scholarly journals Mechanics and thermal management of stretchable inorganic electronics

2015 ◽  
Vol 3 (1) ◽  
pp. 128-143 ◽  
Author(s):  
Jizhou Song ◽  
Xue Feng ◽  
Yonggang Huang
Keyword(s):  
Thermal Management ◽  
Design Guidelines ◽  
Semiconductor Material ◽  
Semiconductor Materials ◽  
Stretchable Electronics ◽  
Wearable Electronics ◽  
Effective Strategy ◽  
Thermal Models ◽  
Inorganic Semiconductor ◽  
Novel Applications

Abstract Stretchable electronics enables lots of novel applications ranging from wearable electronics, curvilinear electronics to bio-integrated therapeutic devices that are not possible through conventional electronics that is rigid and flat in nature. One effective strategy to realize stretchable electronics exploits the design of inorganic semiconductor material in a stretchable format on an elastomeric substrate. In this review, we summarize the advances in mechanics and thermal management of stretchable electronics based on inorganic semiconductor materials. The mechanics and thermal models are very helpful in understanding the underlying physics associated with these systems, and they also provide design guidelines for the development of stretchable inorganic electronics.

scholarly journals Recent Advances on Thermal Management of Flexible Inorganic Electronics

Micromachines ◽  
2020 ◽  
Vol 11 (4) ◽  
pp. 390 ◽  
Author(s):  
Yuhang Li ◽  
Jiayun Chen ◽  
Shuang Zhao ◽  
Jizhou Song
Keyword(s):  
Thermal Management ◽  
Biological Tissues ◽  
Design Guidelines ◽  
Polymer Substrate ◽  
Thermal Dissipation ◽  
Wearable Electronics ◽  
Practical Applications ◽  
Recent Advances ◽  
Soft Polymer ◽  
Functional Components

Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on thermal management due to the sensitive nature of biological tissues to temperature. In this review, we take microscale inorganic light-emitting diodes (μ-ILEDs) as an example of functional components to summarize the recent advances on thermal management of FIEDs including thermal analysis, thermo-mechanical analysis and thermal designs of FIEDs with and without biological tissues. These results are very helpful to understand the underlying heat transfer mechanism and provide design guidelines to optimize FIEDs in practical applications.

Highly Efficient Solar-driven Photocatalytic Hydrogen Evolution by Ternary 3D ZnIn2S4-MoS2 Microsphere/1D TiO2 Nanobelt Heterostructure

2021 ◽  
Author(s):  
Hanghang Zhou ◽  
Lan Wang ◽  
Hang Shi ◽  
Huan Zhang ◽  
Yue Wang ◽  
...  
Keyword(s):  
Energy Level ◽  
High Activity ◽  
Hydrogen Evolution ◽  
Solvothermal Method ◽  
Semiconductor Materials ◽  
Effective Strategy ◽  
Geometric Structures ◽  
Photocatalytic Hydrogen Evolution ◽  
Highly Efficient ◽  
Tio2 Nanobelts

Combining different semiconductor materials with diverse geometric structures and energy level configurations is an effective strategy for constructing high-activity heterostructure photocatalyst. Using the solvothermal method, 1D TiO2 nanobelts were uniformly...

Mechanics of Buckled Kirigami Membranes for Stretchable Interconnects in Island-Bridge Structures

2020 ◽  
Vol 87 (5) ◽  
Author(s):  
Ruitao Tang ◽  
Haoran Fu
Keyword(s):  
Scaling Laws ◽  
High Surface ◽  
Design Guidelines ◽  
Stretchable Electronics ◽  
Postbuckling Behavior ◽  
Critical Height ◽  
Element Analysis ◽  
Bridge Structures ◽  
Stretchable Interconnects ◽  
Novel Design

Abstract Island-bridge structures incorporated with kirigami membranes emerge as a novel design strategy for flexible/stretchable electronics, taking advantages of large stretchability, high-surface filling ratio and low resistance. However, it is hard to determine the mechanical properties of this design due to its complex geometries and nonlinear deformation configuration, thereby limiting its further applications. In this paper, we present a model for the postbuckling behavior of kirigami membranes through a combination of theoretical modeling, finite element analysis, and experiments. Scaling laws for elastic stretchability are developed, showing good agreement with numerical results and experimental images. Investigations on the critical height of post array are conducted to ensure the boundary condition of the kirigami membranes in the analytical model. These results can serve as design guidelines for kirigami structures and facilitate their applications in flexible/stretchable electronics.

Conformal organic–inorganic semiconductor composites for flexible thermoelectrics

2020 ◽  
Vol 13 (2) ◽  
pp. 511-518 ◽  
Author(s):  
Qing Xu ◽  
Sanyin Qu ◽  
Chen Ming ◽  
Pengfei Qiu ◽  
Qin Yao ◽  
...  
Keyword(s):  
Human Body ◽  
Promising Material ◽  
Wearable Electronics ◽  
Inorganic Semiconductor

The development of flexible organic–inorganic thermoelectric composites constitutes a promising material approach toward harvesting heat from the human body or environment to power wearable electronics.

