Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001250-001268
Author(s):  
Michael O'Reilly ◽  
Michael J. Renn ◽  
Stephen Barnes
Keyword(s):  
Aspect Ratio ◽  
Integrated Circuits ◽  
High Performance ◽  
3 Dimensional ◽  
Wire Bond ◽  
Printing System ◽  
Performance System ◽  
Definition Of ◽  
Working Distance ◽  
Nanoparticle Ink

Optomec's Aerosol Jet print platform provides an evolutionary alternative to both wire bond and TSV technology, providing high density 3-dimensional interconnect capabilities which enable multi-functional integrated circuits to be stacked and vertically interconnected in high performance System-in-Package (SiP) solutions. The die stacks can include 8 or more die, with a total stack height of ~ 1 mm. The printing system has a working distance of several mm which means that no Z-height adjustments are required for the interconnect printing. Closely coupled pneumatic atomizers with multiplexed print nozzles are used to achieve production throughput of greater than 15,000 interconnects per hour. The Aerosol Jet deposits silver nanoparticle ink connections on staggered multi-chip die stacks. High aspect ratio interconnects with <30-micron line width and 6-micron line heights have been demonstrated at sub 60-micron pitches with resistivity <1x10−7 ohm*m. Pre-production yields exceeding 80% have been consistently realized. This paper will be further expanded to include pre-production qualification results, final production packaging, and further definition of the Aerosol Jet print platform integrated within a high throughput, manufacturing ready automation solution.

Aerosol Jet® Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications

2011 ◽  
Vol 2011 (1) ◽  
pp. 001028-001032
Author(s):  
Michael J. O’Reilly ◽  
Jeff Leal ◽  
Suzette K. Pangrle ◽  
Kenneth Vartanian
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
Three Dimensional ◽  
Contact Printing ◽  
Wire Bond ◽  
Printing System ◽  
3D Printed ◽  
Working Distance ◽  
Aerosol Jet Deposition ◽  
Vertical Interconnect

Aerosol Jet deposition systems provide an evolutionary alternative to both wire bond and TSV technology. As part of the Vertical Interconnect Pillar (ViP™) process, the Aerosol Jet system prints high density three-dimensional (3D) interconnects enabling multi-function integrated circuits to be stacked and vertically interconnected in high performance System-in-Packages (SiP). The stacks can include two or more die, with a total height of ∼ 2 millimeters. The non-contact printing system has a working distance of several millimeters above the substrate allowing 3D interconnects to be printed with no Z-height adjustments. The Aerosol Jet printhead is configured with multiple nozzles and a closely coupled atomizer to achieve production throughput of greater than 19,000 interconnects per hour. The Aerosol Jet printer deposits silver fine particle ink to form connections on staggered die stacks. High aspect ratio interconnects, less than 30-microns wide and greater than 6-microns tall, are printed at sub 60-micron pitch. After isothermal sintering at 150° C to 200° C for 30 minutes, highly conductive interconnects near bulk resistivity are produced. Pre-production yields exceeding 80% have been realized. This paper will provide further details on the 3D printed interconnect process, current and planned production throughput levels, and process yield and device reliability status.

Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip Packaging

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 002131-002152 ◽  
Author(s):  
Michael J. Renn ◽  
Bruce H. King ◽  
Michael O'Reilly ◽  
Jeff S. Leal ◽  
Suzette K. Pangrle
Keyword(s):  
Video Communication ◽  
High Density ◽  
Contact Material ◽  
Functional Requirements ◽  
3 Dimensional ◽  
Material Deposition ◽  
Printing System ◽  
Working Distance ◽  
Nanoparticle Ink ◽  
Semiconductor Packaging

Optomec's patented Aerosol Jet technology is a maskless, non-contact material deposition system used to enable 3-dimensional semiconductor packaging. This presentation highlights results of printing high density, 3-D interconnects on stacked die modules which incorporate video, communication and memory chips. Such packages are critical for meeting the increasing functional requirements of SmartPhones, personal entertainment, and other mobile devices. The Aerosol Jet system is used to deposit silver nanoparticle ink connections along the staircase sidewall of staggered multi-chip die stacks. High aspect ratio interconnects with 30-micron line width and greater than 10-micron line height are demonstrated at a pitch of 61-microns. After printing, the silver inks are cured at ~200°C for ~30 minutes, which gives interconnect resistances below one-Ohm (< 5 micron Ohm*cm). The stacks can include up to 8 die, with a total stack height below 1 mm. The printing system has a working distance of several mm which means that no Z-height adjustments are required for the interconnect printing. Multiplexed print nozzles are used to achieve production throughputs of greater than two interconnects per second per nozzle. Based on cost and functional advantages, the Aerosol Jet process is emerging as an effective alternative to traditional wire bond and through-silicon-via (TSV) technologies.

