Thermal Expansion Behavior of the Electroless Copper Coated Cu-SiCp Composites Fabricated via the Conventional Powder Metallurgical Technique

2013 ◽  
Vol 594-595 ◽  
pp. 857-861
Author(s):  
K. Azmi ◽  
M.N. Derman ◽  
A.M. Mustafa Al Bakri ◽  
A.V. Sandu
Keyword(s):  
Silicon Carbide ◽  
Thermal Expansion ◽  
Optical Fibers ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Copper Matrix ◽  
Packaging Materials ◽  
Matrix Composites ◽  
Advanced Packaging ◽  
Silicon Carbide Particles

The introduction of the metal matrix composites as the advanced electronic packaging materials is highly anticipated because their thermal properties can be engineered to match those of semiconductors, ceramics substrates and optical fibers. Among these advanced packaging materials, silicon carbide particles reinforced copper matrix (Cu-SiCp) composites are highly rated due to the high thermal conductivity of copper and low coefficient of thermal expansion (CTE) of silicon carbide. However, the Cu-SiCp composites fabricated via the conventional powder metallurgy (PM) technique usually have immature thermophysical properties due to the weak bonding between the copper matrix and the SiCp reinforcement. In order to improve the bonding between the two constituents, the SiCp were coated with copper via electroless coating process prior to PM fabrication processes. Based on the experimental results, The CTE and porosity of the Cu-SiCp composites were significantly affected by the volume fraction of SiCp. Furthermore, the CTE and porosity of the Cu-Coated Cu-SiCp composites were significantly lower than the non-Coated Cu-SiCp composites. These differences were mainly contributed by the nature of the bonding between the copper matrix and SiCp reinforcement.

scholarly journals Technological Relevance, Research Prospect and Applications of Aluminium-Silicon Carbide-Graphite Hybrid Metal Matrix Composites for Thermal Characterization

2018 ◽  
Vol 8 (02) ◽  
Author(s):  
S A Mohan Krishna ◽  
T N Shridhar ◽  
L Krishnamurthy ◽  
K B Vinay ◽  
G V Naveen Prakash
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Thermal Expansion ◽  
Hybrid Composites ◽  
Coefficient Of Thermal Expansion ◽  
Aluminium Matrix ◽  
Matrix Composites ◽  
Aluminium Matrix Composites ◽  
Research Prospect

Aluminium matrix composites belong to the family of materials whose mechanical, tribological, thermal and electrical properties can be customized effectively. Most of the commercial work on MMCs has been highlighted on Aluminium as the matrix material. The combination of light weight, environmental resistance and beneficial mechanical properties has made Aluminium alloys exceedingly popular; these properties also make Aluminium best suited for use as a matrix metal. The thermophysical properties of these composites can be tailor made and have excellent specific mechanical properties. These composites can be fabricated with ease. Aluminium matrix composites reinforced with the particles of Silicon Carbide possess high yield strength, low coefficient of thermal expansion or thermal expansivity, high modulus of elasticity and excellent wear resistance by maintaining volume proportion up to 20%. Aluminium hybrid composites can be customized to provide moderate Coefficient of Thermal Expansion (CTE) and high thermal conductivity that are favorable for the applications pertaining to thermal management equipment. However, it is necessary to evaluate different percentage combinations of reinforcements with matrix Aluminium to check for thermal stability and to measure thermal conductivity and coefficient of thermal expansion. It is expected that, Aluminium-Silicon Carbide-Graphite hybrid composites can be used as load bearing material for the above applications. In this paper, a review about the said hybrid composites to investigate thermal properties for engineering applications have been discussed based on its technological relevance, applications and research prospect.

The Influences of Cu-Coated SiCp on the Porosity and Thermal Expansion Behavior of Cu-SiCp Composites

2013 ◽  
Vol 795 ◽  
pp. 241-244
Author(s):  
K. Azmi ◽  
M.I.M. Tajuddin ◽  
A. Azida
Keyword(s):  
Thermal Expansion ◽  
Thermal Management ◽  
Metal Matrix ◽  
Coefficient Of Thermal Expansion ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Electroless Coating ◽  
Expansion Behavior ◽  
Significant Difference ◽  
Powder Metallurgy Methods

The widespread use of metal matrix composites as the packaging materials is due to their tailorable thermal conductivity and coefficient of thermal expansion (CTE). For the same reason, silicon carbide reinforced copper matrix (Cu-SiCp) composites are highly rated as thermal management materials in the electronic packaging applications. However, the Cu-SiCp composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the presence of porosity in the interface of copper matrix and the SiCp reinforcement. In order to improve the bonding between the two constituents, the SiCp were coated with copper via electroless coating process. Based on the experimental results, the CTE values of the copper coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites. The CTEs of the composites tend to decrease as the porosity increases. The significant difference in the CTE values was related to the presence of sub-micron gap between the copper matrix and the SiCp reinforcement.

