Enhancement of ESD performances of Silicon Capacitors for RFID solutions

2020 ◽  
Vol 2020 (1) ◽  
pp. 000085-000089
Author(s):  
Sébastien Jacqueline ◽  
Catherine Bunel ◽  
Laurent Lengignon
Keyword(s):  
Cross Sections ◽  
Radio Frequency Identification ◽  
Integrated Circuit ◽  
Equivalent Series Resistance ◽  
Human Body Model ◽  
Capacitance Density ◽  
Electrical Failure ◽  
Low Profile ◽  
Lc Circuit ◽  
Process Architecture

Abstract Radio-Frequency IDentification devices such as smart cards and RFID tags are based on the presence of a resonant tuned LC circuit associated to the RFID Integrated Circuit (IC). The use of discrete capacitor, external to the IC gives greater flexibility and design freedom. In the race of miniaturization, manufacturers of RFID devices always require smaller electronic components. To save space and in the same time improve performances, capacitors are exposed to height and volume constraints. In the same time, the capacitor has to withstand ESD stresses that can occur during the assembly of the device and during operation. Murata has developed a unique thin capacitor technology in silicon. This paper reports the development of a range of low profile capacitors with enhanced ESD performances. The manufacturing process optimization and the design adjustments will be presented here. The process was optimized by taking into account the main electrical parameters: leakage current, breakdown voltage, capacitance density, capacitance accuracy, Equivalent Series Resistance (ESR) and Self-Resonant Frequency (SRF). The dielectric stack was defined in order to integrate up to 330pF in 0402 case. The process architecture, based on accurate planar capacitor with thick dielectric will be discussed. With this architecture there is no constraint to reach low thickness, such as 100μm or even lower. The ESD threshold of each Silicon Capacitor was investigated with design variations associated to Human Body Model measurements. A Single Project Wafer (SPW) was founded with 36 different capacitor designs. Design modulations specifically addressed the orientation and position of the contacts openings. Special care was taken to maximize the width of the contact holes and metal tracks. A mosaic approach, constructed out of a massive network of parallelized elementary cells was also implemented, so that the charges of the ESD pulse do not concentrate at the same place, leading to electrical failure. Examples of defects due to ESD stress will be shown with failure analysis cross-sections and ways to enhance the ESD threshold by design will be illustrated.

A Technique for Reliably Preparing Full-Length Metallographic Cross-Sections of Integrated Circuit Bond Wires

2006 ◽  
Author(s):  
Carl Nail
Keyword(s):  
Integrated Circuits ◽  
High Precision ◽  
Cross Sections ◽  
Integrated Circuit ◽  
Radiographic Analysis ◽  
Good Resolution ◽  
Metallographic Preparation ◽  
Bond Wires ◽  
Darkfield Imaging ◽  
Bond Wire

Abstract To overcome the obstacles in preparing high-precision cross-sections of 'blind' bond wires in integrated circuits, this article proposes a different technique that generates reliable, repeatable cross-sections of bond wires across most or all of their lengths, allowing unencumbered and relatively artifact-free analysis of a given bond wire. The basic method for cross-sectioning a 'blind' bond wire involves radiographic analysis of the sample and metallographic preparation of the sample to the plane of interest. This is followed by tracking the exact location of the plane on the original radiograph using a stereomicroscope and finally darkfield imaging in which the wire is clearly visible with good resolution.

A low-profile FSS-based high capacity chipless RFID tag for sensing and encoding applications

2021 ◽  
pp. 1-9
Author(s):  
Shahid Habib ◽  
Amjad Ali ◽  
Ghaffer Iqbal Kiani ◽  
Wagma Ayub ◽  
Syed Muzahir Abbas ◽  
...  
Keyword(s):  
Radio Frequency Identification ◽  
High Capacity ◽  
Frequency Selective Surface ◽  
Rfid Tag ◽  
Sensing Applications ◽  
Low Profile ◽  
Simple Geometry ◽  
Chipless Rfid ◽  
Frequency Identification ◽  
Good Agreement

