scholarly journals High-speed programmable photonic circuits in a cryogenically compatible, visible–near-infrared 200 mm CMOS architecture

2021 ◽  
Author(s):  
Mark Dong ◽  
Genevieve Clark ◽  
Andrew J. Leenheer ◽  
Matthew Zimmermann ◽  
Daniel Dominguez ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Power Consumption ◽  
High Speed ◽  
Large Scale ◽  
Near Infrared ◽  
Response Times ◽  
Photonic Integrated Circuits ◽  
Complementary Metal Oxide Semiconductor ◽  
Phase Shifters ◽  
Oxide Semiconductor

AbstractRecent advances in photonic integrated circuits have enabled a new generation of programmable Mach–Zehnder meshes (MZMs) realized by using cascaded Mach–Zehnder interferometers capable of universal linear-optical transformations on N input/output optical modes. MZMs serve critical functions in photonic quantum information processing, quantum-enhanced sensor networks, machine learning and other applications. However, MZM implementations reported to date rely on thermo-optic phase shifters, which limit applications due to slow response times and high power consumption. Here we introduce a large-scale MZM platform made in a 200 mm complementary metal–oxide–semiconductor foundry, which uses aluminium nitride piezo-optomechanical actuators coupled to silicon nitride waveguides, enabling low-loss propagation with phase modulation at greater than 100 MHz in the visible–near-infrared wavelengths. Moreover, the vanishingly low hold-power consumption of the piezo-actuators enables these photonic integrated circuits to operate at cryogenic temperatures, paving the way for a fully integrated device architecture for a range of quantum applications.

scholarly journals Design of High-Speed Low Power Computational Blocks for DSP Processors

2021 ◽  
Vol 11 (2) ◽  
pp. 1419-1429
Author(s):  
Alivelu Manga N.
Keyword(s):  
Signal Processing ◽  
Integrated Circuits ◽  
Power Consumption ◽  
Low Power ◽  
High Speed ◽  
Large Scale ◽  
Power Optimization ◽  
Digital Signal ◽  
Oxide Semiconductor ◽  
Performance Criteria

In today’s deep submicron VLSI (Very Large-Scale Integration) Integrated Circuits, power optimization and speed play a very important role. This importance for low power has initiated the designs where power dissipation is equally important as performance and area. Power reduction and power management are the key challenges in the design of circuits down to 100nm. For power optimization, there are several techniques and extension designs are applied in the literature. In real time Digital Signal Processing applications, multiplication and accumulation are significant operations. The primary performance criteria for these signal processing operations are speed and power consumption. To lower the power consumption, there are techniques like Multi threshold (Multi-Vth), Dula-Vth etc. Among those, a technique known as GDI (Gate diffusion Input) is used which allows reduction in power, delay and area of digital circuits, while maintaining low complexity of logic design. In this paper, various signal processing blocks like parallel-prefix adder, Braun multiplier and a Barrel shifter are designed using GDI (Gate diffusion Input) technique and compared with conventional CMOS (Complementary Metal Oxide Semiconductor) based designs in terms of delay and speed. The designs are simulated using Cadence Virtuoso 45nm technology. The Simulation results shows that GDI based designs consume less power and delay also reduced compared to CMOS based designs.

scholarly journals The Mixed Logic Style based Low Power and High Speed 3-2 Compressor for ASIC designs at 32nm Technology

2019 ◽  
Vol 9 (1) ◽  
pp. 43-49
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
High Speed ◽  
Average Power ◽  
Complementary Metal Oxide Semiconductor ◽  
Building Blocks ◽  
Propagation Delay ◽  
Oxide Semiconductor ◽  
Logic Design ◽  
Average Power Consumption

Compressors are the fundamental building blocks to construct Data Processing arithmetic units. A novel 3-2 Compressor is presented in this paper which is designed by Mixed logic design style. In addition to small size transistors and reduced transistor activity compared to conventional CMOS (Complementary Metal Oxide Semiconductor) gates, it provides the priority between the High logic and Low logic for the computation of the output. Various logic topologies are used to design the 3-2 compressor like High-Skew(Hi-Skew), Low-Skew(Li-Skew), TGL (Transmission Gate Logic) and DVL (Dual value Logic). This new approach gives the better operating speed, low power consumption compared to conventional logic design by reducing the transistors activity, improving the driving capability and reduced input capacitance with skew gates. Especially the Mixed logic style-3 provides 92.39% average power consumption and Propagation Delay of 99.59% at 0.8v. The H-SPICE simulation tool is used for construction and evaluation of compressor logic at different voltages. 32nm model file is used for MOS transistors

scholarly journals Design and Implementation of Full Adder using Different XOR Gates

2020 ◽  
Vol 9 (4) ◽  
pp. 1422-1426
Keyword(s):  
Integrated Circuits ◽  
Power Consumption ◽  
Great Part ◽  
Reducing Power ◽  
Complementary Metal Oxide Semiconductor ◽  
Full Adder ◽  
Oxide Semiconductor ◽  
Performance Criteria ◽  
Xor Gate ◽  
Pass Transistor

