High-Voltage Stacked Diode Package

2015 ◽  
Vol 2015 (1) ◽  
pp. 000225-000230 ◽  
Author(s):  
Lauren Boteler ◽  
Alexandra Rodriguez ◽  
Miguel Hinojosa ◽  
Damian Urciuoli
Keyword(s):  
Silicon Carbide ◽  
High Voltage ◽  
Recovery Time ◽  
Load Test ◽  
Avalanche Breakdown ◽  
Electric Force ◽  
Inductive Load ◽  
Turn On ◽  
Series Configuration ◽  
Reverse Recovery Time

The Army is moving to a more electric force with a number of high-voltage applications. To support this transition, there have been efforts to develop high voltage (15–30 kV) single-die 4H-silicon carbide (SiC) bipolar switches and diodes. However, packaging these high-voltage devices has proven to be challenging since standard packaging methods cannot withstand the high voltages in a compact form. Therefore, this work aims to develop a compact prototype package with improved size, weight, and power density by stacking diodes. The stacked diode approach allows elimination of almost half of the wirebonds, reduces the board size by 45%, and reduces the package inductance. A module has been designed, fabricated, and tested which is the first 30 kV module reported in the literature to stack two high-voltage diodes in a series configuration. The package has a number of features specific to high-voltage packaging including (1) two fins that extend the perimeter of the package to mitigate shorting, and (2) all the leads were designed with rounded corners to minimize voltage crowding. Hi-pot tests were performed on the unpopulated package and showed the package can withstand 30 kV without breaking down. The completed package with the stacked diodes showed avalanche breakdown occurring at 29 kV. The complete package was then compared to an equivalent discrete diode module and showed a 10X reduction in size. During a clamped-inductive load test the stacked diodes showed lower parasitic capacitance, faster reverse recovery time, and lower turn on energy as compared to the discrete diode packages.

Application of Silicon Carbide Diode in Ultrasound High Voltage Pulse Protection Circuit

2013 ◽  
Vol 290 ◽  
pp. 115-119
Author(s):  
Shi Yuan Zhou ◽  
Kai Zhang ◽  
Dinguo Xiao ◽  
Chun Guang Xu ◽  
Bo Yang
Keyword(s):  
Silicon Carbide ◽  
Schottky Barrier ◽  
High Voltage ◽  
Voltage Pulse ◽  
Recovery Time ◽  
High Performance ◽  
High Voltage Pulse ◽  
Protection Level ◽  
Protection Circuit ◽  
Reverse Recovery Time

SiC diode (Silicon Carbide Diode) is a newly commercial available Schottky barrier diode with zero reverse-recovery-time, which is a perfect candidate for fabricating high voltage pulse protection circuit in ultrasonic transceiver system. With SiC diode’s high performance, the circuit can deliver 400 volts or higher voltage protection level, which is not an easy job for other kind of diodes. In this article, the theory of diode-bridge protection circuit is briefly discussed, and a SiC diode-bridge protection circuit was fabricated, and some experiments has been done to verify the feasibility of using SiC diodes in diode-bridge protection circuit.

High Voltage and Fast Switching Reverse Recovery Characteristics of 4H-SiC PiN Diode

2014 ◽  
Vol 778-780 ◽  
pp. 841-844 ◽  
Author(s):  
Koji Nakayama ◽  
Shuji Ogata ◽  
Toshihiko Hayashi ◽  
Tetsuro Hemmi ◽  
Atsushi Tanaka ◽  
...  
Keyword(s):  
High Voltage ◽  
Recovery Time ◽  
Carrier Lifetime ◽  
Low Voltage ◽  
Reduction Rate ◽  
Drift Region ◽  
Pin Diode ◽  
Fully Depleted ◽  
Fast Switching ◽  
Reverse Recovery Time

The reverse recovery characteristics of a 4H-SiC PiN diode under higher voltage and faster switching are investigated. In a high-voltage 4H-SiC PiN diode, owing to an increased thickness, the drift region does not become fully depleted at a relatively low voltage Furthermore, an electron–hole recombination must be taken into account when the carrier lifetime is equal to or shorter than the reverse recovery time. High voltage and fast switching are therefore needed for accurate analysis of the reverse recovery characteristics. The current reduction rate increases up to 2 kA/μs because of low stray inductance. The maximum reverse voltage during the reverse recovery time reaches 8 kV, at which point the drift layer is fully depleted. The carrier lifetime at the high level injection is 0.086 μs at room temperature and reaches 0.53 μs at 250 °C.

