An Overview of 3D X-Ray Reconstruction Algorithms for PCB Inspection

2020 ◽  
Author(s):  
Alexandra Roberts ◽  
John True ◽  
Nathan T. Jessurun ◽  
Dr. Navid Asadizanjani
Keyword(s):  
Open Source ◽  
Printed Circuit Boards ◽  
Critical Role ◽  
Reconstruction Algorithms ◽  
X Ray ◽  
Reconstruction Methods ◽  
Verification Methods ◽  
Pcb Manufacturing ◽  
Micro Tomography ◽  
The Government

Abstract Printed Circuit Boards (PCBs) play a critical role in everyday electronic systems, therefore the quality and assurance of the functionality for these systems is a topic of great interest to the government and industry. PCB manufacturing has been largely outsourced to cut manufacturing costs in comparison with the designing and testing of PCBs which still retains a large presence domestically. This offshoring of manufacturing has created a surge in the supply chain vulnerability for potential adversaries to garner access and attack a device via a malicious modification. Current hardware assurance and verification methods are based on electrical and optical tests. These tests are limited in the detection of malicious hardware modifications, otherwise known as Hardware Trojans. For PCB manufacturing there has been an increase in the use of automated X-ray inspection. These inspections can validate a PCB’s functionality during production. Such inspections mitigate process errors in real time but are unable to perform highresolution characterization on multi-layer fully assembled PCBs. In this paper, several X-ray reconstruction methods, ranging from proprietary to open-source, are compared. The high-fidelity, commercial NRecon software for SkyScan 2211 Multi-scale X-ray micro-Tomography system is compared to various methods from the ASTRA Toolbox. The latter is an open-source, transparent approach to reconstruction via analytical and iterative methods. The toolbox is based on C++ and MEX file functions with MATLAB and Python wrappers for analysis of PCB samples. In addition, the differences in required imaging parameters and the resultant artifacts generated by planar PCBs are compared to the imaging of cylindrical biological samples. Finally, recommendations are made for improving the ASTRA Toolbox reconstruction results and guidance is given on the appropriate scenarios for each algorithm in the context of hardware assurance for PCBs.

scholarly journals Beam Hardening Artifact Reduction in X-Ray CT Reconstruction of 3D Printed Metal Parts Leveraging Deep Learning and CAD Models

2020 ◽  
Author(s):  
Amirkoushyar Ziabari ◽  
Singanallur Venkatakrishnan ◽  
Michael Kirka ◽  
Paul Brackman ◽  
Ryan Dehoff ◽  
...  
Keyword(s):  
Computer Aided Design ◽  
Critical Role ◽  
Simulated Data ◽  
Data Sets ◽  
Ct Reconstruction ◽  
Reconstruction Algorithms ◽  
Beam Hardening ◽  
X Ray ◽  
Cad Models ◽  
Aided Design

Abstract Nondestructive evaluation (NDE) of additively manufactured (AM) parts is important for understanding the impacts of various process parameters and qualifying the built part. X-ray computed tomography (XCT) has played a critical role in rapid NDE and characterization of AM parts. However, XCT of metal AM parts can be challenging because of artifacts produced by standard reconstruction algorithms as a result of a confounding effect called “beam hardening.” Beam hardening artifacts complicate the analysis of XCT images and adversely impact the process of detecting defects, such as pores and cracks, which is key to ensuring the quality of the parts being printed. In this work, we propose a novel framework based on using available computer-aided design (CAD) models for parts to be manufactured, accurate XCT simulations, and a deep-neural network to produce high-quality XCT reconstructions from data that are affected by noise and beam hardening. Using extensive experiments with simulated data sets, we demonstrate that our method can significantly improve the reconstruction quality, thereby enabling better detection of defects compared with the state of the art. We also present promising preliminary results of applying the deep networks trained using CAD models to experimental data obtained from XCT of an AM jet-engine turbine blade.

scholarly journals Evaluation of the Possibility of Applying Spatial 3D Imaging Using X-Ray Computed Tomography Reconstruction Methods for Quantitative Analysis of Multiphase Materials / Rentgenowska Analiza Ilościowa Materiałów Wielofazowych Z Wykorzystaniem Przestrzennego Obrazowania (3D) Przy Użyciu Metod Rekonstrukcji Tomografii Komputerowej

