GaN power IC normally-on and normally-off transistors technology and simulation
2021 ◽
Vol 2086
(1)
◽
pp. 012058
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Abstract GaN technology has been waiting to be widely adopted because of its specific technical requirements. Integration of transistor and driver in a single die will enable to overcome problems with gate driving, high cost of circuit and low device reliability. This paper demonstrates technology of GaN-on-Si normally-on and normally-off transistor with different p-GaN cap-layer thickness as well as simulation of these devices. The simulation data confirm experimental results. P-GaN cap-layer thickness affects the current channel density: the more p-GaN thickness, the less channel density. The fabricated transistors have a maximum drain current in open state of about 800 mA/mm.
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2001 ◽
Vol 40
(Part 1, No. 3B)
◽
pp. 1643-1644
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Keyword(s):
2020 ◽
Vol 10
(2)
◽
pp. 1791
Keyword(s):
2020 ◽
Keyword(s):