AlN nanowires for Al-based composites with high strength and low thermal expansion

2007 ◽  
Vol 22 (10) ◽  
pp. 2711-2718 ◽  
Author(s):  
Y.B. Tang ◽  
Y.Q. Liu ◽  
C.H. Sun ◽  
H.T. Cong
Keyword(s):  
Thermal Expansion ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Maximum Yield ◽  
High Strength ◽  
Mechanical And Thermal Properties ◽  
Matrix Composites ◽  
Interfacial Reaction Product ◽  
Low Thermal Expansion ◽  
Al Matrix

Based on the synthesis of a sufficient amount of AlN nanowires (AlN-NWs), AlN-NWs/Al composites with homogenously distributed AlN-NWs were fabricated. Microstructural observations reveal that the interface between AlN-NWs and Al matrix is clean and bonded well, and no interfacial reaction product was formed at the nanowire-matrix boundary. Mechanical properties including yield and tensile strength of the composites were improved with AlN-NWs volume fraction changing from 5 to 15 vol%, and the maximum yield and tensile strengths of the composite were about 6 and 5 times, respectively, as high as those of Al matrix. Meanwhile, AlN-NWs effectively decreased the coefficient of thermal expansion (CTE) of the composites, and the CTE of 15 vol% composite was about one half that of Al matrix. The results obtained suggest that AlN nanowire is a promising reinforcement for optimizing the mechanical and thermal properties of metal matrix composites.

Structural and Thermal Properties of Hot Pressed Cu/C Matrix Composites Materials Used for the Thermal Management of High Power Electronic Devices

2007 ◽  
Vol 534-536 ◽  
pp. 1505-1508 ◽  
Author(s):  
Pierre Marie Geffroy ◽  
Jean François Silvain
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Carbon Fibers ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Porosity Level ◽  
Materials Used ◽  
Short Carbon

In order to obtain materials for electronic applications that exhibit both excellent thermal conductivity and low coefficient of thermal expansion (CTE), copper matrix composites have been reinforced by short high modulus graphite fibers. The lack of fiber/matrix interaction prevents any degradation of the carbon reinforcement during the elaboration steps and the normal use of these materials. Elaboration conditions, such as mixing conditions of the short carbon fibers and the copper powder, dimension and shape of the two powders, and finally densification atmosphere, temperature, pressure and time, have been optimized. Main parameters involved in the thermal properties of the Cu/C composite materials have been analyzed and adjusted. CTE is mainly related with the carbon volume fraction; CTE ranging from 9 to 13 10-6/°C can be reproductively obtained with carbon volume fraction ranging from 50% to 20%. Thermal conductivity properties are more complex and are linked mainly with 1) the porosity level inside the material, and 2) the orientation, properties and volume fraction of the carbon fibers. For short carbon fibers, in plane thermal conductivity ranging from 200 to 550 W/mK have been reproductively measured associated with thermal conductivity through-thickness ranging from 150 to 300 W/mK.

Preparation and Characterization of Cordierite-Bonded Silicon Carbide Porous Ceramics

2007 ◽  
Vol 124-126 ◽  
pp. 747-750 ◽  
Author(s):  
Jin Seok Lee ◽  
Do Mun Choi ◽  
Sung Churl Choi
Keyword(s):  
Silicon Carbide ◽  
Open Porosity ◽  
Bending Strength ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Graphite Powder ◽  
Porous Ceramics ◽  
Pore Former ◽  
Silicon Carbide Particles ◽  
Increasing Temperature

Cordierite-bonded silicon carbide porous ceramics were prepared by a reactive process, in which kaolin, talc, and alumina powders were mixed with silicon carbide powders and graphite powder was used as a pore former. The mixture was heated in air so that graphite was burned out and silicon carbide particles were bonded by reaction-derived cordierite. Open porosity and strength of porous ceramics were strongly dependent on the volume fraction of graphite and cordierite. A three-point bending strength of 13.9 MPa was achieved at a open porosity of 38.5 %, exhibiting coefficient of thermal expansion of 7.28 × 10-6/oC at the range of 25 – 800oC. Increase of cordierite volume in SiC matrix indicated mechanical improvement of the porous ceramics due to the increase of neck area among the SiC particles. Porous ceramics sintered at 1450oC possessed higher open porosity and median pore diameter than those of samples sintered at 1250 and 1350oC, since pore generated by the transport of dissolved talc materials as increasing temperature.

