Preparation of a Wafer-level Micro Polymer Lens Array With Improved Performance Using a Low Cost Glass Mold

2013 ◽  
Vol 2013 (1) ◽  
pp. 000878-000882
Author(s):  
Mengying Ma ◽  
Shunjin Qin ◽  
Jintang Shang ◽  
Chunwei Zhang ◽  
Li Zhang ◽  
...  
Keyword(s):  
Low Cost ◽  
Uv Curing ◽  
Glass Mold ◽  
Wafer Level ◽  
Forming Process ◽  
Molding Process ◽  
Silicon Mold ◽  
Uv Curable ◽  
Improved Performance ◽  
Micro Lens

In our work, polymer-based micro lens arrays with spacers were innovativly fabricated by low cost wafer-level glass-silicon molds. The upper glass mold was prepared by a well-controlled hot forming process (HFP) combined with a chemical foaming process (CFP). The under silicon mold was formed by an etching process. Before dispensing UV-curable glue between the two concave molds, the contact surface should be coated with an anti-stick layer. After UV curing and de-molding, the micro lens arrays were successfully fabricated. The lenses were inspected by an atomic force microscope(AFM), a white light interferometer and a beam analyzer. The results demonstrate the excellent quality of surface roughness and optical characteristics. This study indicates the potential of this novel molding process for industrial production.

Formation of Barrier Ribs via Micro Molding Process Using UV-Curable Paste

2007 ◽  
Vol 534-536 ◽  
pp. 1029-1032
Author(s):  
Yong Seog Kim ◽  
Tae Gum Koh ◽  
Yoo Seong Kim
Keyword(s):  
Uv Curing ◽  
Processing Route ◽  
Curing Process ◽  
Plasma Display Panel ◽  
Molding Process ◽  
Uv Curable ◽  
Processing Cost ◽  
Plasma Display ◽  
Uv Curing Process ◽  
Sintering Shrinkage

In an attempt to reduce processing cost and to improve the resolution of PDPs, a micro mold transfer processing route for barrier ribs of plasma display panel was attempted. In this study, the parameters that may cause defects during the process were identified, which include the shrinkage during the UV curing process, stress due to the evaporation of organic components, and sintering shrinkage. Considering such parameters, a UV curable paste was developed and the barrier ribs of PDPs were successfully processed via the process. This work demonstrated the possibility of a build-up route in manufacturing barrier ribs of PDP

Design and Research of Blade for Poultry Indoor Ventilation

2014 ◽  
Vol 608-609 ◽  
pp. 806-810
Author(s):  
Xiao Ming Jiang
Keyword(s):  
Wind Turbine ◽  
Turbine Blade ◽  
Low Cost ◽  
Leaf Size ◽  
Design Parameters ◽  
Forming Process ◽  
Molding Process ◽  
Actual Operation ◽  
Design Requirements ◽  
Die Forming

According to the design requirements of indoor ventilation, use closed die forming process of low cost to product several types composite wind turbine blade, through actual operation experiments verify the effects of different design parameters on the fan running. The results showed that the leaf size, the molding process of precise, stable quality satisfies the equilibrium requirement.

Novel Mold-free Fan-out Wafer Level Package using Silicon Wafer

2016 ◽  
Vol 2016 (1) ◽  
pp. 000410-000414 ◽  
Author(s):  
Amit Kelkar ◽  
Vivek Sridharan ◽  
Khanh Tran ◽  
Kiyoko Ikeuchi ◽  
Anu Srivastava ◽  
...  
Keyword(s):  
Low Cost ◽  
Temperature Cycling ◽  
Wafer Level ◽  
Molding Process ◽  
Good Reliability ◽  
Molding Compound ◽  
Increasing Demand ◽  
Materials Used ◽  
Wafer Level Package ◽  
Levels Of Integration

Abstract The ever increasing demand for high levels of integration and miniaturization has created new transistor nodes, shrunk redistribution line width/space, and driven a reduction in solder bump pitch. This has created the need for Fan-out packaging. This paper presents a novel Fan-out Wafer level package which does not require use of molding process or materials used typically in such packages. In this technique, silicon is used as the carrier material instead of molding compound. Advantages of silicon include good reliability, high thermal stability, and low cost. This novel Mold-free Fan-out package passes standard reliability tests including temperature cycling (TCT), Drop test (DT), and Convection reflow.