Printable Electronics: Patterning of Conductive Materials for Novel Applications

2004 ◽  
Vol 828 ◽  
Author(s):  
Anupama Karwa ◽  
Yu Xia ◽  
Daniel M. Clark ◽  
Thomas W. Smith ◽  
Bruce E. Kahn
Keyword(s):  
Materials Science ◽  
Low Cost ◽  
High Volume ◽  
Production Volume ◽  
Wearable Electronics ◽  
Conductive Materials ◽  
High Volume Production ◽  
Volume Production ◽  
Novel Applications ◽  
Printing Processes

ABSTRACTThe convergence of materials science, printing, and electronics promises to offer low cost and high volume production of devices such as transistors, RFID tags, wearable electronics and other novel applications. Although a number of “soft lithographic” techniques have been used to make these devices, they are slow and have a limited production volume [5], [14-15].Here high volume printing processes like rotary letterpress, flexography and offset lithography have been investigated for patterning conductive materials [1]. The synthesis and development of conducting inks using electrically functional polymers has been studied. The feasibility of using such inks in high volume printing processes has been studied. An attempt has been made to print conductive interdigitated electrodes using these inks to obtain uniform coating properties and appropriate electrical characteristics. Various process parameters like type of substrate, inking time and speed, printing pressure, printing force and ink formulation have been investigated.

Thermal Design Guidelines for FC-BGA Package With Hot Spot Problem

2006 ◽  
Author(s):  
Eason Chen ◽  
Jeng Yuan Lai ◽  
Yu-Po Wang ◽  
C. S. Hsiao
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
Flip Chip ◽  
Hot Spot ◽  
Design Guidelines ◽  
Thermal Design ◽  
Cfd Modeling ◽  
Bga Packages ◽  
Function Integration ◽  
Hot Spot Problem

With the evolving function integration and power consumption of high-end IC applications, thermal management has become one of the most important concerns of semiconductor designers. In particular, hot spot problem, in recent years, has turned into a popular topic in IC chip thermal management that it comes from the uneven power consumptions in various logical blocks and results in local high temperature that would increase IC chip failure risks. In this paper, thermal evaluations for hot spot impacts on Flip-Chip Ball Grid Array (FC-BGA) packages were presented using CFD modeling technique. The evaluation topics covered hot spot power density effects on substrate designs and heat sink module characterizations including passive heat sink and fan heat sink performance under various hot spot conditions. Finally, thermal suggestions were concluded for package designers to improve the substrate design in substrate via arrangements to effectively dissipate hot spot source. Also heat sink module performance was derived for different ratings of hot spots and external heat sink performance is obtained for the hot spot impact elimination.

scholarly journals Functional Fibers, Composites and Textiles Utilizing Photothermal and Joule Heating

Polymers ◽  
2020 ◽  
Vol 12 (1) ◽  
pp. 189 ◽  
Author(s):  
Juhyun Park
Keyword(s):  
Heat Loss ◽  
Thermal Management ◽  
Joule Heating ◽  
Human Body ◽  
Thermal Environment ◽  
Wearable Electronics ◽  
Future Directions ◽  
Electrical Circuits ◽  
Photothermal Heating ◽  
Biomimetic Structures

This review focuses on the mechanism of adjusting the thermal environment surrounding the human body via textiles. Recently highlighted technologies for thermal management are based on the photothermal conversion principle and Joule heating for wearable electronics. Recent innovations in this technology are described, with a focus on reports in the last three years and are categorized into three subjects: (1) thermal management technologies of a passive type using light irradiation of the outside environment (photothermal heating), (2) those of an active type employing external electrical circuits (Joule heating), and (3) biomimetic structures. Fibers and textiles from the design of fibers and textiles perspective are also discussed with suggestions for future directions to maximize thermal storage and to minimize heat loss.

Design Guidelines for Efficient Thermal Management of Mid-Infrared Quantum Cascade Lasers

2011 ◽  
Vol 1 (12) ◽  
pp. 1975-1982 ◽  
Author(s):  
Satish C. Chaparala ◽  
Feng Xie ◽  
Catherine Caneau ◽  
Chung En Zah ◽  
Lawrence C. Hughes
Keyword(s):  
Thermal Management ◽  
Quantum Cascade Lasers ◽  
Design Guidelines ◽  
Mid Infrared ◽  
Quantum Cascade ◽  
Cascade Lasers

Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding

2015 ◽  
Author(s):  
Ah-Young Park ◽  
S. B. Park
Keyword(s):  
Integrated Circuits ◽  
Thermal Management ◽  
Thermal Loading ◽  
Three Dimensional ◽  
Design Guidelines ◽  
Element Analysis ◽  
Design Guideline ◽  
Management Perspective ◽  
3D Packaging ◽  
3D Package

Three-dimensional (3D) packaging technology is directly related to the increasing I/O number as stacking chips. This technology has the potential to produce integrated circuits with a much better combination of cost, functionality, performance and power consumption. However, stacked chips raise several thermal issues that need to be addressed and eliminated. In this study, a quantitative study of the conventional solder-based interconnection is conducted based on many different cases of thermal loading, using finite element analysis (FEA). This preliminary study clearly shows limitation of the solder-based interconnection in the thermal management perspective. Underfill for microbμmp acts as a barrier of heat transfer in the conventional 3D stacked chip packages. Therefore, as an alternative, Cu-to-Cu direct bonding (CuDB), which has a better thermal conductivity, is proposed. Its parametric study is performed under the same/different loading conditions and dimensions. This study helps to highlight the thermal behavior of 3D packages consisting of various interconnections. Finally, based on the results, we can propose qualitative design guidelines of 3D packaging depending on various environment and conditions.

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