Influence of the Diamond Surface Termination on the Thermal Conductivity of Al/Diamond- and Ag/Diamond MMCs

2015 ◽  
Vol 825-826 ◽  
pp. 142-149
Author(s):  
Jakob Segl ◽  
Christian Edtmaier
Keyword(s):  
Thermal Conductivity ◽  
Surface Layer ◽  
Thermal Properties ◽  
Diamond Surface ◽  
Metal Interface ◽  
Surface Termination ◽  
Drastic Increase ◽  
Pretreatment Conditions ◽  
Liquid Metal Infiltration ◽  
Metal Infiltration

MMCs consisting of diamonds and highly conductive metal matrices have been produced via gas pressure assisted liquid metal infiltration and their thermal properties have been investigated. Special attention was paid towards the diamond surface termination and its influence on the diamond-metal-interface and the resulting heat transport across this interface. Altering the diamond terminating surface layer can lead to a rather drastic increase in the thermal conductivity, rendering MMCs with pretreated diamonds double the thermal conductivity of the ones with as-received diamonds. The evolution of those terminating layers with different pretreatment conditions and their influence on the thermal conductivity of the resulting MMCs is rather complex and an ever-growing field of interest for diamond heat sink materials.The observed thermal properties of the MMCs produced in this study will be linked with the established diamond surface termination and will demonstrate the potential that lies within the method of diamond surface modification.

scholarly journals Preparation and characterization of polysaccharide - silica hybrid aerogels

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Gabrijela Horvat ◽  
Milica Pantić ◽  
Željko Knez ◽  
Zoran Novak
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Surface Area ◽  
Nitrogen Adsorption ◽  
Silica Aerogels ◽  
Drastic Increase ◽  
Organic Precursors ◽  
Hybrid Aerogels ◽  
Silica Hybrid

Abstract Hybrid aerogels based on polysaccharides - silica were prepared and characterized. Tetramethylorthosilicate (TMOS) was used as inorganic precursor and various polysaccharides (alginate, pectin, xanthan and guar) were used as organic precursors. TMOS was added to polysaccharide aqueous solutions, resulting in stable wet gels. There were no additional chemicals or cross-linkers in the process. Produced wet gels were dried under supercritical conditions with CO2 in order to preserve their structure. The nitrogen adsorption results were compared to pure polysaccharide aerogels, prepared in our previous research. It is shown, that the addition of silica to pectin, xanthan, alginate and guar significantly improved their structural properties, primarily seen in the drastic increase of the surface area. Guar-silica aerogels reached the highest surface area of 679 m2 g−1. The thermal properties, including thermal degradation and thermal conductivity were highly improved. Among the prepared hybrid aerogels, pectin-silica samples had the lowest thermal conductivity of 19 mWm−1 K−1.

The oxidation of Inconel alloy MA754 at low oxidation potential

1983 ◽  
Vol 41 ◽  
pp. 218-219
Author(s):  
D. N. Braski ◽  
P. D. Goodell ◽  
J. V. Cathcart ◽  
R. H. Kane
Keyword(s):  
Surface Layer ◽  
Oxidation Potential ◽  
Metal Interface ◽  
Elevated Temperature Strength ◽  
Surface Conditions ◽  
Inconel Alloy ◽  
Inco Alloy ◽  
Resistance To Oxidation ◽  
Oxide Particles ◽  
Cold Worked

It has been known for some time that the addition of small oxide particles to an 80 Ni—20 Cr alloy not only increases its elevated-temperature strength, but also markedly improves its resistance to oxidation. The mechanism by which the oxide dispersoid enhances the oxidation resistance is being studied collaboratively by ORNL and INCO Alloy Products Company.Initial experiments were performed using INCONEL alloy MA754, which is nominally: 78 Ni, 20 Cr, 0.05 C, 0.3 Al, 0.5 Ti, 1.0 Fe, and 0.6 Y2O3 (wt %).Small disks (3 mm diam × 0.38 mm thick) were cut from MA754 plate stock and prepared with two different surface conditions. The first was prepared by mechanically polishing one side of a disk through 0.5 μm diamond on a syntron polisher while the second used an additional sulfuric acid-methanol electropolishing treatment to remove the cold-worked surface layer. Disks having both surface treatments were oxidized in a radiantly heated furnace for 30 s at 1000°C. Three different environments were investigated: hydrogen with nominal dew points of 0°C, —25°C, and —55°C. The oxide particles and films were examined in TEM by using extraction replicas (carbon) and by backpolishing to the oxide/metal interface. The particles were analyzed by EDS and SAD.

AN INSTRUMENT FOR MEASURING HEAT FLOW, TEMPERATURE, AND THERMAL CONDUCTIVITY IN THE LUNAR SURFACE LAYER

1970 ◽  
Author(s):  
A. E. Wechsler ◽  
E. M. Drake ◽  
F. E. Ruccia ◽  
J. E. McCullough ◽  
P. Felsenthal ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Surface Layer ◽  
Heat Flow ◽  
Lunar Surface ◽  
Flow Temperature

Thermal Characterization of Carbon-Carbon Composites

2011 ◽  
Author(s):  
Messiha Saad ◽  
Darryl Baker ◽  
Rhys Reaves
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Thermal Diffusivity ◽  
Specific Heat ◽  
Critical Role ◽  
Carbon Composite ◽  
Flash Method ◽  
Carbon Composites ◽  
Energy Storage Devices ◽  
Graphitized Carbon