Pathophysiology of the coronary circulation

ESC CardioMed ◽  
2018 ◽  
pp. 1320-1324
Author(s):  
Nils P. Johnson ◽  
K. Lance Gould
Keyword(s):  
Pressure Loss ◽  
High Performance ◽  
Building Blocks ◽  
Maximum Pressure ◽  
Control Mechanisms ◽  
Coronary Physiology ◽  
Performance System ◽  
Artery Disease ◽  
Epicardial Stenosis ◽  
Definition Of

All coronary physiology serves a single purpose: the capacity to achieve extraordinary myocardial blood flow and cardiac output for extreme physical demands. Since evolutionary survival requires maximum capacity only intermittently, complex control mechanisms reduce ‘resting’ flow to levels considered ‘normal’ thereby giving the appearance of a ‘high resistance system’ at baseline. From this conceptual definition of coronary physiology as a high-performance system throttled at rest, the inverse idea of coronary pathophysiology arises naturally as the inability to augment flow. Five basic physiological principles exist as building blocks for coronary pathophysiology: diastole dominates perfusion; oxygen extraction has already been maximized at baseline; curvilinear pressure loss versus flow relationships due to coronary artery disease; interaction between the myocardial bed and epicardial stenosis define maximum pressure loss and flow increase; and pathology produces longitudinal and transmural gradients of pressure and flow.

Design of an intermediate high voltage EM for 3-D studies of biological material and its integration with a system for remote access

1995 ◽  
Vol 53 ◽  
pp. 66-67 ◽  
Author(s):  
Mark H. Ellisman
Keyword(s):  
High Voltage ◽  
High Performance ◽  
Remote Access ◽  
3 Dimensional ◽  
Voltage Electron ◽  
Remote Operation ◽  
High Voltage Electron Microscope ◽  
La Jolla ◽  
Performance Computing ◽  
Advanced Version

The increased availability of High Performance Computing and Communications (HPCC) offers scientists and students the potential for effective remote interactive use of centralized, specialized, and expensive instrumentation and computers. Examples of instruments capable of remote operation that may be usefully controlled from a distance are increasing. Some in current use include telescopes, networks of remote geophysical sensing devices and more recently, the intermediate high voltage electron microscope developed at the San Diego Microscopy and Imaging Resource (SDMIR) in La Jolla. In this presentation the imaging capabilities of a specially designed JEOL 4000EX IVEM will be described. This instrument was developed mainly to facilitate the extraction of 3-dimensional information from thick sections. In addition, progress will be described on a project now underway to develop a more advanced version of the Telemicroscopy software we previously demonstrated as a tool to for providing remote access to this IVEM (Mercurio et al., 1992; Fan et al., 1992).

The Structure and Properties of MoSi2 Thin Film in Mos Process

1980 ◽  
Vol 38 ◽  
pp. 326-327
Author(s):  
C.K. Wu ◽  
P. Chang ◽  
N. Godinho
Keyword(s):  
Thin Film ◽  
Integrated Circuits ◽  
High Performance ◽  
Large Scale ◽  
Process Development ◽  
Structure And Properties ◽  
Metal Silicides ◽  
High Oxidation ◽  
Important Approach ◽  
High Oxidation Resistance

Recently, the use of refractory metal silicides as low resistivity, high temperature and high oxidation resistance gate materials in large scale integrated circuits (LSI) has become an important approach in advanced MOS process development (1). This research is a systematic study on the structure and properties of molybdenum silicide thin film and its applicability to high performance LSI fabrication.

Fluorocarbon Precursor for High Aspect Ratio via Milling in Focused Ion Beam Modification of Integrated Circuits

2004 ◽  
Author(s):  
Valery Ray
Keyword(s):  
Side Effects ◽  
Aspect Ratio ◽  
Integrated Circuits ◽  
High Aspect Ratio ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Enabling Technology ◽  
Si Substrate ◽  
Ion Beam Modification ◽  
The Past

Abstract Gas Assisted Etching (GAE) is the enabling technology for High Aspect Ratio (HAR) circuit access via milling in Focused Ion Beam (FIB) circuit modification. Metal interconnect layers of microelectronic Integrated Circuits (ICs) are separated by Inter-Layer Dielectric (ILD) materials, therefore HAR vias are typically milled in dielectrics. Most of the etching precursor gases presently available for GAE of dielectrics on commercial FIB systems, such as XeF2, Cl2, etc., are also effective etch enhancers for either Si, or/and some of the metals used in ICs. Therefore use of these precursors for via milling in dielectrics may lead to unwanted side effects, especially in a backside circuit edit approach. Making contacts to the polysilicon lines with traditional GAE precursors could also be difficult, if not impossible. Some of these precursors have a tendency to produce isotropic vias, especially in Si. It has been proposed in the past to use fluorocarbon gases as precursors for the FIB milling of dielectrics. Preliminary experimental evaluation of Trifluoroacetic (Perfluoroacetic) Acid (TFA, CF3COOH) as a possible etching precursor for the HAR via milling in the application to FIB modification of ICs demonstrated that highly enhanced anisotropic milling of SiO2 in HAR vias is possible. A via with 9:1 aspect ratio was milled with accurate endpoint on Si and without apparent damage to the underlying Si substrate.