Performance of 60 A, 1200 V 4H-SiC DMOSFETs

2009 ◽  
Vol 615-617 ◽  
pp. 749-752 ◽  
Author(s):  
Brett A. Hull ◽  
Charlotte Jonas ◽  
Sei Hyung Ryu ◽  
Mrinal K. Das ◽  
Michael J. O'Loughlin ◽  
...  
Keyword(s):  
Threshold Voltage ◽  
Power Dissipation ◽  
Avalanche Breakdown ◽  
Large Area ◽  
Leakage Currents ◽  
Inductive Load ◽  
Turn On ◽  
Load Circuit

Large area (8 mm x 7 mm) 1200 V 4H-SiC DMOSFETs with a specific on-resistance as low as 9 m•cm2 (at VGS = 20 V) able to conduct 60 A at a power dissipation of 200 W/cm2 are presented. On-resistance is fairly stable with temperature, increasing from 11.5 m•cm2 (at VGS = 15 V) at 25°C to 14 m•cm2 at 150°C. The DMOSFETs exhibit avalanche breakdown at 1600 V with the gate shorted to the source, although sub-breakdown leakage currents up to 50 A are observed at 1200 V and 200°C due to the threshold voltage lowering with temperature. When switched with a clamped inductive load circuit from 65 A conducting to 750 V blocking, the turn-on and turn-off energies at 150°C were less than 4.5 mJ.

Static and Dynamic Characteristics of SiC MOSFETs and SBDs for 3.3 kV 400 A Full SiC Modules

2015 ◽  
Vol 821-823 ◽  
pp. 592-595 ◽  
Author(s):  
Keiji Wada ◽  
Hideto Tamaso ◽  
Satomi Itoh ◽  
Kenji Kanbara ◽  
Toru Hiyoshi ◽  
...  
Keyword(s):  
Power Systems ◽  
High Voltage ◽  
Dynamic Characteristics ◽  
Static Characteristics ◽  
Drain Voltage ◽  
Inductive Load ◽  
Static And Dynamic Characteristics ◽  
Edge Termination ◽  
Turn On ◽  
Igbt Modules

Characteristics of SiC MOSFETs and SBDs with 3.3 kV-class have been presented. Static Characteristics of the MOSFET showed a specific on-resistance of 14.2 mΩ cm2. A breakdown voltage of 3850 V is obtained by using the dose optimized edge termination structure as we have previously reported [1]. At the same time, reverse leakage current of the 3.3 kV SiC SBDs can be suppressed by the JBS structure and the edge termination which is also used in the MOSFETs. By using the MOSFETs and SBDs, we have demonstrated the superior capability of the 3.3 kV 400 A full SiC 2 in 1 modules with a compatible case and terminal configurations to Si IGBT modules. Dynamic characteristics of the full SiC module in an inductive load switching exhibits superior turn-on and turn-off properties even at a high drain voltage of 1650 V, demonstrating the availability of high voltage SiC power systems.

scholarly journals High Voltage Diffusion-Welded Stacks on the Basis of SiC Schottky Diodes

2016 ◽  
Vol 858 ◽  
pp. 790-794 ◽  
Author(s):  
Oleg Korolkov ◽  
Natalja Sleptsuk ◽  
Paul Annus ◽  
Raul Land ◽  
Toomas Rang
Keyword(s):  
Vertical Integration ◽  
High Voltage ◽  
Recovery Time ◽  
Analytical Approach ◽  
Schottky Diodes ◽  
Reverse Current ◽  
Estimation Of Parameters ◽  
Reverse Voltage ◽  
Zero Bias ◽  
Reverse Recovery Time

In the present work we have considered the prototype of the high-voltage diode stack made on the basis of commercial SiC Schottky diodes. Implementation of vertical integration for four diode chips yielded stack with the reverse current of 25 μA under reverse voltage of 6 kV. The capacitance of the stack at zero bias is reduced more than three times in comparison with initial diodes. Reverse recovery time of the stack was 8.0 ns. This paper proposes a convenient analytical approach to the estimation of parameters of modular compositions with vertical architecture.

