scholarly journals A Low-Power Spiking Neural Network Chip Based on a Compact LIF Neuron and Binary Exponential Charge Injector Synapse Circuits

Sensors ◽  
2021 ◽  
Vol 21 (13) ◽  
pp. 4462
Author(s):  
Malik Summair Asghar ◽  
Saad Arslan ◽  
HyungWon Kim
Keyword(s):  
Neural Network ◽  
Power Consumption ◽  
Large Scale ◽  
Average Power ◽  
Complementary Metal Oxide Semiconductor ◽  
Input Image ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Spiking Neural Network ◽  
Digital Implementation

To realize a large-scale Spiking Neural Network (SNN) on hardware for mobile applications, area and power optimized electronic circuit design is critical. In this work, an area and power optimized hardware implementation of a large-scale SNN for real time IoT applications is presented. The analog Complementary Metal Oxide Semiconductor (CMOS) implementation incorporates neuron and synaptic circuits optimized for area and power consumption. The asynchronous neuronal circuits implemented benefit from higher energy efficiency and higher sensitivity. The proposed synapse circuit based on Binary Exponential Charge Injector (BECI) saves area and power consumption, and provides design scalability for higher resolutions. The SNN model implemented is optimized for 9 × 9 pixel input image and minimum bit-width weights that can satisfy target accuracy, occupies less area and power consumption. Moreover, the spiking neural network is replicated in full digital implementation for area and power comparisons. The SNN chip integrated from neuron and synapse circuits is capable of pattern recognition. The proposed SNN chip is fabricated using 180 nm CMOS process, which occupies a 3.6 mm2 chip core area, and achieves a classification accuracy of 94.66% for the MNIST dataset. The proposed SNN chip consumes an average power of 1.06 mW—20 times lower than the digital implementation.

scholarly journals A Smart Floating Gate Transistor with Two Control Gates for Active Noise Control

Micromachines ◽  
2019 ◽  
Vol 10 (11) ◽  
pp. 722
Author(s):  
Mao ◽  
Yang ◽  
Ma ◽  
Yan ◽  
Zhang
Keyword(s):  
Large Scale ◽  
Noise Control ◽  
Low Cost ◽  
Active Noise Control ◽  
Complementary Metal Oxide Semiconductor ◽  
Floating Gate ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Active Noise ◽  
Floating Gate Transistor

A smart floating gate transistor with two control gates was proposed for active noise control in bioelectrical signal measurement. The device, which is low cost and capable of large-scale integration, was implemented in a standard single-poly complementary metal–oxide–semiconductor (CMOS) process. A model of the device was developed to demonstrate the working principle. Theoretical analysis and simulation results proved the superposition of the two control gates. A series of test experiments were carried out and the results showed that the device was in accordance with the basic electrical characteristics of a floating gate transistor, including the current–voltage (I–V) characteristics and the threshold characteristics observed on the two control gates. Based on the source follower circuit, the experimental results proved that the device can reduce interference by more than 29 dB, which demonstrates the feasibility of the proposed device for active noise control.

scholarly journals High-speed programmable photonic circuits in a cryogenically compatible, visible–near-infrared 200 mm CMOS architecture

2021 ◽  
Author(s):  
Mark Dong ◽  
Genevieve Clark ◽  
Andrew J. Leenheer ◽  
Matthew Zimmermann ◽  
Daniel Dominguez ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Power Consumption ◽  
High Speed ◽  
Large Scale ◽  
Near Infrared ◽  
Response Times ◽  
Photonic Integrated Circuits ◽  
Complementary Metal Oxide Semiconductor ◽  
Phase Shifters ◽  
Oxide Semiconductor

AbstractRecent advances in photonic integrated circuits have enabled a new generation of programmable Mach–Zehnder meshes (MZMs) realized by using cascaded Mach–Zehnder interferometers capable of universal linear-optical transformations on N input/output optical modes. MZMs serve critical functions in photonic quantum information processing, quantum-enhanced sensor networks, machine learning and other applications. However, MZM implementations reported to date rely on thermo-optic phase shifters, which limit applications due to slow response times and high power consumption. Here we introduce a large-scale MZM platform made in a 200 mm complementary metal–oxide–semiconductor foundry, which uses aluminium nitride piezo-optomechanical actuators coupled to silicon nitride waveguides, enabling low-loss propagation with phase modulation at greater than 100 MHz in the visible–near-infrared wavelengths. Moreover, the vanishingly low hold-power consumption of the piezo-actuators enables these photonic integrated circuits to operate at cryogenic temperatures, paving the way for a fully integrated device architecture for a range of quantum applications.

