scholarly journals Design and Simulated Analysis of Low Heat Flux Cold Plate for High-power Power Electronics Equipment

2021 ◽  
Vol 2068 (1) ◽  
pp. 012033
Author(s):  
Xunan He ◽  
YuanLi Kang ◽  
Peng Li
Keyword(s):  
Heat Flux ◽  
Comparative Analysis ◽  
Power Electronics ◽  
High Power ◽  
Heat Dissipation ◽  
Heat Distribution ◽  
Cold Plate ◽  
Flow Passage ◽  
Design Requirements ◽  
Simulated Analysis

Abstract The thesis has carried out design and simulated analysis of low flux cold plate for high-power power electronics equipment. First, according to heat distribution and design requirements, two kinds of flow passage for low flux cold plate is designed. Then performance characteristics simulation of different flow passage for cold plate is performed. And the heat dissipation characteristics of two kinds of flow passage can both meet the design requirements. Finally, from the perspective of high temperature, temperature difference, pressure drop and so on, the simulated results are comparative analysis. And it is helpful to the design and optimizing of cold plate for high-power power electronics equipment.

Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm2) Power Electronics Cooling

2019 ◽  
Author(s):  
Ki Wook Jung ◽  
Sougata Hazra ◽  
Heungdong Kwon ◽  
Alisha Piazza ◽  
Edward Jih ◽  
...  
Keyword(s):  
Heat Flux ◽  
Power Electronics ◽  
Parametric Study ◽  
Peak Power ◽  
Peak Power Output ◽  
Working Fluid ◽  
Inlet Temperature ◽  
High Heat Flux ◽  
Cold Plate ◽  
Power Capability

Abstract Thermal management of power electronics continues to be one of the limiting factors in the peak power capability of the traction inverter system and overall efficiency of the e-drive. Successful design and implementation of Embedded Microchannels with a 3D-Manifold Cooler, or EMMC, could enable higher power density that allows increase in the inverter peak power output. In the present work, we have conducted a parametric study on geometric dimensions of the EMMCs to analyze thermofluidic performance by using computational fluid dynamics (CFD) simulations. The study was conducted for a 5 mm × 5 mm cold-plate foot print, heat flux 800 W/cm2, and single-phase water as working fluid at inlet temperature of 25 °C. We implemented strategies such as i) symmetric distribution of manifold inlet/outlet conduits, ii) reducing the thickness of cold-plate substrate, iii) increasing fluid-solid interfacial area in cold-plate microchannels that resulted in reduction in thermal resistance of the baseline EMMC design from 0.1 to 0.04 cm2-K/W with pressure drop from 8 to 37 kPa.

scholarly journals Design of an Integrated Heat Dissipation Mechanism for a Quad Transmit Receive Module of Array Radar

2021 ◽  
Vol 11 (15) ◽  
pp. 7054
Author(s):  
Jian-Yi Liang ◽  
Yung-Lung Lee ◽  
Shih-Wei Mao ◽  
Ming-Da Tsai
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Circulation Type ◽  
Electronic Equipment ◽  
Heat Transfer Analysis ◽  
Cold Plate ◽  
Power Electronic ◽  
Dissipation Mechanism ◽  
Free Environment ◽  
Dissipation System

A radar system requires a number of high-power components operating in a narrow and convection-free environment. This study aims to develop an integrated heat dissipation system that is suitable for the high-power electronic equipment of radar systems. The proposed heat dissipation mechanism integrates a fluid circulation-type cold plate with a quad transmit receive module. The finite element method in the COMSOL fluid–solid coupling heat transfer analysis software was used to analyze the heat dissipation performance of the cold plate in the proposed mechanism. The Taguchi method was adopted to optimize the cold plate design. The simulation and experimental results show that the proposed mechanism can control the temperature equalization and temperature of the system within the specified requirements. The practicality of the proposed mechanism was verified. The findings can serve as a reference for the design of high-power electronic equipment in a heat dissipation system.

Thermal Decoupling in Power Electronics Modules Using Thermal Pyrolytic Graphite

2019 ◽  
Vol 2019 (1) ◽  
pp. 000183-000187
Author(s):  
Riya Paul ◽  
Amol Deshpande ◽  
Fang Luo
Keyword(s):  
Power Electronics ◽  
High Power ◽  
Heat Dissipation ◽  
Pyrolytic Graphite ◽  
High Density ◽  
Junction Temperature ◽  
Heat Extraction ◽  
Maximum Temperature ◽  
Thermal Coupling ◽  
Power Module

