scholarly journals Epoxy solder paste and its applications

2015 ◽  
Vol 33 (3) ◽  
pp. 32-39 ◽  
Author(s):  
Jong-Tae Moon ◽  
Yong-Sung Eom ◽  
Jong-Hyun Lee
Keyword(s):  
Solder Paste ◽  
Epoxy Solder

scholarly journals Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate

Materials ◽  
2019 ◽  
Vol 12 (6) ◽  
pp. 936 ◽  
Author(s):  
Min-Soo Kang ◽  
Do-Seok Kim ◽  
Young-Eui Shin
Keyword(s):  
Intermetallic Compound ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Solder Paste ◽  
Shear Tests ◽  
Sac305 Solder ◽  
Epoxy Solder ◽  
The Relationship ◽  
Bonding Characteristics ◽  
Preventive Effects

This study investigated the suppression of the growth of the intermetallic compound (IMC) layer that forms between epoxy solder joints and the substrate in electronic packaging by adding graphene nano-sheets (GNSs) to 96.5Sn–3.0Ag–0.5Cu (wt %, SAC305) solder whose bonding characteristics had been strengthened with a polymer. IMC growth was induced in isothermal aging tests at 150 °C, 125 °C and 85 °C for 504 h (21 days). Activation energies were calculated based on the IMC layer thickness, temperature, and time. The activation energy required for the formation of IMCs was 45.5 KJ/mol for the plain epoxy solder, 52.8 KJ/mol for the 0.01%-GNS solder, 62.5 KJ/mol for the 0.05%-GNS solder, and 68.7 KJ/mol for the 0.1%-GNS solder. Thus, the preventive effects were higher for increasing concentrations of GNS in the epoxy solder. In addition, shear tests were employed on the solder joints to analyze the relationship between the addition of GNSs and the bonding characteristics of the solder joints. It was found that the addition of GNSs to epoxy solder weakened the bonding characteristics of the solder, but not critically so because the shear force was higher than for normal solder (i.e., without the addition of epoxy). Thus, the addition of a small amount of GNSs to epoxy solder can suppress the formation of an IMC layer during isothermal aging without significantly weakening the bonding characteristics of the epoxy solder paste.

scholarly journals Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment

Crystals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 733
Author(s):  
Lu Liu ◽  
Songbai Xue ◽  
Ruiyang Ni ◽  
Peng Zhang ◽  
Jie Wu
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Composite Solder ◽  
Solder Joints ◽  
Solder Paste ◽  
Epoxy System ◽  
Mechanical Reinforcement ◽  
Microstructure Observation ◽  
Temperature And Humidity ◽  
Thermosetting Epoxy

In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 °C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from −40 °C to 125 °C for 1000 cycles were investigated. Compared to the Sn–Bi solder joint, the TSEP Sn–Bi solder joints had increased reliability. The microstructure observation shows that the epoxy resin curing process did not affect the transformation of the microstructure. The shear force of the TSEP Sn–Bi solder joints after 1000 cycles of thermal cycling test was 1.23–1.35 times higher than the Sn–Bi solder joint and after 1000 h of temperature and humidity tests was 1.14–1.27 times higher than the Sn–Bi solder joint. The fracture analysis indicated that the cured cover layer could still have a mechanical reinforcement to the TSEP Sn–Bi solder joints after these reliability tests.

scholarly journals Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components

Materials ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3353
Author(s):  
Marina Makrygianni ◽  
Filimon Zacharatos ◽  
Kostas Andritsos ◽  
Ioannis Theodorakos ◽  
Dimitris Reppas ◽  
...  
Keyword(s):  
High Resolution ◽  
Form Factors ◽  
Circuit Board ◽  
Lead Free ◽  
Process Conditions ◽  
Solder Paste ◽  
Electronic Components ◽  
Successful Operation ◽  
Fine Pitch ◽  
Forward Transfer