Low temperature wafer level packaging technology of bulk-micromachined MEMS device

2010 ◽  
Vol 2010 (1) ◽  
pp. 000695-000702
Author(s):  
Heung Woo Park ◽  
Seung Hun Han ◽  
Hyun Kee Lee ◽  
Yeong Gyu Lee ◽  
Seoung Ho Kim ◽  
...  
Keyword(s):  
Low Temperature ◽  
Proof Mass ◽  
Low Cost ◽  
Lead Frame ◽  
Wafer Level ◽  
Molding Process ◽  
Packaging Technology ◽  
Mems Sensor ◽  
Polymer Adhesive ◽  
Asic Chip

New low temperature, low cost, small size packaging technology of novel bulk-micromachined MEMS sensor for mobile applications was developed. The sensor was fabricated with the bulk-micromachining process of SOI substrates and composed with a proof mass, membrane and electrodes for capacitance sensing. The sensor device was capped with very thin (130um-thickness) top and bottom silicon cap wafers which have a 80um-depth cavity. Top and bottom cap wafers were bonded with the sensor wafer with a low temperature curing polymer adhesive lower than 200°C. It is needed that the low temperature packaging technology and the passivation of top and bottom sides of the sensor for keeping the sensor performances and preventing stiction of the proof-mass during the molding processes. After bonding the three substrates, the top cap silicon was dry etched to expose bonding pads for the signal interconnection. The ASIC chip was polished to 75um-thickness, diced and bonded on a half-etched 200um-thick lead-frame with a DAF. The diced wafer-level-capped sensor was stacked on the ASIC, wire bonding was accomplished between the sensor and the ASIC, and the ASIC and the lead-frame and finally transfer molding process was done. The developed package is 24-leads QFN and the dimension is 4.0mm×4.0mm×1.1/1.2mm.

A Study on the Birefringence Measurement in Injection Molded Parts Using Two Different Laser Sources and R-G-B Separation of White Light

2006 ◽  
Vol 326-328 ◽  
pp. 187-190
Author(s):  
Jong Sun Kim ◽  
Chul Jin Hwang ◽  
Kyung Hwan Yoon
Keyword(s):  
White Light ◽  
Low Cost ◽  
Main Idea ◽  
Injection Molding Process ◽  
Molding Process ◽  
Laser Method ◽  
High Productivity ◽  
Molded Parts ◽  
Injection Molded ◽  
Plastic Parts

Recently, injection molded plastic optical products are widely used in many fields, because injection molding process has advantages of low cost and high productivity. However, there remains residual birefringence and residual stresses originated from flow history and differential cooling. The present study focused on developing a technique to measure the birefringence in transparent injection-molded optical plastic parts using two methods as follows: (i) the two colored laser method, (ii) the R-G-B separation method of white light. The main idea of both methods came from the fact that more information can be obtained from the distribution of retardation caused by different wavelengths. The comparison between two methods is demonstrated for the same sample of which retardation is up to 850 nm.

scholarly journals Double-Deck Metal Solenoids 3D Integrated in Silicon Wafer for Kinetic Energy Harvester

Micromachines ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 74
Author(s):  
Nianying Wang ◽  
Ruofeng Han ◽  
Changnan Chen ◽  
Jiebin Gu ◽  
Xinxin Li
Keyword(s):  
Kinetic Energy ◽  
Power Density ◽  
Energy Harvester ◽  
High Efficiency ◽  
Vibrational Energy ◽  
Average Power ◽  
Wafer Level ◽  
Peak Voltage ◽  
Silicon Mold ◽  
Casting Technique

A silicon-chip based double-deck three-dimensional (3D) solenoidal electromagnetic (EM) kinetic energy harvester is developed to convert low-frequency (<100 Hz) vibrational energy into electricity with high efficiency. With wafer-level micro electro mechanical systems (MEMS) fabrication to form a metal casting mold and the following casting technique to rapidly (within minutes) fill molten ZnAl alloy into the pre-micromachined silicon mold, the 300-turn solenoid coils (150 turns for either inner solenoid or outer solenoid) are fabricated in silicon wafers for saw dicing into chips. A cylindrical permanent magnet is inserted into a pre-etched channel for sliding upon external vibration, which is surrounded by the solenoids. The size of the harvester chip is as small as 10.58 mm × 2.06 mm × 2.55 mm. The internal resistance of the solenoids is about 17.9 Ω. The maximum peak-to-peak voltage and average power output are measured as 120.4 mV and 43.7 μW. The EM energy harvester shows great improvement in power density, which is 786 μW/cm3 and the normalized power density is 98.3 μW/cm3/g. The EM energy harvester is verified by experiment to be able to generate electricity through various human body movements of walking, running and jumping. The wafer-level fabricated chip-style solenoidal EM harvesters are advantageous in uniform performance, small size and volume applications.