scholarly journals The Mixed Logic Style based Low Power and High Speed 3-2 Compressor for ASIC designs at 32nm Technology

2019 ◽  
Vol 9 (1) ◽  
pp. 43-49
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
High Speed ◽  
Average Power ◽  
Complementary Metal Oxide Semiconductor ◽  
Building Blocks ◽  
Propagation Delay ◽  
Oxide Semiconductor ◽  
Logic Design ◽  
Average Power Consumption

Compressors are the fundamental building blocks to construct Data Processing arithmetic units. A novel 3-2 Compressor is presented in this paper which is designed by Mixed logic design style. In addition to small size transistors and reduced transistor activity compared to conventional CMOS (Complementary Metal Oxide Semiconductor) gates, it provides the priority between the High logic and Low logic for the computation of the output. Various logic topologies are used to design the 3-2 compressor like High-Skew(Hi-Skew), Low-Skew(Li-Skew), TGL (Transmission Gate Logic) and DVL (Dual value Logic). This new approach gives the better operating speed, low power consumption compared to conventional logic design by reducing the transistors activity, improving the driving capability and reduced input capacitance with skew gates. Especially the Mixed logic style-3 provides 92.39% average power consumption and Propagation Delay of 99.59% at 0.8v. The H-SPICE simulation tool is used for construction and evaluation of compressor logic at different voltages. 32nm model file is used for MOS transistors

scholarly journals Finding out square root of an integer number using Single Electron Transistor

2021 ◽  
pp. 96-110
Author(s):  
Dr. Anup Kumar Biswas
Keyword(s):  
Power Consumption ◽  
Gate Voltage ◽  
Large Scale ◽  
Complementary Metal Oxide Semiconductor ◽  
Single Electron ◽  
Oxide Semiconductor ◽  
Integer Number ◽  
Single Electron Transistor ◽  
Square Root ◽  
Ultra Low Power

The single-electron transistor (SET) attracts the researchers, scientists or technologists to design and construct large scale circuits for the sake of the consumption of ultra-low power and its small size. All the incidences in a SET-based circuit happen when only a single electron tunnels through the transistors under the proper applied bias voltage and a small gate voltage or multiple gate voltages. The oscillatory conduction as the function of the variable-multiple /single gate voltage is exhibited by SET. This uncommon characteristic provides the ability of executing the functions of AND, OR, XOR, Inverter and some combinational circuits like multiplexer, subtractor etc. For implementing a square root circuit, SET would be a best candidate to fulfil the requirements. The processing speed of SET based devices will be nearly close to electronic speed. Noise during processing gets ultra-low when the circuits is built with SETs. The square root circuit is presented here for sixteen bit input numbers. The input bit numbers can be increased with the increasing of the depth of the pattern very easily. And this will provide us the greater accuracy about the squared root value. Power consumption in the single electron circuit is low irrespective of bipolar junction transistor (BJT) or Complementary Metal Oxide Semiconductor (CMOS) circuits. Reducing the numbers of nodes, the power consumption is reduced.

scholarly journals A High-Speed Low-Power Divide-by-3/4 Prescaler using E-TSPC Logic DFFs

Electronics ◽  
2019 ◽  
Vol 8 (5) ◽  
pp. 589 ◽  
Author(s):  
Tianchen Shen ◽  
Jiabing Liu ◽  
Chunyi Song ◽  
Zhiwei Xu
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
High Speed ◽  
Critical Path ◽  
Complementary Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Flip Flop ◽  
Mode Control ◽  
Power Operation

