Нелегированный высокоомный буферный слой GaN для HEMT AlGaN/GaN

In this paper the possibility of obtaining the intentionally undoped high resistance GaN buffer layers in AlGaN/GaN heterostructures with high electron mobility for transistors by ammonia molecular beam epitaxy was demonstrated. The growth conditions based on background impurity concentrations and point defects calculations for different gallium and ammonia flows ratios were optimized.

Background Impurity Reduction and Iron Doping of Gallium Nitride Wafers

ABSTRACTBackground impurities and the resulting electrical characteristics were studied for GaN wafers grown using hydride vapor phase epitaxy at various growth conditions. The electron concentration was found to decrease with increasing GaN thickness, by orders of magnitude in the first few microns of growth, but continuing gradually for thousands of microns. Physical removal of the backside degenerate layer enabled improved analysis of the electrical properties. Secondary ion mass spectroscopy was used to determine that the presence of oxygen and silicon accounted for the electron concentration for unintentionally n-type doped material. The concentration of oxygen was found to vary more than that of silicon and increased with decreasing growth temperature. The resistivity was measured to be as high as 1 ohm-cm, corresponding to a carrier concentration of 1016 cm−3. Iron was demonstrated to effectively compensate the residual donors and increased the resistivity to greater than 109 ohm-cm at room temperature and greater than 3×105 ohm-cm at 250 °C. An activation energy for the iron-doped GaN was determined by variable temperature resistivity measurements to be 0.51 eV.

SAMPLE DEPENDENCE OF THE DENSITY OF STATES IN HETEROJUNCTIONS IN STRONG MAGNETIC FIELDS

A detailed theoretical study of the sample dependence of the Density of States (DOS) in a strong and transverse magnetic field is presented for AlGaAs/GaAs heterojunctions and for low-temepratures. The DOS is calculated self-consistently by including electron interactions with background and remote impurities and with deformation-potential and piezoelectric acoustic-phonons. The Landau-level (LL) mixing and the energy shift are taken into account. A significant background DOS between different LL’s results from remote-impurity scattering, and it can be observed for a heterojunction sample with: (1) a relatively low-mobility; (2) the low background impurity concentration; (3) an intermediate spacer distance; and (4) a large spin g-factor. The background DOS decreases with increasing magnetic field and/or electron energy. Applying the self-consistent DOS to the calculation of the thermodynamic quantities such as specific heat, a very good agreement with the experimental results is found.

Growth of High Quality (In,Ga,Al)N/GaN Heterostructure Materials and Devices by Atmospheric Pressure MOCVD

Using atmospheric pressure MOCVD we have obtained high quality InGaN/GaN and AlGaN/GaN heterostructure materials and devices. For nominally undoped 4 μm thick GaN films, we obtained 300 K mobilities of 780 cm2/Vs and an unintentional background impurity level of n300K = 6*1016 cm−3. For InGaN/GaN heterostructures we have obtained direct band-edge transitions with FWHM as narrow as 7.9 nm (59 meV) for 50Å thick In0.16Ga0.84N quantum wells at 300K, which is the among the best reported values. The quantum wells display energy shifts towards shorter wavelength with decreasing well thickness, and the shift agrees with predicted quantum effects. These materials have been incorporated into InGaN single quantum well LEDs that emit at 450 nm. In addition AlGaN/GaN heterostructure materials have been incorporated into HFETs and MODFETs. Gate-drain breakdown voltage well exceeding 100 V, and extrinsic transconductance gm of up to 140 mS/mm were realized in the MODFET.

Formation of Shallow Energy Levels in Mn+ Implanted GaAs with Extremely Low Background Impurity Concentration

ABSTRACTManganese ions implantation into ultrapure GaAs layers grown by molecular beam epitaxy were investigated by photoluminescence technique systematically in a wide range of manganese concentration up to 1×1020cm-3. Five shallow emission bands denoted by (Mn°, X), “G”, “G' “ “H” and (D, A)2 are formed in the implanted layers in addition to the well known Mn impurity related emission at ~880nm. With increasing manganese concentration to 1×1019cm-3, “G” exhibits no energy shift, suggesting that “G” is different from the behavior of [g-g] emission that is commonly formed in shallow acceptor (such as C) incorporated ultrapure GaAs. (Mn°, X), “G” and “G' “ present no energy shift with increasing excitation intensity, while “H” and (D, A)2 indicate peak energy shift greatly showing typical donor-acceptor pair characteristics. “G” and (Mn°, X) are found to hold similar radiative origin which is different from “G”. Temperature dependence measurement reveals that emission “G” has a thermal activation energy of 5.4meV.

Growth of Heterojunction Bipolar Transistors by Metalorganic Molecular Beam Epitaxy

ABSTRACTHeterojunction bipolar transistors (HBTs) are becoming increasingly important for highspeed electronic applications. This paper will discuss how the unique growth chemistry of metalorganic molecular beam epitaxy (MOMBE) can be used to produce high performance HBTs. For example, it has been well documented that MOMBE's ability to grow heavily doped, well-confined layers of either n- or p-type is a significant advantage for this device. This feature arises primarily from the ability to use gaseous dopant sources in the absence of interfacial gas boundary layers. While this is an advantage for doping, it can be a disadvantage in other areas such as AlGaAs purity or InGaP lattice matching. This paper will discuss how these difficulties can be overcome through the use of novel Al or Ga precursors thus allowing deposition of high quality GaAs-based HBTs. By using trimethylamine alane (TMAA), background impurity concentrations can be reduced substantially. Further improvements in purity require cleaner Ga precursors or alternatively novel Ga substitutes. The resulting reduction in compensation allows for the use of lower dopant concentrations in the AlGaAs thus producing significant improvement in the leakage behavior of the base-emitter junction. Even further improvement can be achieved through the use of InGaP. Using novel Ga precursors, such as tri-isobutylgallium (TIBG), the problems associated with the sensitivity of composition to growth temperature are greatly reduced, allowing for the reproducible deposition of devices containing InGaP emitter layers.