Ultrasonic measurement of clamping force for injection molding machine

2019 ◽  
Vol 39 (4) ◽  
pp. 388-396 ◽  
Author(s):  
Peng Zhao ◽  
Yao Zhao ◽  
Jianfeng Zhang ◽  
Junye Huang ◽  
Neng Xia ◽  
...  
Keyword(s):  
Injection Molding ◽  
Measurement Method ◽  
Large Scale ◽  
Force Measurement ◽  
Low Cost ◽  
Ultrasonic Method ◽  
Injection Molding Process ◽  
Propagation Time ◽  
Clamping Force ◽  
Molding Process

AbstractAn online and feasible clamping force measurement method is important in the injection molding process and equipment. Based on the sono-elasticity theory, anin situclamping force measurement method using ultrasonic technology is proposed in this paper. A mathematical model is established to describe the relationship between the ultrasonic propagation time, mold thickness, and clamping force. A series of experiments are performed to verify the proposed method. Experimental findings show that the measurement results of the proposed method agree well with those of the magnetic enclosed-type clamping force tester method, with difference squares less than 2 (MPa)2and errors bars less than 0.7 MPa. The ultrasonic method can be applied in molds of different thickness, injection molding machines of different clamping scales, and large-scale injection cycles. The proposed method offers advantages of being highly accurate, highly stable, simple, feasible, non-destructive, and low-cost, providing significant application prospects in the injection molding industry.

UV-Curable organic-inorganic hybrid films based on tetraethylorthosilicate oligomer and special acrylated polyester

e-Polymers ◽  
2012 ◽  
Vol 12 (1) ◽  
Author(s):  
Jianyun He ◽  
Jinping Xiong ◽  
Bingqian Xia
Keyword(s):  
Uv Light ◽  
Uv Curing ◽  
Organic Matrix ◽  
Dynamic Mechanical Properties ◽  
Hybrid Films ◽  
Uv Curable ◽  
Inorganic Hybrid ◽  
Dynamic Mechanical ◽  
H Nmr ◽  
Uv Curing Process

AbstractOrganic-inorganic hybrid films were prepared using tetraethylorthosilicate (TEOS) oligomer and special acrylated polyester (SAP) via a UV-curing process. TEOS oligomers were prepared in the presence of water and ethanol using hydrochloric acid as the catalyst and characterized using 1H NMR, 29Si NMR and MALDI-TOF mass spectra. Special acrylated polyester was synthesized by 1,4-cyclohexane dimethanol, neopentyl glycol, 1,4-butanediol, maleic anhydride, adipic acid, and acrylic acid. Hybrid films were cured by UV light and the thermal properties, dynamic mechanical properties, and tensile properties of the hybrid films were evaluated as the function of TEOS oligomer content. The morphology of the hybrid films was examined using atomic force microscopy (AFM). The microscopy and dynamic mechanical data indicated that the hybrid films were heterogeneous materials with various inorganic particle sizes dispersed within the organic matrix. The results indicated that after incorporating the TEOS oligomer, the strength and thermal stability of the hybrid films were enhanced.

Wafer Level Glass Molding

2012 ◽  
Vol 523-524 ◽  
pp. 1001-1005 ◽  
Author(s):  
Martin Hünten ◽  
Daniel Hollstegge ◽  
Fritz Klocke
Keyword(s):  
Wafer Level ◽  
Molding Process ◽  
Optical Components ◽  
New Approach ◽  
Glass Molding ◽  
Wafer Scale ◽  
Precision Glass Molding

Manufacturing of micro optical components is approached with many different technologies. In this paper it is presented how the precision glass molding process is enabled to manufacture micro optical components made out of glass. In comparison to the existing glass molding technology the new approach aims for molding entire glass wafers including multiple micro optical components. It is explained which developments in the filed of simulation, mold manufacturing and molding were accomplished in order to enable the precision glass molding on wafer scale.

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