Electromigration effect on pancake type void propagation near the interface of bulk solder and intermetallic compound

2009 ◽  
Vol 105 (6) ◽  
pp. 063710 ◽  
Author(s):  
Yao Yao ◽  
Leon M. Keer ◽  
Morris E. Fine
Keyword(s):  
Intermetallic Compound ◽  
Bulk Solder ◽  
Electromigration Effect ◽  
Void Propagation

Microstructure Evolution of Sn-Cu Based Solder Paste with Different Cu Concentration Subjected to Multiple Reflows

2018 ◽  
Vol 280 ◽  
pp. 206-211 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Nur Ain Athirah Amran ◽  
Mohd Izrul Izwan Ramli
Keyword(s):  
Intermetallic Compound ◽  
Microstructure Evolution ◽  
Bulk Solder ◽  
Solder Paste ◽  
Microstructure Formation ◽  
Cu Content ◽  
Microstructure Morphology ◽  
Solder Microstructure ◽  
Multiple Reflow Cycles ◽  
Solder Composition

The evolution in microstructure of Sn-Cu based solder paste with different copper (Cu) content subjected to multiple reflow cycles was investigated. In this study, the Sn-0.7Cu (SC) solder paste was used as based material. The Cu particles were added into SC solder paste to produce new Sn-4Cu and Sn-10Cu solder paste. After that, the solder paste was then reflowed on Cu-OSP surface finished and subjected to six times reflows. Characterization focuses on the bulk solder microstructure, morphology and intermetallic compound (IMC) thickness after multiple reflows. Results reveal that solder composition significantly affect the microstructure formation and growth of IMC.

On the Influence of Internal Void Size on the Fracture Stress of Constrained Solder Joints

2016 ◽  
Vol 258 ◽  
pp. 229-232
Author(s):  
Martin Lederer ◽  
Golta Khatibi ◽  
Julien Magnien
Keyword(s):  
Finite Element ◽  
Intermetallic Compound ◽  
Fracture Stress ◽  
Solder Joints ◽  
Base Material ◽  
Gradient Elasticity ◽  
Bulk Solder ◽  
Element Analysis ◽  
Dominant Influence

The fracture strengths of thin solder joints were investigated experimentally and with Finite Element Analysis. Due to a constraining effect, thin solder joints can carry loads which are much higher than the ultimate tensile strength of bulk solder material. On the other hand, thin solder joints show a tendency of being brittle. In fact, the tensile properties show a dependence on the quality of the intermetallic compound at the interface to the base material. Consequently, the size of microscopic defects in the intermetallic compound has a dominant influence on the fracture stress. This behavior could nicely be explained with Finite Element simulations based on strain gradient elasticity.

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

2006 ◽  
Vol 88 (1) ◽  
pp. 012106 ◽  
Author(s):  
Lingyun Zhang ◽  
Shengquan Ou ◽  
Joanne Huang ◽  
K. N. Tu ◽  
Stephen Gee ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Void Propagation

Dislocation Substructures Produced During Tensile, Creep, and Fatigue Deformation of Ti3Al at 700°C

1977 ◽  
Vol 35 ◽  
pp. 272-273
Author(s):  
S. M. L. Sastry
Keyword(s):  
Intermetallic Compound ◽  
Strain Rate ◽  
Tensile Creep ◽  
Slip Systems ◽  
Slip Vector ◽  
Superlattice Structure ◽  
Slip Activity ◽  
Dislocation Arrangement ◽  
Ordered Intermetallic ◽  
Tangled Dislocation

Ti3Al is an ordered intermetallic compound having the DO19-type superlattice structure. The compound exhibits very limited ductility in tension below 700°C because of a pronounced planarity of slip and the absence of a sufficient number of independent slip systems. Significant differences in slip behavior in the compound as a result of differences in strain rate and mode of deformation are reported here.Figure 1 is a comparison of dislocation substructures in polycrystalline Ti3Al specimens deformed in tension, creep, and fatigue. Slip activity on both the basal and prism planes is observed for each mode of deformation. The dominant slip vector in unidirectional deformation is the a-type (b) = <1120>) (Fig. la). The dislocations are straight, occur for the most part in a screw orientation, and are arranged in planar bands. In contrast, the dislocation distribution in specimens crept at 700°C (Fig. lb) is characterized by a much reduced planarity of slip, a tangled dislocation arrangement instead of planar bands, and an increased incidence of nonbasal slip vectors.

Atomic structure of interface of intermetallic compound TiAl and nitride Ti2AIN using HREM and image processing

1991 ◽  
Vol 49 ◽  
pp. 570-571
Author(s):  
E. Sukedai ◽  
H. Mabuchi ◽  
H. Hashimoto ◽  
Y. Nakayama
Keyword(s):  
Mechanical Properties ◽  
Image Processing ◽  
Composite Material ◽  
Intermetallic Compound ◽  
Side Surface ◽  
High Resolution Electron Microscopy ◽  
Hexagonal Structure ◽  
Second Phase ◽  
Resolution Electron ◽  
Compound Tial

In order to improve the mechanical properties of an intermetal1ic compound TiAl, a composite material of TiAl involving a second phase Ti2AIN was prepared by a new combustion reaction method. It is found that Ti2AIN (hexagonal structure) is a rod shape as shown in Fig.1 and its side surface is almost parallel to the basal plane, and this composite material has distinguished strength at elevated temperature and considerable toughness at room temperature comparing with TiAl single phase material. Since the property of the interface of composite materials has strong influences to their mechanical properties, the structure of the interface of intermetallic compound and nitride on the areas corresponding to 2, 3 and 4 as shown in Fig.1 was investigated using high resolution electron microscopy and image processing.