Abstract This paper presents a polarization-independent 11-bit chipless RFID tag based on frequency-selective surface which has been designed for encoding and relative humidity (RH) sensing applications. The 10 exterior U-shaped resonators are used for item encoding whereas Kapton has been incorporated with the interior resonator for RH sensing. This radio-frequency identification (RFID) tag operates in S- and C-frequency bands. The proposed design offers enhanced fractional bandwidth up to 88% with the density of 4.46 bits/cm2. Both single- and dual-layer tags have been investigated. The simulated results are in good agreement with measured results and a comparison with existing literature is presented to show the performance. Simple geometry, high code density, large frequency signature bandwidth, high magnitude bit, high radar cross-section, and angular stability for more than 75° are the unique outcomes of the proposed design. In addition, RH sensing has been achieved by integrating the Kapton on the same RFID tag.

Reliability evaluation of wearable radio frequency identification tags: Design and fabrication of a two-part textile antenna

2018 ◽  
Vol 89 (4) ◽  
pp. 560-571 ◽  
Author(s):  
Xiaochen Chen ◽  
Leena Ukkonen ◽  
Johanna Virkki
Keyword(s):  
Radio Frequency ◽  
Radio Frequency Identification ◽  
Integrated Circuit ◽  
High Performance ◽  
Cyclic Strain ◽  
Moist Environment ◽  
Frequency Identification ◽  
Identification Tags ◽  
Cost Efficient ◽  
The One

Passive radio frequency identification-based technology is a convincing approach to the achievement of versatile energy- and cost-efficient wireless platforms for future wearable applications. By using two-part antenna structures, the antenna-electronics interconnections can remain non-stressed, which can significantly improve the reliability of the textile-embedded wireless components. In this article, we describe fabrication of two-part stretchable and non-stretchable passive ultra-high frequency radio frequency identification textile tags using electro-textile and embroidered antennas, and test their reliability when immersed as well as under cyclic strain. The results are compared to tags with traditional one-part dipole antennas fabricated from electro-textiles and by embroidery. Based on the results achieved, the initial read ranges of the two-part antenna tags, around 5 m, were only slightly shorter than those of the one-part antenna tags. In addition, the tag with two-part antennas can maintain high performance in a moist environment and during continuous stretching, unlike the one-part antenna tag where the antenna-integrated circuit attachment is under stress.

“Cleaning”- The Dirty Word in Packaging Assembly

2010 ◽  
Vol 2010 (1) ◽  
pp. 000742-000746
Author(s):  
Rich Brooks
Keyword(s):  
Thermal Energy ◽  
Integrated Circuit ◽  
Flip Chip ◽  
New Technologies ◽  
Cleaning Process ◽  
Maximum Performance ◽  
Low Profile ◽  
Total Process ◽  
Temperature And Pressure

A majority of the package assembly facilities are using only DI water to remove flux residue from under flip-chip devices, prior to an underfill process. As the new technologies are being implemented, not only has DI water reached its limitations, but some cleaning chemistries are not able to perform adequately to remove ALL of the flux residues. Complete cleaning and removal of the flux residues under low profile components are critical to maintain the reliability of the integrated circuit. Therefore, the cleaning process must be carefully examined and optimized to obtain maximum performance for removing the flux residues. The total cleaning process can be broken down into two subsets:Static Cleaning rate & Dynamic Cleaning rate The Static Cleaning rate is ability of the cleaning chemistry to remove or dissolve the residue in the absence of temperature and pressure. The Dynamic Cleaning rate involves the kinetic forces and energy to remove the residue. This includes the Thermal energy and Impingement energy required to remove the flux residue. The sum of these two cleaning rates (Static and Dynamic cleaning rates) equal the Total Process Cleaning rate (see formula below). This paper will review cleaning problems brought about with the implementation of the latest technologies and explain how the cleaning process can be optimized to guarantee the reliability of the assemblies.