A high-speed, low-power divide-by-3/4 prescaler based on an extended true single-phase clock D-flip flop (E-TSPC DFF) is presented. We added two more transistors and a mode control signal to the conventional E-TSPC based divide-by-4 divider to achieve the function of the divide-by-3/4 dual modulus frequency divider. The designed divide-by-3/4 achieved higher speed and lower power operation with mode control compared with the conventional ones. The prescaler was comprised of sixteen transistors and integrates an inverter in the second DFF to provide output directly. The power consumption was minimized due to the reduced number of stages and transistors. In addition, the prescaler operating speed was also improved due to a reduced critical path. We compared the simulation results with conventional E-TSPC based divide-by-3/4 dividers in the same process, where the figure-of-merit (FoM) of the proposed divider was 17.4–75.5% better than conventional ones. We have also fabricated the prescaler in a 40 nm complementary metal oxide semiconductor (CMOS) process. The measured highest operating frequency was 9 GHz with 0.303 mW power consumption under 1.35 V power supply, which agrees with the simulation well. The measurement results demonstrate that the proposed divider achieves high-speed and low-power operation.

scholarly journals The Mixed Logic Style based Low Power and High Speed One-bit Binary adder for SOI Designs AT 32NM Technology

2019 ◽  
Vol 8 (4) ◽  
pp. 361-366
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
High Speed ◽  
Average Power ◽  
Complementary Metal Oxide Semiconductor ◽  
Building Blocks ◽  
Full Adder ◽  
Oxide Semiconductor ◽  
Logic Design ◽  
Average Power Consumption

Binary adders are the fundamental building blocks to construct Data Processing arithmetic units. A novel one-bit full adder is presented in this paper which is designed by Mixed logic design style. In addition to small size transistors and reduced transistor activity compared to conventional CMOS (Complementary Metal Oxide Semiconductor) gates, it provides the priority between the High logic and Low logic for the computation of the output. Various logic topologies are used to design the one-bit full adder like High-Skew(Hi-Skew), Low-Skew(Li-Skew), TGL (Transmission Gate Logic) and DVL (Dual Voltage Logic). This new approach gives the better operating speed, low power consumption compared to conventional logic design by reducing the transistors activity and by improving the driving capability. This Mixed logic style provides 83.53% average power consumption and Propagation Delay of 14.02% at 0.8v. The H-SPICE simulation tool is used for construction and evaluation of the Full adder logic at different voltages. The 32nm model file is used for MOS transistors

Design of Low Leakage PVT Variations Aware CMOS Bootstrapped Driver Circuit

2017 ◽  
Vol 26 (09) ◽  
pp. 1750137 ◽  
Author(s):  
Vijay Kumar Sharma
Keyword(s):  
Large Scale ◽  
Low Voltage ◽  
Complementary Metal Oxide Semiconductor ◽  
Monte Carlo Analysis ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Switching Speed ◽  
Low Leakage ◽  
Driver Circuit ◽  
Pvt Variations

This paper describes a novel complementary metal oxide semiconductor (CMOS) bootstrapped driver circuit for driving large resistive capacitive (RC) loads. The proposed bootstrapped driver reduces the leakage as well as process, voltage and temperature (PVT) variations from the boosted nodes with higher switching speed. Very large scale integration (VLSI) designers need boosted output for the logic circuits which are operating in ultra-deep submicron regime under widespread use of low voltage. Proposed CMOS bootstrapped driver circuit is easy in design; built with minimum number of transistors and have high boosting efficiency with sharp output performance. Comparative evaluations with existing bootstrapped driver circuits are reported. Simulation results are derived by HSPICE tool with predictive technology model (PTM) bulk CMOS process fabrication at 32 nm technology node. The ability of large leakage reduction makes this driver superior as compared to active drivers. An average of 96.97% leakage current is saved at nominal ultra-low voltage of 0.15 V. Monte-Carlo analysis indicates that the proposed bootstrapped driver has less sensitivity of PVT variations. The power consumption and delay sensitivities are reduced by 10 × and 4.12 × as compared to conventional circuit.

scholarly journals An E-Band 21-dB Variable-Gain Amplifier with 0.5-V Supply in 40-nm CMOS