Fabrication and Application of 1.7KV SiC-Schottky Diodes

2015 ◽  
Vol 821-823 ◽  
pp. 579-582 ◽  
Author(s):  
Gang Chen ◽  
Song Bai ◽  
A. Liu ◽  
Lin Wang ◽  
Run Hua Huang ◽  
...  
Keyword(s):  
Recovery Time ◽  
Doping Concentration ◽  
Schottky Diodes ◽  
Device Structure ◽  
Reverse Voltage ◽  
Turn On ◽  
Forward Current ◽  
State Resistance ◽  
Drift Layer ◽  
Reverse Recovery Time

High voltage 4H-SiC Ti Schottky junction barrier schottky (JBS) diode with breakdown voltage of 1700 V and forward current of 5 A has been fabricated. A low reverse leakage current below 3.8×10-5A/cm2at the bias voltage of -1700 V has been obtained. The forward on-state current was 5 A at VF= 1.7 V and 15.8 A at VF= 3 V. The active area is 1.5 mm × 1.5 mm. The turn-on voltage is about 0.9 V. The on-state resistance is 3.08 mΩ·cm2. The doping and thickness of the N-type drift layer and the device structure have been performed by numerical simulations. The SiC JBS devices have been fabricated and the processes were in detail. The die was assembled in a TO-220 package. The thickness of the N- epilayer is 17 µm, and the doping concentration is 3.2 × 1015cm−3. The number of floating guard p-rings was chosen to be 25, the distance between the rings was chosen to be 0.7 µm ~ 1.3 µm and the width of the p-rings is 2.5 µm. We use the PECVD SixNy/SiO2as the passivation dielectric and a non photosensitive polyamide as the passivation in the end. The reverse recovery current Irwas 1.26A and the reverse recovery time Trrwas 26ns when the diode was switched from 5A forward current to a reverse voltage of 700V. The reverse recovery electric charge Qrrof 16nC was obtained.

Superior Short Circuit Performance of 1.2kV SiC JBSFETs Compared to 1.2kV SiC MOSFETs

2019 ◽  
Vol 963 ◽  
pp. 797-800 ◽  
Author(s):  
Ajit Kanale ◽  
Ki Jeong Han ◽  
B. Jayant Baliga ◽  
Subhashish Bhattacharya
Keyword(s):  
High Temperature ◽  
Short Circuit ◽  
Switching Loss ◽  
Switching Circuit ◽  
Inductive Load ◽  
Circuit Performance ◽  
Switching Performance ◽  
Turn On ◽  
Switching Losses ◽  
High Side

The high-temperature switching performance of a 1.2kV SiC JBSFET is compared with a 1.2kV SiC MOSFET using a clamped inductive load switching circuit representing typical H-bridge inverters. The switching losses of the SiC MOSFET are also evaluated with a SiC JBS Diode connected antiparallel to it. Measurements are made with different high-side and low-side device options across a range of case temperatures. The JBSFET is observed to display a reduction in peak turn-on current – up to 18.9% at 150°C and a significantly lesser turn-on switching loss – up to 46.6% at 150°C, compared to the SiC MOSFET.

X-band Silicon Carbide IMPATT Oscillator

2001 ◽  
Vol 680 ◽  
Author(s):  
Konstantin V. Vassilevski ◽  
Alexandr V. Zorenko ◽  
Konstantinos Zekentes
Keyword(s):  
Silicon Carbide ◽  
Pulse Duration ◽  
Output Power ◽  
Pulse Current ◽  
Input Pulse ◽  
Threshold Current ◽  
Avalanche Breakdown ◽  
X Band

ABSTRACTPulsed X-band (8.2 - 12.4 GHz) IMPATT oscillators have been fabricated and characterized. They utilized 4H-SiC diodes with single drift p+-n-n+ structures and avalanche breakdown voltages of about 290 V. The microwave oscillations appeared at a threshold current of 0.3 A. The maximum measured output power was about 300 mW at input pulse current of 0.35 A and pulse duration of 40 ns.

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