Electromagnetic Interference and Discontinuity Effects of Interconnections on Big Data Performance of Integrated Circuits

2017 ◽  
pp. 181-216
Author(s):  
Seyi Stephen Olokede ◽  
Babu Sena Paul
Keyword(s):  
Big Data ◽  
Integrated Circuits ◽  
Electromagnetic Interference

scholarly journals Design of an Ultra-Low Voltage Bias Current Generator Highly Immune to Electromagnetic Interference

2021 ◽  
Vol 11 (1) ◽  
pp. 6
Author(s):  
Orazio Aiello
Keyword(s):  
Integrated Circuits ◽  
Electromagnetic Interference ◽  
Low Voltage ◽  
Current Source ◽  
Building Blocks ◽  
Cmos Technology ◽  
Threshold Region ◽  
Output Current ◽  
Current Generator ◽  
Technology Process

The paper deals with the immunity to Electromagnetic Interference (EMI) of the current source for Ultra-Low-Voltage Integrated Circuits (ICs). Based on the properties of IC building blocks, such as the current-splitter and current correlator, a novel current generator is conceived. The proposed solution is suitable to provide currents to ICs operating in the sub-threshold region even in the presence of an electromagnetic polluted environment. The immunity to EMI of the proposed solution is compared with that of a conventional current mirror and evaluated by analytic means and with reference to the 180 nm CMOS technology process. The analysis highlights how the proposed solution generates currents down to nano-ampere intrinsically robust to the Radio Frequency (RF) interference affecting the input of the current generator, differently to what happens to the output current of a conventional mirror under the same conditions.

Alternative Setup for Long-Duration Low-Duty-Cycle 600°C Ambient Testing of SiC Integrated Circuits

2021 ◽  
Vol 2021 (HiTEC) ◽  
pp. 000076-000082
Author(s):  
Alain Izadnegahdar ◽  
Stephanie L. Booth ◽  
David J. Spry ◽  
Philip G. Neudeck
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Electromagnetic Interference ◽  
Design Feature ◽  
Maximum Deviation ◽  
Oxide Ceramic ◽  
Serial Port ◽  
Ramp Rate ◽  
Long Duration ◽  
Custom Made

Abstract A scalable, compact oven testbed system for simultaneously evaluating a multitude of high temperature integrated circuits (ICs) for prolonged operating times of up to 600 °C has been prototyped. The new testbed system enables long-duration high temperature testing in sufficient statistical quantities consistent with standard aerospace electronics engineering standards. This setup is comprised of multiple compact ovens housing chips or packages mounted to ceramic circuit boards. Each oven is a compact 15.2 cm length by 15.2 cm width by 12.7 cm depth with a maximum 400 Watts of heating power. The custom-made silicon oxide ceramic heating block inside each oven is based on a 3D printed design adapted for the easy insertion of the IC device under test (DUT). This innovative design provides the quick insertion of ICs with or without a ceramic package into a 600 °C environment by utilizing a movable 11.43 cm long ceramic substrate with electrical traces extending from the oven hot zone to external standard plastic-based board connectors. Another key oven design feature is the minimization of the DUT exposure to electromagnetic interference (EMI) by utilizing a filtered DC power source to reduce heating element noise. Additionally, the ovens can be configured in a parallel arrangement allowing global data monitoring over a single industrial RS422 serial port. This feature is important for scaling up to test multiple ICs semi-simultaneously. A USB serial port is provided to independently control the operating parameters of each oven such as the oven target temperature and oven ramp rate. The oven temperature can reach up to 600 °C with a confirmed +/− 4 °C maximum deviation across the test zone region. The ramp rate can be programmed from 1 °C/minute up to 10 °C/minute. Furthermore, a programmable switchboard is used to interface with the DUT. This switchboard comprises a National Instruments Peripheral Component Interconnect eXtension for Instrumentation (NI PXI) system and a breakout board to send and receive power, analog or digital test signals. By using this unique oven testbed system, a variety of ICs can now be tested in parallel using the same test components configured for a diverse set of requirements.

Comparison among emission and susceptibility reduction techniques for electromagnetic interference in digital integrated circuits

2008 ◽  
Vol 39 (12) ◽  
pp. 1728-1735 ◽  
Author(s):  
Ali Alaeldine ◽  
Nicolas Lacrampe ◽  
Alexandre Boyer ◽  
Richard Perdriau ◽  
Fabrice Caignet ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Electromagnetic Interference ◽  
Digital Integrated Circuits ◽  
Reduction Techniques

Combined ionizing radiation & electromagnetic interference test procedure to achieve reliable integrated circuits

2019 ◽  
Vol 100-101 ◽  
pp. 113341
Author(s):  
Roger Goerl ◽  
Paulo Villa ◽  
Fabian L. Vargas ◽  
César A. Marcon ◽  
Nilberto H. Medina ◽  
...  
Keyword(s):  
Ionizing Radiation ◽  
Integrated Circuits ◽  
Electromagnetic Interference ◽  
Test Procedure ◽  
Interference Test

Electrostatic Control and Air Ionization in Cleanrooms for Semiconductor and TFT Production

2009 ◽  
Vol 52 (1) ◽  
pp. 87-97 ◽  
Author(s):  
Guan Wei
Keyword(s):  
Integrated Circuits ◽  
Electromagnetic Interference ◽  
Semiconductor Industry ◽  
Electrostatic Charge ◽  
High Tech ◽  
Manufacturing Processes ◽  
Electrostatic Charges ◽  
Particle Contamination ◽  
Electrostatic Control ◽  
Manufacturing Technologies

The most critical manufacturing processes for integrated circuits and thin-film transistors, mainstays of the semiconductor industry, take place in cleanrooms. The strictly controlled temperature and humidity in cleanrooms enable electrostatic charges to be generated and maintained on the surface of objects for an extended time. Electrostatic charge and discharge cause particle contamination, damage to products, and electromagnetic interference, which can lead to production tool lockup. With the development of new manufacturing technologies, products are becoming more sensitive to electrostatic discharge. How to control electrostatic charge and eliminate associated problems has become a challenge in the high-tech semiconductor industry.

scholarly journals Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits

2020 ◽  
Vol 10 (3) ◽  
pp. 748
Author(s):  
Dipesh Kapoor ◽  
Cher Ming Tan ◽  
Vivek Sangwan
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Electromagnetic Interference ◽  
High Speed ◽  
High Performance ◽  
Near Field ◽  
Three Dimensional ◽  
3D Ic ◽  
Three Dimensional Integrated Circuit ◽  
The Impact

Advancements in the functionalities and operating frequencies of integrated circuits (IC) have led to the necessity of measuring their electromagnetic Interference (EMI). Three-dimensional integrated circuit (3D-IC) represents the current advancements for multi-functionalities, high speed, high performance, and low-power IC technology. While the thermal challenges of 3D-IC have been studied extensively, the influence of EMI among the stacked dies has not been investigated. With the decreasing spacing between the stacked dies, this EMI can become more severe. This work demonstrates the potential of EMI within a 3D-IC numerically, and determines the minimum distance between stack dies to reduce the impact of EMI from one another before they are fabricated. The limitations of using near field measurement for the EMI study in stacked dies 3D-IC are also illustrated.

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