Performance assessment of class-E inverter for capacitive power transfer system

2017 ◽  
Vol 36 (4) ◽  
pp. 1237-1256 ◽  
Author(s):  
Yusmarnita Yusop ◽  
Mohd. Shakir Md. Saat ◽  
Siti Huzaimah Husin ◽  
Sing Kiong Nguang ◽  
Imran Hindustan
Keyword(s):  
Electromagnetic Interference ◽  
Printed Circuit Board ◽  
Capacitive Coupling ◽  
Circuit Board ◽  
Attractive Alternative ◽  
Power Transfer ◽  
Content Type ◽  
Zero Voltage Switching ◽  
Switching Losses ◽  
Class E

Purpose This paper aims to present a new wireless power transfer technique using capacitive coupling. The capacitive power transfer (CPT) system has been introduced as an attractive alternative to the traditional inductive coupling method. The CPT offers benefits such as simple topology, fewer components, better electromagnetic interference (EMI) performance and robustness to surrounding metallic elements. Design/methodology/approach A class-E inverter together with and without inductor capacitor (LC) matching circuit has been utilised in this work because of its ability to perform the DC-to-AC inversion efficiently with significant reduction in switching losses. The validity of the proposed concept has been verified by conducting a laboratory experiment of the CPT system. Findings The performances for both systems are analysed and evaluated. A 9.7 W output power is generated through a combined interface [printed circuit board (PCB) plate] capacitance of 2.82 nF at an operating frequency of 1 MHz, with 97 per cent efficiency for 0.25 mm coupling gap distance. Originality value An efficient CPT system with class-E LC matching topology is proposed in this paper. With this topology, the zero-voltage switching can be achieved even if the load is different by properly designing the LC matching transformation circuit.

Improve electromagnetic compatibility of electronic products with multivariate parametric design

2017 ◽  
Vol 34 (1) ◽  
pp. 45-55 ◽  
Author(s):  
Chien-Yi Huang ◽  
Ching-Hsiang Chen
Keyword(s):  
Electromagnetic Interference ◽  
Electromagnetic Compatibility ◽  
Printed Circuit Board ◽  
Optimal Parameter ◽  
Principal Component ◽  
Circuit Board ◽  
Design Parameters ◽  
Individual Country ◽  
Content Type ◽  
Noise Factors

Purpose Differing from previous studies trying to solve the electromagnetic compatibility (EMC) issue by addressing single factor, this study aims to combine measures of shielding, filtering and grounding to design parameters with the Taguchi method at the beginning of product design to come up with the optimal parameter combination. Design/methodology/approach EMC-related performance such as radiated emission, conduction interference and electrical fast transient/burst immunity (EFT) are response variables, whereas the printed circuit board and mechanic design-relevant parameters are considered as control factors. The noise factors are peripherals used together with the tablet. Findings The optimal design parameter matrix based on results from the application and integration of multivariate analysis method of principal component grey relation and technique for order preference by similarity to ideal solution suggests 14 grounding screw holes, cooling aperture of casing at diameter of 3 mm and staggered layout and 300O filter located at source of noise. Validation of this matrix shows around 10, 1 and 8 per cent improvement in radiation, conduction interference and EFT immunity. Originality/value The multivariate quality parameters’ design method proposed by this study improves EMC characteristics of products and meets the design specification required by customer, accelerating electronic product research and development process and complying with electromagnetic interference test regulations set forth by individual country.

scholarly journals The Development of Capacitive Power Transfer for Biomedical Implantable Devices

2019 ◽  
Vol 8 (3S2) ◽  
pp. 238-246
Keyword(s):  
Electromagnetic Interference ◽  
Impedance Matching ◽  
Implantable Device ◽  
Capacitive Coupling ◽  
Power Transfer ◽  
Wireless Power ◽  
Inductive Power Transfer ◽  
Zero Voltage Switching ◽  
Biomedical Device ◽  
Zero Voltage