Electrical Characterization of Low-Profile Copper Foil for Reduced Surface Roughness Loss

2016 ◽  
Vol 2016 (1) ◽  
pp. 000358-000363 ◽  
Author(s):  
Qianfei Su ◽  
A. Ege Engin ◽  
Jerry Aguirre
Keyword(s):  
Surface Roughness ◽  
Cross Sections ◽  
Transmission Lines ◽  
High Frequency ◽  
Printed Circuit Board ◽  
Electrical Characterization ◽  
Cavity Resonator ◽  
Circuit Board ◽  
Low Profile ◽  
Measure Surface Roughness

Abstract Signal attenuation in transmission lines is a major issue for reliable transmission in high frequency range. Knowledge of the electrical parameters of printed circuit board (PCB), including dielectric constant and loss tangent, is critical. Moreover, surface roughness has a great effect on loss in high frequency. This paper demonstrates an effective simulation fitting method for electrical material characterization. Cavity resonator is chosen as the circuit for characterization. A methodology is presented to measure surface roughness from cross sections, and compared with values extracted from resonator measurements. Several materials and copper foils treatments, including low-profile, are analyzed in this paper.

Experimental investigation on the thermal performance of Si micro-heat pipe with different cross-sections

2017 ◽  
Vol 31 (30) ◽  
pp. 1750279 ◽  
Author(s):  
Mohammad Hamidnia ◽  
Yi Luo ◽  
Xiaodong Wang ◽  
Congming Li
Keyword(s):  
Thermal Management ◽  
Thermal Performance ◽  
Cross Sections ◽  
Integrated Circuit ◽  
Thermal Characteristics ◽  
Cost Savings ◽  
Working Fluid ◽  
Cross Sectional ◽  
Si Substrates ◽  
Silicon Based

Increasing component densities of the integrated circuit (IC) and packaging levels has led to thermal management problems. Si substrates with embedded micro-heat pipes (MHPs) couple good thermal characteristics and cost savings associated with IC batch processing. The thermal performance of MHP is intimately related to the cross-sectional geometry. Different cross-sections are designed in order to enhance the backflow of working fluid. In this experimental study, three different Si MHPs with same hydraulic diameter and various cross-sections are fabricated by micro-fabrication methods and tested under different conditions of fluid charge ratios. The results show that the trapezoidal MHP associated with rectangular artery which is charged with 40% of vapor chamber’s volume has the best thermal performance. This silicon-based MHP is a passive approach for thermal management, which could widen applications in the commercial electronics industry and LED lightings.

scholarly journals Miniature Compact Folded Dipole for Metal Mountable UHF RFID Tag Antenna

Electronics ◽  
2019 ◽  
Vol 8 (6) ◽  
pp. 713 ◽  
Author(s):  
Fuad Erman ◽  
Effariza Hanafi ◽  
Eng-Hock Lim ◽  
Wan Amirul Wan Mohd Mahyiddin ◽  
Sulaiman Wadi Harun ◽  
...  
Keyword(s):  
Radio Frequency Identification ◽  
Integrated Circuit ◽  
Single Layer ◽  
Metal Plate ◽  
Uhf Rfid ◽  
Rfid Tag ◽  
Tuning Method ◽  
Strip Lines ◽  
Folded Dipole ◽  
Outer Strip

This article describes the design of an Ultra-High Frequency (UHF) miniature folded dipole Radio Frequency Identification (RFID) tag antenna that can be mountable on metallic objects. The compact tag antenna is formed from symmetric C-shaped resonators connected with additional arms embedded into the outer strip lines for miniaturization purposes. It is loaded with outer strip lines, resulting in a flexible tuning method that is capable of matching the integrated circuit (IC) chip’s impedance. The proposed tag is fabricated on a single layer of Polytetrafluoroethylene (PTFE) substrate. It has simple structure and does not require any metallic vias or shorting plate. The miniature tag antenna with a size of 82.75 × 19.5 × 1.5   mm 3 yields a total realized gain of − 0.53   dB at the resonance frequency when attached to a 40 × 40   cm 2 metal plate. The presented design utilizes a European RFID band, and the simulated results of realized gain, read range, and input impedance are verified with measurement results.

Modelling the expected observations of the Advanced Ice Giants Net Flux Radiometer (IG-NFR) instrument concept, under study for future entry probe missions to Uranus or Neptune.