A Full Adder is a logical circuit that servers a great part in the design of application particular integrated circuits. It is the basic component found in VLSI and DSP applications. The applications of Full adder in VLSI include ALU design, Address generation in processors, Multipliers and so on. Power consumption is one of the most significant parameters of full adder. Therefore, reducing power consumption in full adder is very important. In this paper, Design XOR gate using Transmission gate logic (TGL), Pass transistor logic (PTL) and Static Complementary metal oxide semiconductor logic (CMOS). Also design Full Adder circuit using different XOR gate designs. These circuits are designed and implemented, simulated using Mentor Graphics Tool. After getting simulation results, compare the different XOR gate designs based full adders in terms of power consumption and delay. Using the comparative analysis for the designed Full Adders, an effective adder design can be chosen based on the performance criteria as required by the designer.

scholarly journals Finding out square root of an integer number using Single Electron Transistor

2021 ◽  
pp. 96-110
Author(s):  
Dr. Anup Kumar Biswas
Keyword(s):  
Power Consumption ◽  
Gate Voltage ◽  
Large Scale ◽  
Complementary Metal Oxide Semiconductor ◽  
Single Electron ◽  
Oxide Semiconductor ◽  
Integer Number ◽  
Single Electron Transistor ◽  
Square Root ◽  
Ultra Low Power

The single-electron transistor (SET) attracts the researchers, scientists or technologists to design and construct large scale circuits for the sake of the consumption of ultra-low power and its small size. All the incidences in a SET-based circuit happen when only a single electron tunnels through the transistors under the proper applied bias voltage and a small gate voltage or multiple gate voltages. The oscillatory conduction as the function of the variable-multiple /single gate voltage is exhibited by SET. This uncommon characteristic provides the ability of executing the functions of AND, OR, XOR, Inverter and some combinational circuits like multiplexer, subtractor etc. For implementing a square root circuit, SET would be a best candidate to fulfil the requirements. The processing speed of SET based devices will be nearly close to electronic speed. Noise during processing gets ultra-low when the circuits is built with SETs. The square root circuit is presented here for sixteen bit input numbers. The input bit numbers can be increased with the increasing of the depth of the pattern very easily. And this will provide us the greater accuracy about the squared root value. Power consumption in the single electron circuit is low irrespective of bipolar junction transistor (BJT) or Complementary Metal Oxide Semiconductor (CMOS) circuits. Reducing the numbers of nodes, the power consumption is reduced.

scholarly journals A Low-Power Spiking Neural Network Chip Based on a Compact LIF Neuron and Binary Exponential Charge Injector Synapse Circuits

Sensors ◽  
2021 ◽  
Vol 21 (13) ◽  
pp. 4462
Author(s):  
Malik Summair Asghar ◽  
Saad Arslan ◽  
HyungWon Kim
Keyword(s):  
Neural Network ◽  
Power Consumption ◽  
Large Scale ◽  
Average Power ◽  
Complementary Metal Oxide Semiconductor ◽  
Input Image ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Spiking Neural Network ◽  
Digital Implementation

To realize a large-scale Spiking Neural Network (SNN) on hardware for mobile applications, area and power optimized electronic circuit design is critical. In this work, an area and power optimized hardware implementation of a large-scale SNN for real time IoT applications is presented. The analog Complementary Metal Oxide Semiconductor (CMOS) implementation incorporates neuron and synaptic circuits optimized for area and power consumption. The asynchronous neuronal circuits implemented benefit from higher energy efficiency and higher sensitivity. The proposed synapse circuit based on Binary Exponential Charge Injector (BECI) saves area and power consumption, and provides design scalability for higher resolutions. The SNN model implemented is optimized for 9 × 9 pixel input image and minimum bit-width weights that can satisfy target accuracy, occupies less area and power consumption. Moreover, the spiking neural network is replicated in full digital implementation for area and power comparisons. The SNN chip integrated from neuron and synapse circuits is capable of pattern recognition. The proposed SNN chip is fabricated using 180 nm CMOS process, which occupies a 3.6 mm2 chip core area, and achieves a classification accuracy of 94.66% for the MNIST dataset. The proposed SNN chip consumes an average power of 1.06 mW—20 times lower than the digital implementation.

scholarly journals Optimal Physical Implementation of Radiation Tolerant High-Speed Digital Integrated Circuits in Deep-Submicron Technologies

Electronics ◽  
2019 ◽  
Vol 8 (4) ◽  
pp. 432 ◽  
Author(s):  
Jeffrey Prinzie ◽  
Karel Appels ◽  
Szymon Kulis
Keyword(s):  
Integrated Circuits ◽  
High Speed ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Deep Submicron ◽  
Oxide Semiconductor ◽  
Digital Integrated Circuits ◽  
Physical Implementation ◽  
Radiation Hard ◽  
Radiation Tolerant

This paper presents a novel scalable physical implementation method for high-speed Triple Modular Redundant (TMR) digital integrated circuits in radiation-hard designs. The implementation uses a distributed placement strategy compared to a commonly used bulk 3-bank constraining method. TMR netlist information is used to optimally constrain the placement of both sequential cells and combinational cells. This approach significantly reduces routing complexity, net lengths and dynamic power consumption with more than 60% and 20% respectively. The technique was simulated in a 65 nm Complementary Metal-Oxide Semiconductor (CMOS) technology.

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