Wireless power transfer using electric and magnetic near-fields has been used in many applications widely, and biomedical implants being one of them. The most commonly used method for powering power wirelessly to biomedical implantable device is using inductive coupling between two mutually-coupled coils. In this paper, a consider new method will be proposed in transferring power for biomedical device which is based on capacitive coupling and known as capacitive power transfer (CPT) system. The main reasons of using this method are the low electromagnetic interference (EMI), can reduce power losses and the abilities to transfer power across metal barriers compared to inductive power transfer. To be specific, in this work, we have designed Class E circuit as an inverter to convert the 12VDC to AC with 1 MHz frequency. The prototype of the capacitive power transfer for implantable application has also been successfully developed with capacitive plate dimensions of 3cmx3cm width per length for receiver plate and 4cmx4cm for transmitter plate, respectively. 5mm thickness of beef separation between the plates is used in this paper. The design specification of this work is accordance to stimulator for peripheral nerve implantable device which only needs 100 mW of power to operate in the CPT system. Overall, the developed CPT system for the biomedical device is able to deliver 76mWatt with 41.43% efficiency. To enhance the efficiency, the impedance matching circuit has been proposed in this work and the prototype is now able to deliver 140mWatt power to the DC load, achieving zero voltage switching (ZVS) waveform and efficiency of 77.5%.

scholarly journals Analysis and Optimized Design of Metamaterials for Mid-Range Wireless Power Transfer Using a Class-E RF Power Amplifier

2018 ◽  
Vol 9 (1) ◽  
pp. 26 ◽  
Author(s):  
Cancan Rong ◽  
Xiong Tao ◽  
Conghui Lu ◽  
Zhaoyang Hu ◽  
Xiutao Huang ◽  
...  
Keyword(s):  
Power Amplifier ◽  
Printed Circuit Board ◽  
High Efficiency ◽  
Single Layer ◽  
Wireless Power Transfer ◽  
Circuit Board ◽  
Optimized Design ◽  
Power Transfer ◽  
Wireless Power ◽  
Class E

In this paper, a mid-range wireless power transfer (WPT) system based on metamaterials (MMs) has been presented. It has been shown that the MMs are positioned in the WPT system to focalize the electromagnetic field for distance enhancement and efficiency improvement theoretically and experimentally. The MMs were fabricated by using a single layer printed-circuit board (PCB) with the negative magnetic permeability, μr. An applicable impedancetuning technology was implemented by changing the operating distance between the drive (load) resonator and the internal resonator, which can achieve the optimal load of the system. In addition, the Class-E RF (radio frequency) power amplifier is firstly proposed as the high frequency excitation source of the WPT system based on the MMs due to its simple design and high efficiency. The proposed technology can achieve efficiency improvements of 4.26% and 9.13% at distances of 100 cm and 200 cm around the 2.80 MHz WPT system with the MMs, respectively. Specially, it is worth mentioning that the system efficiency is enhanced by 18.58% at 160 cm. The measured results indicate the WPT system based on the MMs can assure a stable output power of 5W at a transfer distance of 200 cm.

Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

Circuit World ◽  
2016 ◽  
Vol 42 (1) ◽  
pp. 32-36 ◽  
Author(s):  
Michal Baszynski ◽  
Edward Ramotowski ◽  
Dariusz Ostaszewski ◽  
Tomasz Klej ◽  
Mariusz Wojcik ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
New Technologies ◽  
Electronic Device ◽  
Circuit Board ◽  
New Materials ◽  
Content Type ◽  
Printed Circuit

Purpose – The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies. Design/methodology/approach – Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties. Findings – The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices. Originality/value – This paper shows the advantages of new technologies and materials in PCB thermal management.

Wireless Power Transfer Systems via Strong Coupled Magnetic Resonances — Design, PCB Implementation and Tests

2011 ◽  
Vol 383-390 ◽  
pp. 5984-5989
Author(s):  
Yan Ping Yao ◽  
Hong Yan Zhang ◽  
Zheng Geng
Keyword(s):  
Printed Circuit Board ◽  
Experimental System ◽  
Wireless Power Transfer ◽  
Circuit Board ◽  
Transfer Efficiency ◽  
Power Transfer ◽  
Wireless Power ◽  
Power Transfer Efficiency ◽  
Coil Winding ◽  
Magnetic Resonances

In this paper, we present theoretical analysis and detailed design of a class of wireless power transfer (WPT) systems based on strong coupled magnetic resonances. We established the strong coupled resonance conditions for practically implementable WPT systems. We investigated the effects of non-ideal conditions presented in most practical systems on power transfer efficiency and proposed solutions to deal with these problems. We carried out a design of WPT system by using PCB (Printed Circuit Board) antenna pair, which showed strong coupled magnetic resonances. The innovations of our design include: (1) a new coil winding pattern for resonant coils that achieves a compact space volume, (2) fabrication of resonant coils on PCBs, and (3) integration of the entire system on a pair of PCBs. Extensive experiments were performed and experimental results showed that our WPT system setup achieved a guaranteed power transfer efficiency 14% over a distance of two times characteristic length(44cm). The wireless power transfer efficiency in this PCB based experimental system was sufficiently high to lighten up a LED with a signal generator.

