Effect of Direct Nitridation of 4H-SiC Surface on MOS Interface States

2012 ◽  
Vol 717-720 ◽  
pp. 725-728 ◽  
Author(s):  
Takashi Sakai ◽  
Mitsunori Hemmi ◽  
Yusuke Murata ◽  
Tomohiko Yamakami ◽  
Rinpei Hayashibe ◽  
...  
Keyword(s):  
Thermal Decomposition ◽  
Deposition Process ◽  
Interface State ◽  
Nitride Layer ◽  
State Density ◽  
Interface State Density ◽  
Xps Analysis ◽  
Insulating Layer ◽  
Direct Nitridation ◽  
Mis Diode

A nitride layer was formed on a SiC surface by direct nitridation in pure N2 or in NH3 diluted with N2. The SiO2 layer was deposited by the thermal decomposition of tetraethylorthosilicate (TEOS) on the nitride layer to form an MIS diode. The XPS analysis showed that the nitride layer was oxidized during the deposition process of SiO2. The direct nitridation was effective to reduce the interface state density between the insulating layer and 4H-SiC

scholarly journals Preparation and Characterization of Deposited Tetraethylorthosilicate-SiO2/SiC MIS Structure

2013 ◽  
Vol 740-742 ◽  
pp. 805-808 ◽  
Author(s):  
Mitsunori Hemmi ◽  
Takashi Sakai ◽  
Tomohiko Yamakami ◽  
Rinpei Hayashibe ◽  
Kiichi Kamimura
Keyword(s):  
Thermal Decomposition ◽  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Mis Structure ◽  
Interface Properties ◽  
Post Deposition Annealing ◽  
Direct Nitridation ◽  
Post Deposition

The SiO2 layer was deposited on the 4H-SiC Si face by the thermal decomposition of tetraethylorthosilicate(TEOS) in N2 atmosphere to from MIS diodes. The post deposition annealing was effective to improve the interface properties. The interface state density of the deposited SiO2/SiC MIS structure was estimated to be the order of 1011 cm-2eV-1 by Terman method. The direct nitridation of SiC surface prior to the deposition of the SiO2 layer was effective to reduce the interface state density.

scholarly journals Preparation and Characterization of Nitridation Layer on 4H SiC (0001) Surface by Direct Plasma Nitridation

2014 ◽  
Vol 778-780 ◽  
pp. 631-634 ◽  
Author(s):  
Yoshiyuki Akahane ◽  
Takuo Kano ◽  
Kyosuke Kimura ◽  
Hiroki Komatsu ◽  
Yukimune Watanabe ◽  
...  
Keyword(s):  
Interface State ◽  
Nitride Layer ◽  
State Density ◽  
Interface State Density ◽  
Process Temperature ◽  
Pure Nitrogen ◽  
Interface Property ◽  
Plasma Nitridation

A nitride layer was formed on a SiC surface by plasma nitridation using pure nitrogen as the reaction gas at the temperature from 800°C to 1400°C. The surface was characterized by XPS. The XPS measurement showed that an oxinitride layer was formed on the SiC surface by the plasma nitridation. The high process temperature seemed to be effective to activate the niridation reaction. A SiO2film was deposited on the nitridation layer to form SiO2/nitride/SiC structure. The interface state density of the SiO2/nitride/SiC structure was lower than that of the SiO2/SiC structure. This suggested that the nitridation was effective to improve the interface property.

High Permittivity Oxide Gate Stacks on Silicon Incorporating UHV Silicon Nitride Interfacial Layers

2001 ◽  
Vol 670 ◽  
Author(s):  
Mark A. Shriver ◽  
Ann M. Gabrys ◽  
T. K. Higman ◽  
S. A. Campbell
Keyword(s):  
Oxide Thickness ◽  
Interface State ◽  
Nitride Layer ◽  
State Density ◽  
Interface State Density ◽  
Equivalent Oxide Thickness ◽  
Gate Stacks ◽  
High Permittivity ◽  
Interfacial Layers ◽  
Thermal Nitridation

ABSTRACTCurrent high permittivity material deposition techniques produce a low permittivity oxide interfacial layer consequently increasing the equivalent oxide thickness. This interfacial oxide layer can be prevented by initially growing a thin nitride layer to act as a diffusion barrier. The interfacial nitride layer must also have low interface state densities comparable to state-of-the-art SiO2 insulators in order to be suitable for MOSFETs. The nitride layer used in this study was formed by thermal nitridation in a UHV system, with the subsequent high permittivity deposition done in an adjoining system. After forming capacitors from these films, capacitance vs. voltage (C-V) techniques were used to determine the interface state density and equivalent oxide thickness of the films. Gate stack films were produced on Si(100) and Si(111) and the results are compared. Gate stacks on Si(100) show a slight increase in stretchout in the high frequency C-V curves for both n-type and p-type samples. Initial data suggests that Si(111) has a lower interface state density than the Si(100) gate stacks. This may be attributed to the Si3N4layer on Si(111) being epitaxial nitride.