2015 ◽  
Vol 60 (4) ◽  
pp. 2663-2670
Author(s):  
P. Matysik ◽  
M. Chojnacki ◽  
S. Jóźwiak ◽  
T. Czujko ◽  
S. Lipiński
Keyword(s):  
Computed Tomography ◽  
Quantitative Analysis ◽  
Glass Fibers ◽  
X Ray Diffraction ◽  
X Ray ◽  
Multiphase Materials ◽  
Reconstruction Methods ◽  
Verification Methods ◽  
X Ray Computed ◽  
Ti Powder

In this paper the possibility of using X-ray computed tomography (CT) in quantitative metallographic studies of homogeneous and composite materials is presented. Samples of spheroidal cast iron, Fe-Ti powder mixture compact and epoxy composite reinforced with glass fibers, were subjected to comparative structural tests. Volume fractions of each of the phase structure components were determined by conventional methods with the use of a scanning electron microscopy (SEM) and X-ray diffraction (XRD) quantitative analysis methods. These results were compared with those obtained by the method of spatial analysis of the reconstructed CT image. Based on the comparative analysis, taking into account the selectivity of data verification methods and the accuracy of the obtained results, the authors conclude that the method of computed tomography is suitable for quantitative analysis of several types of structural materials.

Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Micro-Joints by Synchrotron Radiation X-Ray Micro-Tomography

2005 ◽  
Author(s):  
Toshihiko Sayama ◽  
Hiroyuki Tsuritani ◽  
Kentaro Uesugi ◽  
Akira Tsuchiyama ◽  
Tsukasa Nakano ◽  
...  
Keyword(s):  
Synchrotron Radiation ◽  
Solder Ball ◽  
Printed Circuit Boards ◽  
Thermal Strain ◽  
Ct Images ◽  
Linear Attenuation Coefficient ◽  
Phase Growth ◽  
Eutectic Solder ◽  
X Ray ◽  
Micro Tomography

In high-density packaging technology, one of the most important problems is reliability of the micro-joints connecting LSI (Large Scale Integrated Circuit) chips to PCBs (Printed Circuit Boards) electrically and mechanically. Development of nondestructive testing methods with high spatial resolution is expected to enhance the reliability. Our research group has developed an X-ray micro-tomography system called SP-μCT at the beamline BL47XU in SPring-8, the largest synchrotron radiation facility in Japan. In this work, SP-μCT was applied to three-dimensional evaluation of microstructure evolution; that is, phase growth due to thermal cyclic loading in solder ball micro-joints. Simulating solder micro-joints used in a flip chip, specimens were fabricated by joining a Sn-Pb eutectic solder ball 100 μm in diameter to a steel pin in the usual reflow soldering process. The phase growth process was determined by observation of the CT images obtained consecutively at the fixed point of the target joining. In the reconstructed CT images, the distribution of the constituent phases in Sn-Pb eutectic solder was identified based on the estimation value of the X-ray linear attenuation coefficient. The following results were obtained. First, each phase involves not dispersing particles but a three-dimensionally monolithic structure just like a sponge. Second, the phase growth proceeds in such a way that the average phase size to the 4th power increases proportionally to the number of cycles. Finally, in the vicinity of the joining interface, more rapid phase growth occurs in comparison to the other regions because local thermal strain due to the mismatch of thermal expansion leads to remarkable phase growth. Consequently, the microstructure images obtained by SP-μCT bring us useful information to evaluate the reliability of micro-joints.