Electronics ◽  
2021 ◽  
Vol 10 (7) ◽  
pp. 804
Author(s):  
Gibeom Shin ◽  
Kyunghwan Kim ◽  
Kangseop Lee ◽  
Hyun-Hak Jeong ◽  
Ho-Jin Song
Keyword(s):  
Power Consumption ◽  
Frequency Band ◽  
Noise Figure ◽  
Complementary Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Operating Frequency ◽  
Variable Gain Amplifier ◽  
Variable Gain ◽  
Operating Frequency Band ◽  
Shunt Capacitors

This paper presents a variable-gain amplifier (VGA) in the 68–78 GHz range. To reduce DC power consumption, the drain voltage was set to 0.5 V with competitive performance in the gain and the noise figure. High-Q shunt capacitors were employed at the gate terminal of the core transistors to move input matching points for easy matching with a compact transformer. The four stages amplifier fabricated in 40-nm bulk complementary metal oxide semiconductor (CMOS) showed a peak gain of 24.5 dB at 71.3 GHz and 3‑dB bandwidth of more than 10 GHz in 68–78 GHz range with approximately 4.8-mW power consumption per stage. Gate-bias control of the second stage in which feedback capacitances were neutralized with cross-coupled capacitors allowed us to vary the gain by around 21 dB in the operating frequency band. The noise figure was estimated to be better than 5.9 dB in the operating frequency band from the full electromagnetic (EM) simulation.

scholarly journals A Novel Cross-Latch Shift Register Scheme for Low Power Applications

2020 ◽  
Vol 11 (1) ◽  
pp. 129
Author(s):  
Po-Yu Kuo ◽  
Ming-Hwa Sheu ◽  
Chang-Ming Tsai ◽  
Ming-Yan Tsai ◽  
Jin-Fa Lin
Keyword(s):  
Power Consumption ◽  
Supply Voltage ◽  
Electrical Power ◽  
Average Power ◽  
Leakage Power ◽  
Shift Register ◽  
Cmos Process ◽  
Average Power Consumption ◽  
Simulation Results ◽  
Layout Area

The conventional shift register consists of master and slave (MS) latches with each latch receiving the data from the previous stage. Therefore, the same data are stored in two latches separately. It leads to consuming more electrical power and occupying more layout area, which is not satisfactory to most circuit designers. To solve this issue, a novel cross-latch shift register (CLSR) scheme is proposed. It significantly reduced the number of transistors needed for a 256-bit shifter register by 48.33% as compared with the conventional MS latch design. To further verify its functions, this CLSR was implemented by using TSMC 40 nm CMOS process standard technology. The simulation results reveal that the proposed CLSR reduced the average power consumption by 36%, cut the leakage power by 60.53%, and eliminated layout area by 34.76% at a supply voltage of 0.9 V with an operating frequency of 250 MHz, as compared with the MS latch.

scholarly journals Phase Change Metasurfaces by Continuous or Quasi-Continuous Atoms for Active Optoelectronic Integration

Materials ◽  
2021 ◽  
Vol 14 (5) ◽  
pp. 1272
Author(s):  
Zhihua Fan ◽  
Qinling Deng ◽  
Xiaoyu Ma ◽  
Shaolin Zhou
Keyword(s):  
Phase Change ◽  
Phase Change Materials ◽  
Complementary Metal Oxide Semiconductor ◽  
Photonic Devices ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Nanophotonic Devices ◽  
Optoelectronic Integration ◽  
Hybrid Devices ◽  
Micro Electromechanical System

In recent decades, metasurfaces have emerged as an exotic and appealing group of nanophotonic devices for versatile wave regulation with deep subwavelength thickness facilitating compact integration. However, the ability to dynamically control the wave–matter interaction with external stimulus is highly desirable especially in such scenarios as integrated photonics and optoelectronics, since their performance in amplitude and phase control settle down once manufactured. Currently, available routes to construct active photonic devices include micro-electromechanical system (MEMS), semiconductors, liquid crystal, and phase change materials (PCMs)-integrated hybrid devices, etc. For the sake of compact integration and good compatibility with the mainstream complementary metal oxide semiconductor (CMOS) process for nanofabrication and device integration, the PCMs-based scheme stands out as a viable and promising candidate. Therefore, this review focuses on recent progresses on phase change metasurfaces with dynamic wave control (amplitude and phase or wavefront), and especially outlines those with continuous or quasi-continuous atoms in favor of optoelectronic integration.

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