Highly Reliable Solderless Contact with Press-fit Technology for Power Modules

2018 ◽  
Vol 2018 (1) ◽  
pp. 000470-000475
Author(s):  
Minoru Egusa ◽  
Hidetoshi Ishibashi ◽  
Yoshitaka Otsubo ◽  
Masao Kikuchi ◽  
Yoshihiro Kashiba

Abstract Press-fit technology has been expected as a mounting technique instead of soldering in power electronics. To apply press-fit technology to power modules, the basic behavior of the contact resistance and an interface reaction of the press-fit contact are studied. Further, maintaining a stable contact force is important to maintain a low contact resistance. Factors that reduce the contact force include the displacement by the geometric tolerance of the pin and through-hole of the printed circuit board, and the thermal cycle load. We solved the problem by designing a new press-fit pin structure that provides the constricted portion for the body part of the press-fit pin, and clarified by thermal cycle test on power modules.

Author(s):  
Hironori Tohmyoh ◽  
Kiichiro Yamanobe ◽  
Masumi Saka ◽  
Jiro Utsunomiya ◽  
Takeshi Nakamura ◽  
...  

This paper treats typical mechanical problems met in a solderless press-fit assembly. First, the elastic-plastic properties of a pin and the friction coefficient of the pin in thin plated through hole (TH) are determined by the experiments and the three-dimensional finite element (FE) analysis. The elastic-plastic properties of the press-fit pin are determined by the small scale three-point bending. The friction coefficient of the pin in the TH is successfully determined from the load-displacement relationship of the pin during press-fit assembly. The validity of the determined parameters is to be clarified by conducting the press-fit assemblies into the holes with different diameters. By comparing the damaged area of the printed circuit boards after assembly and the stress distributions obtained numerically, the failure stress of the board is determined. Finally, both the retention force of the pin and the damage of the printed circuit board after assembly become possible to be predicted by the numerical analysis.


1984 ◽  
Vol 11 (2) ◽  
pp. 165-172
Author(s):  
A. Kerkhoff

Involving, as it does, DIN and Reversed DIN board connectors, compliant press-fit pins, round cable, flat cable, and coaxial-connectors, the Berg Backpanel System has, over the past two years, gained a recognized position in the European and US markets.Development and expansion of the system in depth, and in breadth, is still ongoing. One of the major subjects is press-fit: preloaded press-fit connectors and studies focused on the relationship between printed circuit board properties vs. compliant press-fit pin design.This paper presents results of these developments and discusses design options.


Nanomaterials ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 787
Author(s):  
Hong Gi Oh ◽  
Dong Cheol Jeon ◽  
Mahmudah Salwa Gianti ◽  
Hae Shin Cho ◽  
Da Ae Jo ◽  
...  

The monitoring of Na+ ions distributed in the body has been indirectly calculated by the detection of Na+ ions in urine. We fabricated a two–dimensional (2D) Na+ ion sensor using a graphene ion–sensitive field–effect transistor (G–ISFET) and used fluorinated graphene as a reference electrode (FG–RE). We integrated G–ISFET and FG on a printed circuit board (PCB) designed in the form of a secure digital (SD) card to fabricate a disposable Na+ ion sensor. The sensitivity of the PCB tip to Na+ ions was determined to be −55.4 mV/dec. The sensor exhibited good linearity despite the presence of interfering ions in the buffer solution. We expanded the evaluation of the PCB tip to real human patient urine samples. The PCB tip exhibited a sensitivity of −0.36 mV/mM and linearly detected Na+ ions in human patient urine without any dilution process. We expect that G–ISFET with FG–RE can be used to realize a disposable Na+ ion sensor by serving as an alternative to Ag/AgCl reference electrodes.


Biosensors ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 242
Author(s):  
Ziqi Liu ◽  
Yiyin Chen ◽  
Meng Zhang ◽  
Tiancheng Sun ◽  
Keer Li ◽  
...  

Uric acid, as the terminal product of purine metabolism in the body, is an important marker of many diseases. Uric acid is abundant in saliva, offering the possibility of its non-invasive detection. However, it is sensitive to interference in saliva by a variety of factors. A reliable method of processing saliva is centrifugation (CF), but the cost and size of equipment limit its use in everyday life. In this study, a novel portable salivary-sensing system (PSSS) with integrated suction filtration (SF) and temperature insulation was proposed to obtain more accurate salivary uric acid levels through a simple procedure. The PSSS includes a saliva container, a high-sensitive uric acid sensor (UAS), an accompanying printed circuit board (PCB), and a mobile application. The responses produced by the UAS presents excellent linearity (4.6 μA/mM with R2 = 0.9964), selectivity, reproducibility, and stability for the detection of low levels of uric acid. The difference in detection values between the UAS and the commercial sensor is only ~4%. The primary feature of the saliva container is the processing of saliva by SF instead of CF. Samples from CF and SF showed no significant differences regarding uric acid levels, and both exhibited approximately 50% deviation from the untreated samples, while the difference in uric acid levels between the samples after SF and after applying both treatments was ~10%. Besides, insulation of the saliva container can partially eliminate sources of error induced by the environment during uric acid level testing. The PSSS provides a novel strategy for the immediate detection of specific markers in saliva. We believe that the PSSS has promising potential for future application in the rapid saliva testing.


