed M Tadayyon ◽  
Peter R Norton ◽  
...  
Keyword(s):  
Mass Spectrometry ◽  
Weight Loss ◽  
High Temperature ◽  
Photoelectron Spectroscopy ◽  
Single Phase ◽  
Noble Metal Nanoparticles ◽  
Phase Method ◽  
Gravimetric Analysis ◽  
Ionic Contaminants

Noble metal nanoparticles (NPs) prepared by a surfactant-free single-phase solution method have been proposed to contain fewer ionic contaminants than similar NPs prepared by a two-phase method. Reported herein is the possible contamination of Au and Pd NPs, prepared by a surfactant-free single-phase method, with Li2CO3 and other Li salts. High-temperature thermal gravimetric analysis measurements coupled with mass spectrometry (TGA–MS) up to 1100 °C were employed to determine the relative amounts of ionic contaminants since protecting thiolate groups and inorganic contaminants were removed in separate weight loss events. Assignment of the different weight loss events was supported by MS analysis of the evolved gases. TGA–MS also revealed the presence of larger amounts of oxidized sulfur species in the Pd NPs. High-resolution transmission electron microscopy (HRTEM), UV–vis, IR, elemental analysis (EA), and X-ray photoelectron spectroscopy (XPS) measurements complemented the characterization of the NPs. The amount of ionic contaminants crucially depended on the workup conditions, and quenching of the reaction mixture with ethanol was found to be essential for the formation of Li2CO3. Workup procedures that avoid the formation of TGA–MS detectable ionic contaminants are proposed along with purification steps for contaminated NPs.Key words: gold, palladium, nanoparticles, TGA, mass spectrometry, ionic contamination.

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