Internal Stress in an Alumina/Silicon Carbide Whisker Composite

1995 ◽  
Vol 39 ◽  
pp. 391-403
Author(s):  
M. Oden ◽  
T. Ericsson ◽  
J. B. Cohen
Keyword(s):  
Silicon Carbide ◽  
Stress State ◽  
Internal Stress ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
X Ray Diffraction ◽  
X Ray ◽  
Eshelby Model ◽  
The Matrix ◽  
Silicon Carbide Particles

The internal stress state in a Al2O3-SiC composite has been studied with X-ray diffraction and with calculations with a modified Eshelby model. The influence (on the internal stress state) of volume fraction, temperature, geometric shape, and the orientation of the silicon carbide particles are discussed. The stress tensors were measured in both the matrix and in the reinforcing phase, and the macro- and microstresses were separated for ail the components. Good agreement with the microstresses for the Eshelby model is found in all cases.Results from X-ray diffraction experiments at low temperature (45-295 K) on the coefficient of thermal expansion are also presented.

Analysis of Coefficient of Thermal Expansion and Thermal Conductivity of Bi-Modal SiC/A356 Composites Fabricated via Powder Metallurgy Route

2017 ◽  
Author(s):  
Preetkanwal Singh Bains ◽  
H. S. Payal ◽  
Sarabjeet Singh Sidhu
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Powder Metallurgy ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Aluminum Matrix ◽  
Aluminum Matrix Composites ◽  
Powder Metallurgy Method ◽  
Matrix Composites ◽  
Sic Particulates

The present study investigates the thermal conductivity and coefficient of thermal expansion of bimodal SiCp reinforced Aluminum matrix composites formed via powder metallurgy method. The after-effects of proportion of particulate reinforcement as size distribution and sintering parameters on the thermal properties have been explored. The Box-Behnken design for response surface methodology was adopted to recognize the significance of chosen variables on the thermal conductivity and coefficient of thermal expansion of the composite. It is witnessed that the thermal conductivity and coefficient of thermal expansion enhanced due to increase in fine SiC particulates volume fraction. It has been exhibited that the fine SiC particulates (37μm) doped Al-matrix occupied interstitial positions and developed continuous SiC-matrix network. SEMs were conducted to evaluate the microstructure architecture for MMCs.

Mean and Instantaneous Thermal Expansion of Uncoated and Ti Coated Diamond/Copper Composite Materials

2013 ◽  
Vol 702 ◽  
pp. 202-206 ◽  
Author(s):  
Qing Yun Wang ◽  
Wei Ping Shen ◽  
Ming Liang Ma
Keyword(s):  
Thermal Expansion ◽  
Vapor Deposition ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Copper Matrix ◽  
Powder Metallurgy Method ◽  
Titanium Film ◽  
Diamond Particles ◽  
Vapor Deposition Technique ◽  
Copper Composite

Heat sink materials not only should have higher thermal conductivity, but also have smaller difference of thermal expansion with cooled material. diamond/copper composites were made by the powder metallurgy method. Vacuum slowly vapor deposition technique was employed to deposit a titanium film on diamond particles before mixing with Cu powder in order to improve the bonding strength between Cu and diamond particles during sintering. The thermal expansion of diamond/Cu d composite was measured in the temperature range from 50 to 600 °C. The results show that the titanium film on diamond improves the interfacial bonding and reduces the coefficient of thermal expansion (CTE) of Cu/diamond composites. The CTE of diamond/Cu composites decreases with increasing diamond volume fraction as the results of mixture rule and the intense restriction effect of diamond reinforcement on the copper matrix. The residual stresses and pores in the composites affect instantaneous thermal expansion of diamond/Cu composites.

Cu-SiCp Composites as Advanced Electronic Packaging Materials

2013 ◽  
Vol 594-595 ◽  
pp. 852-856 ◽  
Author(s):  
K. Azmi ◽  
M.N. Derman ◽  
A.M. Mustafa Al Bakri ◽  
A.V. Sandu
Keyword(s):  
Silicon Carbide ◽  
Thermal Properties ◽  
Electronic Packaging ◽  
Coefficient Of Thermal Expansion ◽  
Copper Film ◽  
Copper Matrix ◽  
Interface Bonding ◽  
Electroless Coating ◽  
Silicon Carbide Particles ◽  
Carbide Particles

The demand for advanced thermal management materials such as silicon carbide particles reinforced copper matrix (Cu-SiCp) composites is increasing due to the stringent design requirement in the electronic packaging industries. High interest on Cu-SiCp composites is highlighted by the high thermal conductivity and low coefficient of thermal expansion (CTE) properties. However, the thermal properties of the Cu-SiCp composites are constrained by the bonding between the copper matrix and the silicon carbide particles (SiCp) reinforcement. In the powder metallurgical (PM) methodology in particular, the bonding between the two constituents is weak, thus demoting the thermal properties of the Cu-SiCp composites. In order to improve the interface bonding, the SiCp were copper coated via electroless coating process. Based on the experimental results and findings, a continuous copper deposition on the SiCp was obtained via the electroless plating process. The copper film was found to be high in purity and homogeneously deposited on the SiCp surfaces. The CTE values of the Cu-Coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites and were in agreement with Kernels model which accounts for both the shear and isostatic stresses developed in the component phases.

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