Failure Analysis of Short Faults on Advanced Wire-Bond and Flip-Chip Packages with Scanning SQUID Microscopy

2004 ◽  
Author(s):  
Steve K. Hsiung ◽  
Kevan V. Tan ◽  
Andrew J. Komrowski ◽  
Daniel J. D. Sullivan ◽  
Jan Gaudestad
Keyword(s):  
Magnetic Fields ◽  
Integrated Circuits ◽  
Quantum Interference ◽  
Flip Chip ◽  
Infrared Emission ◽  
Fault Analysis ◽  
Wire Bond ◽  
Overlay Design ◽  
Scanning Squid ◽  
Metal Layers

Abstract Scanning SQUID (Superconducting Quantum Interference Device) Microscopy, known as SSM, is a non-destructive technique that detects magnetic fields in Integrated Circuits (IC). The magnetic field, when converted to current density via Fast Fourier Transform (FFT), is particularly useful to detect shorts and high resistance (HR) defects. A short between two wires or layers will cause the current to diverge from the path the designer intended. An analyst can see where the current is not matching the design, thereby easily localizing the fault. Many defects occur between or under metal layers that make it impossible using visible light or infrared emission detecting equipment to locate the defect. SSM is the only tool that can detect signals from defects under metal layers, since magnetic fields are not affected by them. New analysis software makes it possible for the analyst to overlay design layouts, such as CAD Knights, directly onto the current paths found by the SSM. In this paper, we present four case studies where SSM successfully localized short faults in advanced wire-bond and flip-chip packages after other fault analysis methods failed to locate the defects.

scholarly journals A multivariate intersection over union of SiamRPN network for visual tracking

2021 ◽  
Author(s):  
Zhihui Huang ◽  
Huimin Zhao ◽  
Jin Zhan ◽  
Huakang Li
Keyword(s):  
Aspect Ratio ◽  
Visual Tracking ◽  
Target Location ◽  
Coincidence Degree ◽  
Distance Ratio ◽  
Geometric Factors ◽  
Fast Motion ◽  
Definition Of ◽  
Overlap Area ◽  
Center Distance

AbstractSiamPRN algorithm performs well in visual tracking, but it is easy to drift under occlusion and fast motion scenes because it uses $$\ell _1$$ ℓ 1 -smooth loss function to measure the regression location of bounding box. In this paper, we propose a multivariate intersection over union (MIOU) loss in SiamRPN tracking framework. Firstly, MIOU loss includes three geometric factors in regression: the overlap area ratio, the center distance ratio, and the aspect ratio, which can better reflect the coincidence degree of target box and prediction box. Secondly, we improve the definition of aspect ratio loss to avoid gradient explosion, improve the optimization performance of prediction box. Finally, based on SiamPRN tracker, we compared the tracking performance of $$\ell _1$$ ℓ 1 -smooth loss, IOU loss, GIOU loss, DIOU loss, and MIOU loss. Experimental results show that the MIOU loss has better target location regression than other loss functions on the OTB2015 and VOT2016 benchmark, especially for the challenges of occlusion, illumination change and fast motion.

scholarly journals Effects of Steel Fiber Percentage and Aspect Ratios on Fresh and Harden Properties of Ultra-High Performance Fiber

2021 ◽  
Vol 2 (3) ◽  
pp. 501-515
Author(s):  
Rajib Kumar Biswas ◽  
Farabi Bin Ahmed ◽  
Md. Ehsanul Haque ◽  
Afra Anam Provasha ◽  
Zahid Hasan ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Aspect Ratio ◽  
High Performance ◽  
Steel Fiber ◽  
Setting Time ◽  
Fiber Reinforced Concrete ◽  
Future Research ◽  
Manufacturing Cost ◽  
Aspect Ratios ◽  
High Performance Fiber

Steel fibers and their aspect ratios are important parameters that have significant influence on the mechanical properties of ultrahigh-performance fiber-reinforced concrete (UHPFRC). Steel fiber dosage also significantly contributes to the initial manufacturing cost of UHPFRC. This study presents a comprehensive literature review of the effects of steel fiber percentages and aspect ratios on the setting time, workability, and mechanical properties of UHPFRC. It was evident that (1) an increase in steel fiber dosage and aspect ratio negatively impacted workability, owing to the interlocking between fibers; (2) compressive strength was positively influenced by the steel fiber dosage and aspect ratio; and (3) a faster loading rate significantly improved the mechanical properties. There were also some shortcomings in the measurement method for setting time. Lastly, this research highlights current issues for future research. The findings of the study are useful for practicing engineers to understand the distinctive characteristics of UHPFRC.

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