Modeling the Filler Phase Interaction with Solidification Front in Al(TiC) Composite Produced by the In Situ Method

This paper presents simulation results of the interaction of TiC nanoparticle in liquid aluminum. The behavior of the TiC particle in the frontal interaction region stems from the operation of a system of such forces as gravity, viscous flow drag force, and Saffman force. The difference in density between the TiC and the aluminum matrix makes the particle fall, regardless of the radius dimension; while the Saffman force—which accounts for the local velocity gradient of the liquid aluminum—causes that particles with the smallest radii considered in the calculations 6.4 × 10−8 m; 7 × 10−8 m; 7.75 × 10−8 m; 9.85 × 10−8 m are repelled from the solidification front and the particles with 15.03 × 10−8 m are attracted to it. The viscosity growth in the course of casting caused by the lowering temperature reduces this effect, though the trend is maintained. The degree to which the particle is attracted to the front clearly depends on the velocity gradient of the liquid phase. For a very small gradient of 0.00001 m/s, the particle is at its closest position relative to the front.

Effects of Process Parameters on Geometrical Characteristics and Microstructure of TiC Particle-Reinforced Co50 Alloy by Laser Cladding

Laser cladding of Co50 alloy coating and Co50 composite coatings doped with 10, 20, and 30 wt.% TiC particles was performed on the H13 steel surface. The effects of TiC concentration on the phase composition, microstructure, and microhardness of the coatings were studied. The results indicated that, in 10% TiC coating, the “bright band” is a quite flat-growth tissue, while with 20% TiC, the “white bright band” contains a large amount of black TiC particles. The composite coating Co50, 10% TiC, and 20% TiC samples can clearly distinguish the cladding zone, bonding zone, and heat-affected zone, and a good metallurgical bond is formed between the coating and the substrate. The 30% TiC coating and the substrate are not well bonded, which is attributed to the high TiC content in the coating; however, it has the best surface morphology, and there is no porosity on the surface. 10% TiC coatings have poor surface quality, show a spraying material phenomenon on two side edges which is quite serious, and a lot of porosity on the surface of the coating. In addition, 10% TiC coating includes the original TiC particles and primary TiC particles that are precipitated in situ from the liquid phase during solidification; 20% TiC coating indicates a large amount of TiC in the form of cross petals and twigs, and the figure points out that TiC exists like a large number of diffusely distributed spherical structures in the 30% TiC coating. The coatings of TiC/Co composite with less than 20% TiC showed good metallurgical bonding characteristics with the H13 steel surface.

The Impact of Interface Characteristics on Mechanical Performance of a Hot-Forged Cu/Ti-Coated-Diamond Composite

The Cu/55vol.%diamond (Ti) composites were fabricated by hot forging of the cold-pressed powder preforms, consisted of elemental copper powders and Ti-coated diamond particles, at 800 °C (800C-Cu/55Dia composite) and 1050 °C (1050C-Cu55Dia composite), respectively. Well bonded interface was achieved between the diamond and the copper matrix for the 800C-Cu/55Dia composite, and the coverage of diamond by interface was about 96%, attributed to homogeneously distributed nanospherical TiC interface formed on the diamond surface. However, obvious coarse TiC particle size and spallation of the formed interface were observed in the 1050C-Cu55Dia composite, implying that the composite had a relatively low bonding strength. The formed chemical bonding, good wettability and strong mechanical interlocking between the diamond and the copper matrix enable the 800C-Cu/55Dia composite having a high tensile strength of 145 MPa and a strain at fracture of 0.35%, which are about 260% and 170% higher than those of the 1050C-Cu55Dia composite, suggesting that the 800C-Cu/55Dia composite has the potential to have a high thermal conductivity and use as high-performance heat sink materials.