High-speed non-contact sheet resistivity monitoring of printed electronics using inductive sensors

2017 ◽  
Vol 2 (4) ◽  
pp. 044001 ◽  
Author(s):  
Adam P Lewis ◽  
Chris Hunt ◽  
Owen Thomas ◽  
Martin Wickham
2013 ◽  
Vol 844 ◽  
pp. 158-161 ◽  
Author(s):  
M.I. Maksud ◽  
Mohd Sallehuddin Yusof ◽  
M. Mahadi Abdul Jamil

Recently low cost production is vital to produce printed electronics by roll to roll manufacturing printing process like a flexographic. Flexographic has a high speed technique which commonly used for printing onto large area flexible substrates. However, the minimum feature sizes achieved with roll to roll printing processes, such as flexographic is in the range of fifty microns. The main contribution of this limitation is photopolymer flexographic plate unable to be produced finer micron range due to film that made by Laser Ablation Mask (LAMs) technology not sufficiently robust and consequently at micron ranges line will not be formed on the printing plate. Hence, polydimethylsiloxane (PDMS) is used instead of photopolymer. Printing trial had been conducted and multiple solid lines successfully printed for below fifty microns line width with no interference between two adjacent lines of the printed images.


Nanomaterials ◽  
2020 ◽  
Vol 10 (5) ◽  
pp. 892
Author(s):  
Dieter Reenaers ◽  
Wouter Marchal ◽  
Ianto Biesmans ◽  
Philippe Nivelle ◽  
Jan D’Haen ◽  
...  

The field of printed electronics is rapidly evolving, producing low cost applications with enhanced performances with transparent, stretchable properties and higher reliability. Due to the versatility of printed electronics, industry can consider the implementation of electronics in a way which was never possible before. However, a post-processing step to achieve conductive structures—known as sintering—limits the production ease and speed of printed electronics. This study addresses the issues related to fast sintering without scarifying important properties such as conductivity and surface roughness. A drop-on-demand inkjet printer is employed to deposit silver nanoparticle-based inks. The post-processing time of these inks is reduced by replacing the conventional oven sintering procedure with the state-of-the-art method, named near-infrared sintering. By doing so, the post-processing time shortens from 30–60 min to 6–8 s. Furthermore, the maximum substrate temperature during sintering is reduced from 200 °C to 120 °C. Based on the results of this study, one can conclude that near-infrared sintering is a ready-to-industrialize post-processing method for the production of printed electronics, capable of sintering inks at high speed, low temperature and with low complexity. Furthermore, it becomes clear that ink optimization plays an important role in processing inkjet printable inks, especially after being near-infrared sintered.


Author(s):  
Taehyeong Kim ◽  
Dongho Oh ◽  
Youngjin Kim ◽  
Jihyeon Kim ◽  
Byeongcheol Lee

Printed electronics is a next-generation process technology that is suitable for high speed and high volume production and can make electronic devices and circuits on flexible materials. To commercialize printed electronics, it is necessary to improve the alignment precision of printing. In order to improve the alignment precision of the roll-to-roll process, accurate measurement of the web position is required. Therefore, in the previous research of this paper, we proposed a measurement system of the moving direction and the lateral movement using an encoder. However, in the previous study, the direction of error control had to be set according to the measurement position of the encoder, and the measurement range was so narrow. In this paper, we propose a measurement system that can detect the direction of error and increase the effective measurement range using the burst alignment pattern that generates the burst signal. Applying it to roll-to-roll printing position measurement systems, measurements can be performed with greatly improved efficiency and measurement range.


Proceedings ◽  
2020 ◽  
Vol 32 (1) ◽  
pp. 24
Author(s):  
James Claypole ◽  
Alex Holder ◽  
Caitlin McCall ◽  
Amy Winters ◽  
William Ray ◽  
...  