Coating-Based PCB Protection against Tampering, Snooping, EM Attack, and X-ray Reverse Engineering

2018 ◽  
Author(s):  
Haoting Shen ◽  
M Tanjidur Rahman ◽  
Navid Asadizanjani ◽  
Mark Tehranipoor ◽  
Swarup Bhunia
Keyword(s):  
Integrated Circuits ◽  
Reverse Engineering ◽  
Printed Circuit Boards ◽  
Economic Trend ◽  
Circuit Boards ◽  
X Ray ◽  
Active Defense ◽  
Non Invasive ◽  
Pcb Manufacturing ◽  
Cost Efficient

Abstract In the last decades, the supply chain of printed circuit boards (PCBs) becomes distributed with growing complexity of PCB designs and the economic trend of outsourcing the PCB manufacturing. This makes the PCBs more vulnerable to security attacks, such as tampering, snooping, and electromagnetic (EM) attacks. Because of the large feature size of PCBs (compared to integrated circuits), it is challenging to protect the PCBs from those attacks or proof the suspected attacks. For the same reason, PCBs are vulnerable to non-invasive reverse engineering by X-ray tomography as well. In this paper, we propose a novel silicon carbide (SiC) coating technique to provide passive protection for PCBs from in-field tampering, snooping and EM attacks. In addition, capacitive sensors are designed based on the SiC coating, offering active defense against those attacks. The coating and sensors can be implemented on PCBs in cost-efficient ways and the area overheads are minimized. The insulating coating also allows an extra tungsten-based painting to be applied to prevent the X-ray reverse engineering.

X-ray micro tomography in the scanning electron microscope

1978 ◽  
Vol 36 (1) ◽  
pp. 106-107 ◽  
Author(s):  
W. Brünger
Keyword(s):  
Electron Beam ◽  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Target Surface ◽  
The Body ◽  
X Rays ◽  
Cross Sectional ◽  
X Ray ◽  
Micro Tomography ◽  
Scanning Electron

Reconstructive tomography is a new technique in diagnostic radiology for imaging cross-sectional planes of the human body /1/. A collimated beam of X-rays is scanned through a thin slice of the body and the transmitted intensity is recorded by a detector giving a linear shadow graph or projection (see fig. 1). Many of these projections at different angles are used to reconstruct the body-layer, usually with the aid of a computer. The picture element size of present tomographic scanners is approximately 1.1 mm2.Micro tomography can be realized using the very fine X-ray source generated by the focused electron beam of a scanning electron microscope (see fig. 2). The translation of the X-ray source is done by a line scan of the electron beam on a polished target surface /2/. Projections at different angles are produced by rotating the object.During the registration of a single scan the electron beam is deflected in one direction only, while both deflections are operating in the display tube.

X-Ray Nanotomography (XRMT) Tool for Non-Destructive High-Resolution Imaging of ICs

2001 ◽  
Author(s):  
Wenbing Yun ◽  
Steve Wang ◽  
David Scott ◽  
Kenneth W. Nill ◽  
Waleed S. Haddad
Keyword(s):  
High Resolution ◽  
Process Development ◽  
3D Visualization ◽  
Tomographic Reconstruction ◽  
Reconstruction Algorithms ◽  
X Ray ◽  
Visualization Software ◽  
Volumetric Reconstruction ◽  
Resolution Imaging ◽  
Non Destructive

Abstract A high-resolution table-sized x-ray nanotomography (XRMT) tool has been constructed that shows the promise of nondestructively imaging the internal structure of a full IC stack with a spatial resolution better than 100 nm. Such a tool can be used to detect, localize, and characterize buried defects in the IC. By collecting a set of X-ray projections through the full IC (which may include tens of micrometers of silicon substrate and several layers of Cu interconnects) and applying tomographic reconstruction algorithms to these projections, a 3D volumetric reconstruction can be obtained, and analyzed for defects using 3D visualization software. XRMT is a powerful technique that will find use in failure analysis and IC process development, and may facilitate or supplant investigations using SEM, TEM, and FIB tools, which generally require destructive sample preparation and a vacuum environment.

scholarly journals Freeze–Thaw Resistance and Air-Void Analysis of Concrete with Recycled Glass–Pozzolan Using X-ray Micro-Tomography

Materials ◽  
2020 ◽  
Vol 14 (1) ◽  
pp. 154
Author(s):  
Marija Krstic ◽  
Julio F. Davalos ◽  
Emanuele Rossi ◽  
Stefan C. Figueiredo ◽  
Oguzhan Copuroglu
Keyword(s):  
Fly Ash ◽  
Pore Structure ◽  
The United States ◽  
Adsorption Method ◽  
X Ray ◽  
Freeze Thaw ◽  
Void System ◽  
Spatial Parameters ◽  
Micro Tomography ◽  
Air Void