Author(s):  
Vijayalakshmi S ◽  
Nagarajan V

In this work, the communication of a channel in the human body has a characteristic (time-domain) which can be measured at various distances in transmission and various frequencies of a signal by the printed circuit board-an analog frontend board (PCB-AFE) support. Besides, for the wideband signal of Body Channel Communication (BCC), a human body skin acts within a range of 1 Mb/s to 40 Mb/s as the transmission medium. This communication is more stable and attenuating low power while comparing with all another transmission medium in wireless. Moreover, due to the motion of a human body, this communication doesn't get affected. Though, the body antenna gives effects in the communication of a channel of the human body by occurs some interference. The Manchester data acts as encoder and decoder in transmitter and receiver parts respectively, in an AFE-PCB the Manchester encoder data is amplified after receiving the data from end to end channel of a human body. The data quality is improved by 7X sampler in clock data recovery (CDR) circuit. Therefore, the proposed design of reliable BCC Transceiver with SSCG and PNR Generator is processed in XilinxISE14.5, ModelSim Simulator 6.5a (Quartus II 8.1), and Micro wind software tools. It is also implemented in a XilinxXC9572XL kit. The power consumption and delay is reduced up to 90%, speed is increased up to 50% and leakage current is reduced up to 80% in the transmitter part.


2017 ◽  
Vol 11 (1) ◽  
Author(s):  
Joshua Gafford ◽  
Tommaso Ranzani ◽  
Sheila Russo ◽  
Alperen Degirmenci ◽  
Samuel Kesner ◽  
...  

Recent advances in medical robotics have initiated a transition from rigid serial manipulators to flexible or continuum robots capable of navigating to confined anatomy within the body. A desire for further procedure minimization is a key accelerator for the development of these flexible systems where the end goal is to provide access to the previously inaccessible anatomical workspaces and enable new minimally invasive surgical (MIS) procedures. While sophisticated navigation and control capabilities have been demonstrated for such systems, existing manufacturing approaches have limited the capabilities of millimeter-scale end-effectors for these flexible systems to date and, to achieve next generation highly functional end-effectors for surgical robots, advanced manufacturing approaches are required. We address this challenge by utilizing a disruptive 2D layer-by-layer precision fabrication process (inspired by printed circuit board manufacturing) that can create functional 3D mechanisms by folding 2D layers of materials which may be structural, flexible, adhesive, or conductive. Such an approach enables actuation, sensing, and circuitry to be directly integrated with the articulating features by selecting the appropriate materials during the layer-by-layer manufacturing process. To demonstrate the efficacy of this technology, we use it to fabricate three modular robotic components at the millimeter-scale: (1) sensors, (2) mechanisms, and (3) actuators. These modules could potentially be implemented into transendoscopic systems, enabling bilateral grasping, retraction and cutting, and could potentially mitigate challenging MIS interventions performed via endoscopy or flexible means. This research lays the ground work for new mechanism, sensor and actuation technologies that can be readily integrated via new millimeter-scale layer-by-layer manufacturing approaches.


2018 ◽  
Vol 68 (1) ◽  
pp. 103-108
Author(s):  
Peter Šlesar ◽  
Roland Jančo

Abstract The article is devoted to bearing analysis, which has a specific shape. The outer ring is the body directly and the inner ring is the case. To determine optimal radial clearance or overlap are used the thermal / structural analysis. The article is logically divided into two parts. In the first analysis, was monitored the impact of the press-fit of the case into the body. In the second analysis, there are presented attained results in graphical outputs of displacements in the orbits at different operating temperatures. At the end of the article were evaluated and researched individual effects on bearing deformation.


2021 ◽  
Vol 9 (1) ◽  
pp. 199
Author(s):  
Kharisma Adam ◽  
Zairin Zain ◽  
Valentinus Pebriano

Technological developments that continue to evolve changes in various activities such as industries that rely heavily on computers and robot technology to increase industrial production. From this industrial development, it requires competent human resources who can compete in the industrial world. One way to improve human resources in the field of technology is to build a Computer Engineering and Informatics Vocational High School. Improvement and additional facilities are needed to support education in Kubu Raya Regency. The design stages of the Computer and Informatics Engineering Vocational High School in Kubu Raya Regency start from the preparation stage, the analysis stage, the synthesis stage and the design stage. Application of understanding tropical architecture with consideration of the principle of spatial comfort in buildings related to aspects of the body size of the building user, aspects of human space based on human activities in it, audio comfort, visual comfort, and thermal comfort in buildings. The application of renewable energy, such as solar power generation, is applied to building facades to provide electricity sources and block light from entering the room. In addition, the application of laterite brick material and roaster for air humidity adjusts the geographical area of Kubu Raya Regency which is a tropical area. The formation of buildings with a philosophical composition of shapes and room analogies from the Printed Circuit Board gives the meaning of access to rooms that are connected to one another.


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