A Theoretical Study on the Performance of SnO2/SiO2/n-Si Solar Cells

2013 ◽  
Vol 737 ◽  
pp. 1-8 ◽  
Author(s):  
Fatimah A. Noor ◽  
Fandi Oktasendra ◽  
Euis Sustini ◽  
Abdullah Mikrajuddin ◽  
Khairurrijal
Keyword(s):  
Solar Cells ◽  
Short Circuit ◽  
Tunneling Current ◽  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Doping Density ◽  
Insulating Layer ◽  
Si Solar Cells ◽  
Cell Thickness

The performance of SnO2/SiO2/n-Si solar cells was studied by considering various transport mechanisms including minority-carrier diffusion, carrier recombination, and tunneling through insulating layer. The tunneling current through the SiO2 layer was obtained by employing the Airy-wavefunction approach. The efficiency was calculated to determine the performance of the cells under AM1 illumination for different values of insulating layer thickness, interface state density, hole life-time, doping density of silicon substrate, and cell thickness. It was shown that the efficiency increases as the insulating layer becomes thinner due to the decrease of short-circuit current. It was also shown that the efficiency increases as the doping density increases up to 6x1022/m3 and it then decreases for higher doping densities. As the interface state density decreases, the efficiency becomes higher. In addition, the increases in the hole lifetime and cell thickness enhance the efficiency of the solar cell.

Effect of Plasma Damage on Interface State Density Between a-Si:H and Insulating Films

1995 ◽  
Vol 377 ◽  
Author(s):  
Ikurou Umezu ◽  
Takahiro Kuwamura ◽  
Keiji Maeda
Keyword(s):  
Surface State ◽  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Gas Mixture ◽  
Plasma Damage ◽  
Insulating Layer ◽  
Surface State Density ◽  
Treated Sample ◽  
Plasma Treated Sample

ABSTRACTThe interface state density between a-Si:H and insulating film is very important in characteristics of a-Si:H thin film transistors. In this study, the interface state density was measured by photothermal deflection spectroscopy (PDS). Layered structures of a-SiN, 1.7:H on a-Si:H and a-SiO2.0 on a-Si:H were deposited by P-CVD method. The a-SiN1.7:H layer was grown from a gas mixture of SiH4 and NH3 and the a-SiO2.0 layer was grown from a gas mixture of SiH4 and N2O. While the interface state density of a-SiN1.7:H on a-Si:H structure was smaller than the free surface state density of a-Si:H, that of a-SiO2.0 on a-Si:H structure was larger than the free surface state density of a-Si:H. The difference in the surface state density between these specimens is discussed in terms of plasma damage of a-Si:H surface by the source gases during deposition of insulating layer. Surface of the a-Si:H was treated by plasma of NH3 or N2o gas which is dominant constituent of source gases of insulating layer. Although the surface state density of the N2o plasma-treated sample increases, that of NH3 plasma treated sample does not increase. The shape and intensity of the spectra of N2o plasma-treated sample is similar to that of the a-Sio2.0 on a-Si:H structure. These results indicate that the interface defect between a-Sio2.0and a-Si:H layer was induced by plasma damage of the a-Si:H surface.

Interface-State-Density Evaluation of p-type and n-type Ge/GeNx Structures by Conductance Technique

2013 ◽  
Vol 133 (7) ◽  
pp. 1279-1284
Author(s):  
Takuro Iwasaki ◽  
Toshiro Ono ◽  
Yohei Otani ◽  
Yukio Fukuda ◽  
Hiroshi Okamoto
Keyword(s):  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Conductance Technique ◽  
Density Evaluation ◽  
P Type

Identification of Charging Effects in Plasma-Enhanced TEOS Deposition with Non-Contact Test Techniques

1998 ◽  
Author(s):  
Tomasz Brozek ◽  
James Heddleson
Keyword(s):  
Vapor Deposition ◽  
Chemical Vapor ◽  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Wafer Surface ◽  
Oxide Charge ◽  
Contact Test ◽  
Deposition Power ◽  
Oxide Deposition

Abstract Use of non-contact test techniques to characterize degradation of the Si-SiO2 system on the wafer surface exposed to a plasma environment have proven themselves to be sensitive and useful in investigation of plasma charging level and uniformity. The current paper describes application of the surface charge analyzer and surface photo-voltage tool to explore process-induced charging occurring during plasma enhanced chemical vapor deposition (PECVD) of TEOS oxide. The oxide charge, the interface state density, and dopant deactivation are studied on blanket oxidized wafers with respect to the effect of oxide deposition, power lift step, and subsequent annealing.

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