A high-power PCCM LED driver based on GaN eHEMT with hybrid dimming modes

Circuit World ◽  
2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Xixian Lin ◽  
Yuming Zhang ◽  
Yimeng Zhang ◽  
Guangjian Rong
Keyword(s):  
Printed Circuit Board ◽  
Pulse Width Modulation ◽  
Circuit Board ◽  
Switching Frequency ◽  
Led Driver ◽  
Power Circuit ◽  
Content Type ◽  
Wide Range ◽  
Circuit Function ◽  
Pwm Dimming

Purpose The purpose of this study is to design a more flexible and larger range of the dimming circuit that achieves the independence of multiple LED strings drive and can time-multiplex the power circuit. Design/methodology/approach The state-space method is used to model the BUCK circuit working in Pseudo continuous conduction mode, analyze the frequency characteristics of the system transfer function and design the compensation network. Build a simulation platform on the Orcad PSPICE platform and verify the function of the designed circuit through the simulation results. Use Altium Designer 16 to draw the printed circuit board, complete the welding of various components and use the oscilloscope, direct current (DC) power supply and a signal generator to verify the circuit function. Findings A prototype of the proposed LED driver is fabricated and tested. The measurement results show that the switching frequency can be increased to 1 MHz, Power inductance is 2.2 µH, which is smaller than current research. The dimming ratio can be set from 10% to 100%. The proposed LED driver can output more than 48 W and achieve a peak conversion efficiency of 91%. Originality/value The proposed LED driver adopts pulse width modulation (PWM) dimming at a lower dimming ratio and adopts DC dimming at a larger dimming ratio to realize switching PWM dimming to analog dimming. The control strategy can be more precise and have a wide range of dimming.

Robotic system design and development for automated dismantling of PCB waste

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Ioan Doroftei ◽  
Daniel Chirita ◽  
Ciprian Stamate ◽  
Stelian Cazan ◽  
Carlos Pascal ◽  
...  
Keyword(s):  
Design Methodology ◽  
Printed Circuit Board ◽  
Vision System ◽  
Electronic Waste ◽  
Robotic System ◽  
Circuit Board ◽  
Short Introduction ◽  
Content Type ◽  
Printed Circuit ◽  
System A

Purpose The mass electronics sector is one of the most critical sources of waste, in terms of volume and content with dangerous effects on the environment. The purpose of this study is to provide an automated and accurate dismantling system that can improve the outcome of recycling. Design/methodology/approach Following a short introduction, the paper details the implementation layout and highlights the advantages of using a custom architecture for the automated dismantling of printed circuit board waste. Findings Currently, the amount of electronic waste is impressive while manual dismantling is a very common and non-efficient approach. Designing an automatic procedure that can be replicated, is one of the tasks for efficient electronic waste recovery. This paper proposes an automated dismantling system for the advanced recovery of particular waste materials from computer and telecommunications equipment. The automated dismantling architecture is built using a robotic system, a custom device and an eye-to-hand configuration for a stereo vision system. Originality/value The proposed approach is innovative because of its custom device design. The custom device is built using a programmable screwdriver combined with an innovative rotary dismantling tool. The dismantling torque can be tuned empirically.

Analysis of surface insulation resistance related failures in electronics by circuit simulation

Circuit World ◽  
2017 ◽  
Vol 43 (2) ◽  
pp. 45-55 ◽  
Author(s):  
Vadimas Verdingovas ◽  
Salil Joshy ◽  
Morten Stendahl Jellesen ◽  
Rajan Ambat
Keyword(s):  
Printed Circuit Board ◽  
Electronic Device ◽  
Early Stage ◽  
Circuit Simulation ◽  
Circuit Board ◽  
Insulation Resistance ◽  
Electronic Circuits ◽  
Content Type ◽  
Printed Circuit ◽  
Surface Insulation Resistance