Recent studies have shown promising potential for using Glass Pozzolan (GP) as an alternative supplementary cementitious material (SCM) due to the scarcity of fly ash and slag in the United States. However, comprehensive studies on the freeze–thaw (FT) resistance and air void system of mixtures containing GP are lacking. Therefore, this study aimed to evaluate GP’s effect on FT resistance and characterize mixtures with different GP contents, both macro- and microscopically. In this study, six concrete mixes were considered: Three mixes with 20%, 30% and 40% GP as cement replacements and two other comparable mixes with 30% fly ash and 40% slag, as well as a mix with 100% Ordinary Portland cement (OPC) as a reference. Concrete samples were prepared, cured and tested according to the ASTM standards for accelerated FT resistance for 1000 cycles and corresponding dynamic modulus of elasticity (Ed). All the samples showed minimal deterioration and scaling and high F/T resistance with a durability factor of over 90%. The relationships among FT resistance parameters, air-pressured method measurements of fresh concretes and air void analysis parameters of hardened concretes were examined in this study. X-ray micro-tomography (micro-CT scan) was used to evaluate micro-cracks development after 1000 freeze–thaw cycles and to determine spatial parameters of air voids in the concretes. Pore structure properties obtained from mercury intrusion porosimetry (MIP) and N2 adsorption method showed refined pore structure for higher cement replacement with GP, indicating more gel formation (C-S-H) which was verified by thermogravimetric analysis (TGA).

scholarly journals Public Personnel Management Process Capability Assessment

2019 ◽  
Vol 49 (1) ◽  
pp. 111-140 ◽  
Author(s):  
Ebru Gökalp ◽  
Onur Demirörs ◽  
P. Erhan Eren
Keyword(s):  
Personnel Management ◽  
Critical Role ◽  
Process Capability ◽  
Software Process Improvement ◽  
Management Process ◽  
Process Definition ◽  
Multiple Case ◽  
Generate Process ◽  
The Government ◽  
Definition Of

Personnel management plays a critical role in the success of public organizations. Our literature review shows that there is a lack of systematic guidance on how to improve Public Personnel Management Process (PPMP) quality. Software Process Improvement and Capability Determination (SPICE) is a process assessment framework that is successfully used by software organizations during the past two decades. The framework can also be used as a baseline to generate process capability models for different specific domains/sectors. We have utilized this approach for the government domain and we developed the process definition of PPMP. To observe the benefits and usability of the model, we have performed a multiple case study, including the assessments of three organizations’ PPMP capability levels and the development of action plans for PPMP improvement. The findings show that the proposed approach is applicable for identifying the PPMP capability levels and is capable of providing a roadmap for moving to the next level.

A new species of anapid spider (Araneae: Araneoidea, Anapidae) in Eocene Baltic amber, imaged using phase contrast X-ray computed micro-tomography

Zootaxa ◽  
2011 ◽  
Vol 2742 (1) ◽  
pp. 60 ◽  
Author(s):  
DAVID PENNEY ◽  
ANDREW MCNEIL ◽  
DAVID I. GREEN ◽  
ROBERT BRADLEY ◽  
YURI M. MARUSIK ◽  
...  
Keyword(s):  
New Species ◽  
Phase Contrast ◽  
Baltic Amber ◽  
X Ray ◽  
The Family ◽  
X Ray Computed ◽  
Micro Tomography ◽  
The Baltic ◽  
A New Species ◽  
Eocene Amber

A new species of the extant spider family Anapidae is described from a fossil mature male in Eocene amber from the Baltic region and tentatively assigned to the genus Balticoroma Wunderlich, 2004. Phase contrast X-ray computed micro-tomography was used to reveal important features that were impossible to view using traditional microscopy. Balticoroma wheateri new species is easily diagnosed from all other anapids by having clypeal extensions that run parallel to the ectal surface of the chelicerae and in having the metatarsus of the first leg highly reduced and modified into what is presumably a y-shaped clasping structure. Although only a single extant anapid species occurs in northern Europe, the family was diverse in the Eocene. The discovery of yet another anapid species in Baltic amber supports the idea that Eocene European forests may have been a hotspot of evolution for this family of spiders.

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