Current challenges in printed circuit board (PCB) assembly require high-resolution deposition of ultra-fine pitch components (<0.3 mm and <60 μm respectively), high throughput and compatibility with flexible substrates, which are poorly met by the conventional deposition techniques (e.g., stencil printing). Laser-Induced Forward Transfer (LIFT) constitutes an excellent alternative for assembly of electronic components: it is fully compatible with lead-free soldering materials and offers high-resolution printing of solder paste bumps (<60 μm) and throughput (up to 10,000 pads/s). In this work, the laser-process conditions which allow control over the transfer of solder paste bumps and arrays, with form factors in line with the features of fine pitch PCBs, are investigated. The study of solder paste as a function of donor/receiver gap confirmed that controllable printing of bumps containing many microparticles is feasible for a gap < 100 μm from a donor layer thickness set at 100 and 150 μm. The transfer of solder bumps with resolution < 100 μm and solder micropatterns on different substrates, including PCB and silver pads, have been achieved. Finally, the successful operation of a LED interconnected to a pin connector bonded to a laser-printed solder micro-pattern was demonstrated.

Solder Paste Transfer Via Pattern Tape Technology

2020 ◽  
Author(s):  
Yam Lip Huei ◽  
Lo Yee Ting ◽  
Chong Kim Hui ◽  
B. Senthil Kumar ◽  
Chan Li-San ◽  
...  
Keyword(s):  
Solder Paste

Selecting the Parameters for Brazing 08 Steel with Pure Copper Solder Paste

2010 ◽  
Vol 426-427 ◽  
pp. 432-435
Author(s):  
De Gong Chang ◽  
J. Zhang ◽  
M.L. Lv
Keyword(s):  
Carbon Steel ◽  
Filler Metal ◽  
Pure Copper ◽  
Low Carbon Steel ◽  
Solder Paste ◽  
Low Carbon ◽  
Technical Parameters ◽  
And Performance ◽  
Steel Joints ◽  
The Ideal

The larger variation of the construction and performance of the low-carbon steel joints was caused by the high temperature of the puddle welding of the joint. Therefore, the braze welding rather than the puddle welding was applied to the welding production of low-carbon steel. The 08 steel parts were joined in a furnace using pure copper solder paste as brazing filler metal. According to the obtained results, the ideal technical parameters are as follow: brazing temperature: 1100-1150°C; holding time: 5-10min; joint clearance: 0.03-0.05mm.

scholarly journals Application of ZnO Nanoparticles in Sn99Ag0.3 Cu0.7-Based Composite Solder Alloys

Nanomaterials ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 1545
Author(s):  
Agata Skwarek ◽  
Olivér Krammer ◽  
Tamás Hurtony ◽  
Przemysław Ptak ◽  
Krzysztof Górecki ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Zno Nanoparticles ◽  
Composite Solder ◽  
Void Formation ◽  
Particle Sizes ◽  
Solder Paste ◽  
Solder Alloys ◽  
Ion Microscopy ◽  
Zno Ceramics ◽  
Thermoelectric Parameters

The properties of Sn99Ag0.3Cu0.7 (SACX0307) solder alloy reinforced with ZnO nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm. They were added to a solder paste at a ratio of 1.0 wt %. The wettability, the void formation, the mechanical strength, and the thermoelectric parameters of the composite solder alloys/joints were investigated. Furthermore, microstructural evaluations were performed using scanning electron and ion microscopy. ZnO nanoparticles decreased the composite solder alloys’ wettability, which yielded increased void formation. Nonetheless, the shear strength and the thermoelectric parameters of the composite solder alloy were the same as those of the SACX0307 reference. This could be explained by the refinement effects of ZnO ceramics both on the Sn grains and on the Ag3Sn and Cu6Sn5 intermetallic grains. This could compensate for the adverse impact of lower wettability. After improving the wettability, using more active fluxes, ZnO composite solder alloys are promising for high-power applications.

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