UHV-STM studies of silicon nano-pyramid growth on silicon surface at high temperature

1992 ◽  
Vol 50 (2) ◽  
pp. 1144-1145
Author(s):  
T. Sato ◽  
S. Kitamura ◽  
T. Sueyoshl ◽  
M. Iwatukl ◽  
C. Nielsen
Keyword(s):  
High Temperature ◽  
Relaxation Process ◽  
Thermal Effect ◽  
Bias Voltage ◽  
Silicon Surface ◽  
Growth Process ◽  
Tunneling Current ◽  
Fabrication Technique ◽  
Nano Fabrication ◽  
Electromigration Effect

Recently, the growth process and relaxation process of crystalline structures were studied by observing a SI nano-pyramid which was built on a Si surface with a UHV-STM. A UHV-STM (JEOL JSTM-4000×V) was used for studying a heated specimen, and the specimen was kept at high temperature during observation. In this study, the nano-fabrication technique utilizing the electromigration effect between the STM tip and the specimen was applied. We observed Si atoms migrated towords the tip on a high temperature Si surface.Clean surfaces of Si(lll)7×7 and Si(001)2×l were prepared In the UHV-STM at a temperature of approximately 600 °C. A Si nano-pyramid was built on the Si surface at a tunneling current of l0nA and a specimen bias voltage of approximately 0V in both polarities. During the formation of the pyramid, Images could not be observed because the tip was stopped on the sample. After the formation was completed, the pyramid Image was observed with the same tip. After Imaging was started again, the relaxation process of the pyramid started due to thermal effect.

Direct observation of Fe-Al-Zn ternary intermetallic compound and its transformation during the early stage of hot-dip galvanizing

1993 ◽  
Vol 51 ◽  
pp. 1116-1117
Author(s):  
C. S. Lin ◽  
W. A. Chiou ◽  
M. Meshii
Keyword(s):  
Intermetallic Compound ◽  
Reaction Rate ◽  
Diffusion Rate ◽  
Early Stage ◽  
Zinc Bath ◽  
Steel Sheets ◽  
Direct Observations ◽  
Solid Iron ◽  
Iron And Zinc ◽  
Ternary Intermetallic Compound

The galvannealed steel sheets have received ever increased attention because of their excellent post-painting corrosion resistance and good weldability. However, its powdering and flaking tendency during press forming processes strongly impairs its performance. In order to optimize the properties of galvanneal coatings, it is critical to control the reaction rate between solid iron and molten zinc.In commercial galvannealing line, aluminum is added to zinc bath to retard the diffusion rate between iron and zinc by the formation of a thin layer of Al intermetallic compound on the surface of steel at initial hot-dip galvanizing. However, the form of this compound and its transformation are still speculated. In this paper, we report the direct observations of this compound and its transformation.The specimens were prepared in a hot-dip simulator in which the steel was galvanized in the zinc bath containing 0.14 wt% of Al at a temperature of 480 °C for 5 seconds and was quenched by liquid nitrogen.

Direct imaging of order-disorder and antiphase domain structures in Ti3Al intermetallic compound

1990 ◽  
Vol 48 (4) ◽  
pp. 480-481
Author(s):  
H. Q. Ye ◽  
T.S. Xie ◽  
D. Li
Keyword(s):  
Intermetallic Compound ◽  
Volume Fraction ◽  
Fundamental Problem ◽  
Antiphase Domain ◽  
Atomic Scale ◽  
Orientation Relationships ◽  
Domain Structures ◽  
Α Phase ◽  
Diffraction Patterns ◽  
Two Phases

The Ti3Al intermetallic compound has long been recognized as potentially useful structural materials. It offers attractive strength to weight and elastic modulus to weight ratios. Recent work has established that the addition of Nb to Ti3Al ductilized this compound. In this work the fundamental problem of this alloy, i.e. order-disorder and antiphase domain structures was investigated at the atomic scale.The Ti3Al+10at%Nb alloys used in this study were treated at 1060°C and then aged at 700°C for 2 hours. The specimens suitable for TEM were prepared by standard jet electrolytic-polishing technique. A JEM-200CX electron microscope with an interpretable resolution of about 0.25 nm was used for HREM.The [100] and [001] projections of the α2 phase were shown in Fig.l.The alloy obtained consist of at least two phases-α2(Ti3Al) and β0 structures. Moreover, a disorder α phase with small volume fraction was also observed. Fig.2 gives [100] and [001] diffraction patterns of the α2 phase. Since lattice parameters of the ordered α2 (a=0.579, c=0.466 nm) and disorder α phase (a0=0.294≈a/2, c0=0.468 nm) are almost the same, their diffraction patterns are difficult to be distinguished when they are overlapped with epitaxial orientation relationships.

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