Purpose The purpose of this study is to show that the humidity levels for surface insulation resistance (SIR)-related failures are dependent on the type of activators used in no-clean flux systems and to demonstrate the possibility of simulating the effects of humidity and contamination on printed circuit board components and sensitive parts if typical SIR data connected to a particular climatic condition are available. This is shown on representative components and typical circuits. Design/methodology/approach A range of SIR values obtained on SIR patterns with 1,476 squares was used as input data for the circuit analysis. The SIR data were compared to the surface resistance values observable on a real device printed circuit board assembly. SIR issues at the component and circuit levels were analysed on the basis of parasitic circuit effects owing to the formation of a water layer as an electrical conduction medium. Findings This paper provides a summary of the effects of contamination with various weak organic acids representing the active components in no-clean solder flux residue, and demonstrates the effect of humidity and contamination on the possible malfunctions and errors in electronic circuits. The effect of contamination and humidity is expressed as drift from the nominal resistance values of the resistors, self-discharge of the capacitors and the errors in the circuits due to parasitic leakage currents (reduction of SIR). Practical/implications The methodology of the analysis of the circuits using a range of empirical leakage resistance values combined with the knowledge of the humidity and contamination profile of the electronics can be used for the robust design of a device, which is also important for electronic products relying on low current consumption for long battery lifetime. Originality/value Examples provide a basic link between the combined effect of humidity and contamination and the performance of electronic circuits. The methodology shown provides the possibility of addressing the climatic reliability of an electronic device at the early stage of device design by using typical SIR data representing the possible climate exposure.

Vision-force guided precise robotic assembly for 2.5D components in a semistructured environment

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Boyoung Kim ◽  
Minyong Choi ◽  
Seung-Woo Son ◽  
Deokwon Yun ◽  
Sukjune Yoon
Keyword(s):  
Computer Aided Design ◽  
Degrees Of Freedom ◽  
Printed Circuit Board ◽  
Force Sensor ◽  
Circuit Board ◽  
Robotic Assembly ◽  
Ccd Cameras ◽  
Content Type ◽  
3 Dimensional ◽  
Aided Design

Purpose Many manufacturing sites require precision assembly. Particularly, similar to cell phones, assembly at the sub-mm scale is not easy, even for humans. In addition, the system should assemble each part with adequate force and avoid breaking the circuits with excessive force. The purpose of this study is to assemble high precision components with relatively reasonable vision devices compared to previous studies. Design/methodology/approach This paper presents a vision-force guided precise assembly system using a force sensor and two charge coupled device (CCD) cameras without an expensive 3-dimensional (3D) sensor or computer-aided design model. The system accurately estimates 6 degrees-of-freedom (DOF) poses from a 2D image in real time and assembles parts with the proper force. Findings In this experiment, three connectors are assembled on a printed circuit board. This system obtains high accuracy under 1 mm and 1 degree error, which shows that this system is effective. Originality/value This is a new method for sub-mm assembly using only two CCD cameras and one force sensor.

Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching

Circuit World ◽  
2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Denglin Fu ◽  
Yanan Wen ◽  
Jida Chen ◽  
Lansi Lu ◽  
Ting Yan ◽  
...  
Keyword(s):  
Corrosion Inhibitor ◽  
Corrosion Inhibitors ◽  
Printed Circuit Board ◽  
Copper Surface ◽  
Etching Process ◽  
Circuit Board ◽  
Content Type ◽  
Printed Circuit ◽  
Etching Method ◽  
Electrolytic Etching

Purpose The purpose of this paper is to study an electrolytic etching method to prepare fine lines on printed circuit board (PCB). And the influence of organics on the side corrosion protection of PCB fine lines during electrolytic etching is studied in detail. Design/methodology/approach In this paper, the etching factor of PCB fine lines produced by new method and the traditional method was analyzed by the metallographic microscope. In addition, field emission scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) were used to study the inhibition of undercut of the four organometallic corrosion inhibitors with 2,5-dimercapto-1,3,4-thiadiazole, benzotriazole, l-phenylalanine and l-tryptophan in the electrolytic etching process. Findings The SEM results show that corrosion inhibitors can greatly inhibit undercut of PCB fine lines during electrolytic etching process. XPS results indicate that N and S atoms on corrosion inhibitors can form covalent bonds with copper during electrolytic etching process, which can be adsorbed on sidewall of PCB fine lines to form a dense protective film, thereby inhibiting undercut of PCB fine lines. Quantum chemical calculations show that four corrosion inhibitor molecules tend to be parallel to copper surface and adsorb on copper surface in an optimal form. COMSOL Multiphysics simulation revealed that there is a significant difference in the amount of corrosion inhibitor adsorbed on sidewall of the fine line and the etching area. Originality/value As a clean production technology, electrolytic etching method has a good development indicator for the production of high-quality fine lines in PCB industry in the future. And it is of great significance in saving resources and reducing environmental pollution.

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