Thermal properties of materials such as specific heat, thermal diffusivity, and thermal conductivity are very important in the engineering design process and analysis of aerospace vehicles as well as space systems. These properties are also important in power generation, transportation, and energy storage devices including fuel cells and solar cells. Thermal conductivity plays a critical role in the performance of materials in high temperature applications. Thermal conductivity is the property that determines the working temperature levels of the material, and it is an important parameter in problems involving heat transfer and thermal structures. The objective of this research is to develop thermal properties data base for carbon-carbon and graphitized carbon-carbon composite materials. The carbon-carbon composites tested were produced by the Resin Transfer Molding (RTM) process using T300 2-D carbon fabric and Primaset PT-30 cyanate ester. The graphitized carbon-carbon composite was heat treated to 2500°C. The flash method was used to measure the thermal diffusivity of the materials; this method is based on America Society for Testing and Materials, ASTM E1461 standard. In addition, the differential scanning calorimeter was used in accordance with the ASTM E1269 standard to determine the specific heat. The thermal conductivity was determined using the measured values of their thermal diffusivity, specific heat, and the density of the materials.

scholarly journals Testing a Gypsum Composite Based on Raw Gypsum with a Direct Admixture of Paraffin and Polymer to Improve Thermal Properties

Materials ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3241
Author(s):  
Krzysztof Powała ◽  
Andrzej Obraniak ◽  
Dariusz Heim
Keyword(s):  
Thermal Conductivity ◽  
Heat Capacity ◽  
Thermal Properties ◽  
Phase Change ◽  
Large Scale ◽  
Building Materials ◽  
Residential Buildings ◽  
Energy Performance ◽  
Polymer Content ◽  
Volumetric Heat Capacity

The implemented new legal regulations regarding thermal comfort, the energy performance of residential buildings, and proecological requirements require the design of new building materials, the use of which will improve the thermal efficiency of newly built and renovated buildings. Therefore, many companies producing building materials strive to improve the properties of their products by reducing the weight of the materials, increasing their mechanical properties, and improving their insulating properties. Currently, there are solutions in phase-change materials (PCM) production technology, such as microencapsulation, but its application on a large scale is extremely costly. This paper presents a solution to the abovementioned problem through the creation and testing of a composite, i.e., a new mixture of gypsum, paraffin, and polymer, which can be used in the production of plasterboard. The presented solution uses a material (PCM) which improves the thermal properties of the composite by taking advantage of the phase-change phenomenon. The study analyzes the influence of polymer content in the total mass of a composite in relation to its thermal conductivity, volumetric heat capacity, and diffusivity. Based on the results contained in this article, the best solution appears to be a mixture with 0.1% polymer content. It is definitely visible in the tests which use drying, hardening time, and paraffin absorption. It differs slightly from the best result in the thermal conductivity test, while it is comparable in terms of volumetric heat capacity and differs slightly from the best result in the thermal diffusivity test.

Effect of Coating on the Thermal Conductivities of Diamond/Cu Composites Prepared by Spark Plasma Sintering (SPS)

2014 ◽  
Vol 722 ◽  
pp. 25-29 ◽  
Author(s):  
Q.L. Che ◽  
X.K. Chen ◽  
Y.Q. Ji ◽  
Y.W. Li ◽  
L.X. Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Theoretical Prediction ◽  
Volume Fraction ◽  
Interface Reaction ◽  
Copper Matrix ◽  
Bonding Force ◽  
Ti Alloys ◽  
Plasma Sintering ◽  
Spark Plasma

The carbide forming is proposed to improve interfacial bonding between diamond particles and copper-matrix for diamond/copper composites. The volume fraction of diamond and minor titanium are optimized. The microstructures, thermal properties, interface reaction production and its effect of minor titanium on the properties of the composites are investigated. The results show that the bonding force and thermal conductivity of the diamond/Cu-Ti alloys composites is much weaker and lower than that of the coated-diamond/Cu. the thermal conductivity of coated-60 vol. % diamond/Cu composites is 618 W/m K which is 80 % of the theoretical prediction value. The high thermal conductivity has been achieved by forming the titanium carbide at diamond/copper interface to gain a good interface.

Adhesive penetration of wood cell walls investigated by scanning thermal microscopy (SThM)

Holzforschung ◽  
2008 ◽  
Vol 62 (1) ◽  
pp. 91-98 ◽  
Author(s):  
Johannes Konnerth ◽  
David Harper ◽  
Seung-Hwan Lee ◽  
Timothy G. Rials ◽  
Wolfgang Gindl
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Surface Temperature ◽  
Cell Walls ◽  
Adhesive Contact ◽  
Wood Adhesive ◽  
Bond Line ◽  
Scanning Thermal Microscopy ◽  
Thermal Probe ◽  
Thermal Microscopy

Abstract Cross sections of wood adhesive bonds were studied by scanning thermal microscopy (SThM) with the aim of scrutinizing the distribution of adhesive in the bond line region. The distribution of thermal conductivity, as well as temperature in the bond line area, was measured on the surface by means of a nanofabricated thermal probe offering high spatial and thermal resolution. Both the thermal conductivity and the surface temperature measurements were found suitable to differentiate between materials in the bond region, i.e., adhesive, cell walls and embedding epoxy. Of the two SThM modes available, the surface temperature mode provided images with superior optical contrast. The results clearly demonstrate that the polyurethane adhesive did not cause changes of thermal properties in wood cell walls with adhesive contact. By contrast, cell walls adjacent to a phenol-resorcinol-formaldehyde adhesive showed distinctly changed thermal properties, which is attributed to the presence of adhesive in the wood cell wall.

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