Abstract The device within a power electronics module package will fail if the maximum junction temperature is not within the device's permissible maximum temperature rating specified by the manufacturer. Modern electronic miniaturization demands multi-chip module (MCM) packaging providing different semiconductor technology integration, reduced number of component interconnects, and lower power supply. But the huge amount of heat generated by each chip produces thermal coupling among devices, leading to an increase in the junction temperature. The power device specifications in the datasheet assume the devices being mounted on a suitable heatsink. Wide bandgap (WBG) devices like silicon carbide (SiC) devices can generally sustain a maximum junction temperature of about 175 °C – 200 °C. The junction temperature of the WBG devices becomes severe in a high-density high-power module. This highlights the need for a thermal management system to limit the maximum junction temperature within the device's permissible range. As a result, the power module needs to be connected to a heatsink to effectively increase the surface area of the heat dissipation junctions. A high conductivity material based heatsink extracts heat effectively from the module as the thermal resistance value remains low. In this paper, preliminary thermal analysis is done for a high density high-power module where the high in-plane thermal conductivity of thermal pyrolytic graphite (TPG) is exploited in substrate as well as heatsink designs. TPG brings down the junction temperature to a considerably lower level, leading to a safer power module functioning. This paper focuses on the design and proper alignment of the substrate and heatsink with respect to the module layout so that maximum junction temperature is reduced by proper heat extraction far below the operating temperature of the devices and also extent of reduction of the thermal coupling among the power devices placed next to each other on the same plane within the power module.

The Effects of Material Properties on Heat Dissipation in High Power Electronics

1998 ◽  
Vol 120 (3) ◽  
pp. 280-289 ◽  
Author(s):  
T. J. Lu ◽  
A. G. Evans ◽  
J. W. Hutchinson
Keyword(s):  
Thermal Conductivity ◽  
Power Electronics ◽  
High Power ◽  
Heat Dissipation ◽  
Substrate Material ◽  
High Thermal Conductivity ◽  
Analytical Models ◽  
Wide Range ◽  
Power Densities

The role of the substrate in determining heat dissipation in high power electronics is calculated, subject to convective cooling in the small Biot number regime. Analytical models that exploit the large aspect ratio of the substrate to justify approximations are shown to predict the behavior with good accuracy over a wide range of configurations. The solutions distinguish heat spreading effects’ that enable high chip-level power densities from insulation effects that arise at large chip densities. In the former, the attributes of high thermal conductivity are apparent, especially when the substrate dimensions are optimized. Additional benefits that derive from a thin layer of a high thermal conductivity material (such as diamond) are demonstrated. In the insulating region, which arises at high overall power densities, the substrate thermal conductivity has essentially no effect on the heat dissipation. Similarly, for compact multichip module designs, with chips placed on both sides of the substrate, heat dissipation is insensitive to the choice of the substrate material, unless advanced cooling mechanisms are used to remove heat around the module perimeter.

Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Peng Wang ◽  
Patrick McCluskey ◽  
Avram Bar-Cohen
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Single Phase ◽  
Heat Dissipation ◽  
Heat Fluxes ◽  
System Level ◽  
Cooling Power ◽  
Cold Plate ◽  
Two Phase ◽  
Cold Plates

Recent trends including rapid increases in the power ratings and continued miniaturization of semiconductor devices have pushed the heat dissipation of power electronics well beyond the range of conventional thermal management solutions, making control of device temperature a critical issue in the thermal packaging of power electronics. Although evaporative cooling is capable of removing very high heat fluxes, two-phase cold plates have received little attention for cooling power electronics modules. In this work, device-level analytical modeling and system-level thermal simulation are used to examine and compare single-phase and two-phase cold plates for a specified inverter module, consisting of 12 pairs of silicon insulated gate bipolar transistor (IGBT) devices and diodes. For the conditions studied, an R134a-cooled, two-phase cold plate is found to substantially reduce the maximum IGBT temperature and spatial temperature variation, as well as reduce the pumping power and flow rate, in comparison to a conventional single-phase water-cooled cold plate. These results suggest that two-phase cold plates can be used to substantially improve the performance, reliability, and conversion efficiency of power electronics systems.

A Micromachined Microjet Array Impingement Cooling Device for High Power Electronics

2004 ◽  
Author(s):  
Simon S. Ang ◽  
Paneer Selvam ◽  
Ajay Malshe ◽  
Fred Barlow
Keyword(s):  
Power Electronics ◽  
High Power ◽  
Cooling Device ◽  
Impingement Cooling

scholarly journals Thermal conductivity performance of nanoporous plate for high-power LED lighting and power electronics

2019 ◽  
Vol 1309 ◽  
pp. 012016
Author(s):  
A D Kurilov ◽  
V V Belyaev ◽  
K D Nessemon ◽  
E D Besprozvannyi ◽  
A O Osin ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Power Electronics ◽  
High Power ◽  
Led Lighting ◽  
High Power Led
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