2020 ◽  
Author(s):  
Patrick Irwin ◽  
Simon Calcutt ◽  
Jack Dobinson ◽  
Juan Alday ◽  
Arjuna James ◽  
...  
Keyword(s):  
Radiative Transfer ◽  
Cross Sections ◽  
Integrated Circuit ◽  
Near Infrared ◽  
Complex Refractive Index ◽  
Radiation Energy ◽  
Discrete Ordinates ◽  
Detector Response ◽  
Net Flux

<p>The NASA Ice Giants Pre-Decadal Survey Mission Report (2017) recommended the high scientific importance of sending a mission with an orbiter and a probe to one of the Ice Giants, with preferential launch dates in the 2029-2034 timeframe. Such a mission concept is equally well supported by European scientists and Mousis et al (P&SS, 155, 12, 2018) give compelling scientific rationales for the exploration of these worlds with missions carrying in situ probes.</p> <p>In this presentation we will outline the conceptual design of the Advanced Ice Giants Net Flux Radiometer (IG-NFR) instrument, currently being designed by NASA Goddard Space Flight Center to make in situ observations of the upward and downward fluxes of solar and thermal radiation in the atmospheres of Uranus and Neptune. The IG-NFR is designed to: (i) accommodate seven filter bandpass channels in the spectral range 0.25-300 µm (ii) measure up and down radiation flux in a clear unobstructed 10° FOV for each channel; (iii) use thermopile detectors that can measure a change of flux of at least 0.5 W/m<sup>2</sup> per decade of pressure; (iv) view five distinct view angles (±80°, ±45°, and 0°); (v) predict the detector response with changing  temperature environment; (vi) use application-specific integrated circuit technology for the thermopile detector readout; (vii) be able to integrate radiance for 2s or longer, and (vii) sample each view angle including calibration targets. The IG-NFR system noise equivalent power at 298 K is 73 pW in a 1 Hz electrical bandwidth.</p> <p>We present initial simulations of the anticipated observations using two radiative transfer and retrieval tools, NEMESIS (Irwin et al., JQSRT, 109, 1136, 2008) and the Planetary Spectrum Generator (PSG, Villanueva et al., 2017, https://psg.gsfc.nasa.gov). For the NEMESIS modelling the radiative fluxes observable at varying pressure levels were calculated with a Matrix-Operator plane-parallel multiple-scattering model, using between 5 and 21 zenith angle quadrature points and up to 38 Fourier components for the azimuth decomposition. We also employed PSG to further validate our flux estimates, providing an important benchmarking and comparison test between both models. PSG solves the scattering radiative transfer employing the discrete ordinates method, with the scattering phase function described in terms of an expansion in terms of Legendre Polynomials. Molecular cross-sections are solved via the correlated-k method employing the latest HITRAN database (Gordon et al., 2017), which are completed with the latest collision-induced-absorption (CIA, Karman et al., 2019), and UV/optical cross-sections from the MPI database (Keller-Rudek et al., 2013). For the nominal case the Sun was assumed to be at an altitude of 10° above the horizon. The internal radiance field was calculated at each internal level for a standard reference Uranus atmosphere (e.g., Irwin et al., 2017) with the addition of a single cloud layer, based at 3 bar and composed of particles with a mean radius of 1.0 µm (and size variance 0.1) and assumed complex refractive index of 1.4 + 0.001i at all wavelengths. The opacity and fractional scale height of this cloud were fitted in both models to match the combined near-infrared observations of HST/WFC3, IRTF/SpeX and VLT/SINFONI analyzed by Irwin et al. (2017). The internal radiance fields were calculated from 0.4 to 300 µm using this atmospheric model.</p> <p>We will show how these simulations are being used to guide the choice of spectral filter bandwidths and centres to optimize the scientific return of such an instrument. We will show that observations with such an instrument can be used to constrain effectively the radiation energy budget in the atmospheres of the Ice Giants and can also be used to determine the pressures of cloud and haze layers and broadly constrain particle size. Such modelling also allows us to simulate the visible appearance of Uranus’ atmosphere during a descent and to perform detailed validations of the simulations by comparing the two radiative transfer models (NEMESIS and PSG).</p>

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