: A new form of inorganic printed electronics has been developed that allows for high speed production of solid-state lighting on flexible substrates. Light emitting diodes (LED) become more efficient as their size is decreased. However, the difficulties in making the electrical connection to micro LEDs has previously prevented these benefits being exploited outside the laboratory. Standard InGaN film, grown on a defined substrate (heteroepitaxy), was fabricated into micro LEDs (approx. 27 µm) and dispersed in a carrier fluid to form an ink, which can then be printed using established printing technologies. During printing and curing, the geometry of the individual micro LEDs causes them to orientate into a single preferential direction. Connections can then be made via further printed layers of conductive and dielectric ink to create flexible lamps consisting of areas of discrete LEDs. These lamps have low power consumption and high light output making them ideal for incorporating into garments and for packaging. The “Thunderstorm” dress (a Rainbow Winters project) was developed for the “Wired to Wear” exhibition in the Museum of Science and Industry, Chicago (MSI) to demonstrate the potential of this technology. The concept was to turn the wearer into a living representation of a thunderstorm. The concept had previously been realised in 2010 using electroluminescent elements (EL) to create a lightning flash in the panels of the dress. However, this required the wearer to carry high voltage devices, bulky electronics and heavy batteries. Instead, using inorganic printed LEDs afforded the potential to create a truly wearable piece of haute couture, using low voltages, miniature electronics and small batteries. The work reported here describes the fabrication technique used to create the micro LED lamps and the issues related to their integration into a piece of wearable technology. The lamps could be driven in such a way as to create a more realistic flash compared to the EL version. Other potential applications such as smart packaging, are also discussed.


2020 ◽  
Vol 5 (3) ◽  
pp. 035006
Author(s):  
Md Saifur Rahman ◽  
Mohammadreza Shahzadeh ◽  
Mizanur Rahman ◽  
Simone Pisana ◽  
Gerd Grau

1997 ◽  
Vol 484 ◽  
Author(s):  
Z. C. Feng ◽  
M. Pelczynski ◽  
C. Beckham ◽  
P. Cooke ◽  
I. Ferguson ◽  
...  

AbstractMultiple wafer growth of infrared III-V semiconductor materials of InSb and InGaAsP have been produced by metalorganic chemical vapor deposition technology employing a vertical reactor growth configuration with a high speed rotating disk. Three measurement techniques of sheet resistivity, Fourier transform infrared (FTIR) reflectance and photoluminescence have been used to characterize epitaxial films on wafers up to 4″ diameter. Mapping distributions of the film thickness, sheet resistivity, surface morphology, and PL peak wavelength with uniformities better than 1% are illustrated. Data from our 2900 runs are produced. Variations of the characteristic features of the film with the growth conditions are discussed. These whole wafer and non-destructive material characterization techniques tightly coupled with the epitaxial processes are necessary to realize the high quality and high uniformity growth of state-of-art materials in a production environment.


2019 ◽  
Vol 17 (2) ◽  
pp. 447-459 ◽  
Author(s):  
Sarah-Jane Potts ◽  
Chris Phillips ◽  
Eifion Jewell ◽  
Ben Clifford ◽  
Yin Cheung Lau ◽  
...  

AbstractScreen printing is the most widely used process in the production of printed electronics due to its ability to consistently transfer inks containing a wide range of functional materials onto a range of substrates. However, despite its extensive use, the mechanism by which the ink is transferred through the mesh and onto the substrate is not fully understood. Existing theories are contradictory and lack experimental validation. Therefore, high-speed imaging was used in combination with a screen-printing simulation rig that was designed to provide good optical access to study ink deposition during the screen-printing process. The variation in the four stages of ink flow through the screen, described in the theory by Messerschmitt, has been quantified with respect to changes in snap-off distance and squeegee speed. Analyses of the images were compared with measurements of the ink properties and corroborated with analyses of the prints. This has provided a better understanding of the mechanism by which the ink transfers from the mesh to the substrate and subsequently separates in screen printing. This could be used as the basis for the development of predictive algorithms, as well as to improve the understanding of how to optimize print quality and performance.


2021 ◽  
Author(s):  
Xiaozhu Wei ◽  
Shohei Kumagai ◽  
Tatsuyuki Makita ◽  
Kotaro Tsuzuku ◽  
Akifumi Yamamura ◽  
...  

Abstract Printed electronics offer a cost-efficient way to realise flexible electronic devices. The combined use of p-type and n-type semiconductors would yield silicon-like integrated circuits with low power consumption and stability. However, printing complementary circuits is challenging due to a lack of suitable material systems. To counter this, we employed a hybrid system to integrate p-type organic semiconductors (OSCs) and n-type amorphous metal oxide semiconductors (MOSs). These damage-free patterned OSC- and MOS-based thin-film transistors with improved process durability allowed the fabrication of hybrid complementary circuits on flexible substrates. These inverters functioned well even after exposure to air for 5 months. A large noise margin and power gain of 38 were realised with a supply voltage as low as 7 V. Furthermore, a five-stage ring oscillator with a stage propagation delay of 1.3 µs was achieved, which is the fastest operation ever reported for printed, flexible complementary inverters.


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