An overview of phonon-based heat conduction models and their solution

2016 ◽  
Vol 26 (3/4) ◽  
pp. 916-949 ◽  
Author(s):  
V.M Wheeler ◽  
K K Tamma

Purpose – The purpose of this paper is to provide an overview and some recent advances in the models, analysis and simulation of thermal transport of phonons as related to the field of microscale/macroscale heat conduction in solids. The efforts focus upon a fairly comprehensive overview of the subject matter from a unified standpoint highlighting the various approximations inherent in the thermal models. Subsequently, the numerical formulations and illustrations using the current state-of-the-art are provided. Design/methodology/approach – This paper is dedicated to the approximate solution to the relaxation time phonon Boltzmann equation (BE). While original contributions are pointed out and addressed appropriately, the efforts and contributions will be focussed on a relatively complete overview highlighting the field from one unified standpoint and clearly stating all assumptions that go into the approximations inherent to existing models. The contents will be divided as follows: In the first section the authors will give an overview of semi-classical phonon transport physics. Then the authors will discuss the equation of phonon radiative transport (EPRT) and its approximations—the ballistic-diffusive approximation (BDA) and the new heat equation (NHE). Next the authors derive and discuss the C-F model. A numerical discretization method valid for all models is then presented followed by results to numerical simulations and discussion. Findings – From a unified treatment based on the introduction of an energy distribution function, the authors have derived the EPRT and its two well-known approximations: BDA and NHE. For completeness and to provide a vehicle for a general numerical discretization approach, the authors have also included analysis of the C-F model and the parabolic and hyperbolic descriptions of heat transfer along with it. The approximation of angular dependence of phonons in radiation-like descriptions of transport has been given special attention. The assumption of isotropy was found to be of paramount importance in the formulation of position space models for phononic thermal transport. For the thin film problem considered here, the NHE along with the proper boundary condition appears to be the best choice to approximate the phonon BE. Not only does it provide predictions that are in excellent agreement with EPRT, it does not require the discretization of phase space making it far more computationally efficient. Originality/value – The authors hope this work will help dispel the idea that since Fourier’s law describes diffusion (under limiting assumptions) and it has shown to be ineffective in describing heat transfer for very thin films, that diffusion cannot describe heat transfer in thin films and one should look to a radiative description instead. If one considers diffusion in the sense of random motion, as invisaged by the original builders of the subject (Smoluchowski, Einstein, Ornstein et al.), instead of a temperature gradient, the idea that diffusion can govern thermal transport at this scale is not surprising. Indeed, the NHE is essentially a diffusion equation that describes the motion of particles up to the point of true randomness (isotropy) as well as thereafter.

2008 ◽  
Vol 130 (7) ◽  
Author(s):  
Jaona Randrianalisoa ◽  
Dominique Baillis

Heat conduction in submicron crystalline materials can be well modeled by the Boltzmann transport equation (BTE). The Monte Carlo method is effective in computing the solution of the BTE. These past years, transient Monte Carlo simulations have been developed, but they are generally memory demanding. This paper presents an alternative Monte Carlo method for analyzing heat conduction in such materials. The numerical scheme is derived from past Monte Carlo algorithms for steady-state radiative heat transfer and enables us to understand well the steady-state nature of phonon transport. Moreover, this algorithm is not memory demanding and uses very few iteration to achieve convergence. It could be computationally more advantageous than transient Monte Carlo approaches in certain cases. Similar to the famous Mazumder and Majumdar’s transient algorithm (2001, “Monte Carlo Study of Phonon Transport in Solid Thin Films Including Dispersion and Polarization,” ASME J. Heat Transfer, 123, pp. 749–759), the dual polarizations of phonon propagation, the nonlinear dispersion relationships, the transition between the two polarization branches, and the nongray treatment of phonon relaxation times are accounted for. Scatterings by different mechanisms are treated individually, and the creation and/or destruction of phonons due to scattering is implicitly taken into account. The proposed method successfully predicts exact solutions of phonon transport across a gallium arsenide film in the ballistic regime and that across a silicon film in the diffusion regime. Its capability to model the phonon scattering by boundaries and impurities on the phonon transport has been verified. The current simulations agree well with the previous predictions and the measurement of thermal conductivity along silicon thin films and along silicon nanowires of widths greater than 22nm. This study confirms that the dispersion curves and relaxation times of bulk silicon are not appropriate to model phonon propagation along silicon nanowires of 22nm width.


2021 ◽  
Vol 11 (13) ◽  
pp. 5933
Author(s):  
Wei-Jen Chen ◽  
I-Ling Chang

This study investigated the thermal transport behaviors of branched carbon nanotubes (CNTs) with cross and T-junctions through non-equilibrium molecular dynamics (NEMD) simulations. A hot region was created at the end of one branch, whereas cold regions were created at the ends of all other branches. The effects on thermal flow due to branch length, topological defects at junctions, and temperature were studied. The NEMD simulations at room temperature indicated that heat transfer tended to move sideways rather than straight in branched CNTs with cross-junctions, despite all branches being identical in chirality and length. However, straight heat transfer was preferred in branched CNTs with T-junctions, irrespective of the atomic configuration of the junction. As branches became longer, the heat current inside approached the values obtained through conventional prediction based on diffusive thermal transport. Moreover, directional thermal transport behaviors became prominent at a low temperature (50 K), which implied that ballistic phonon transport contributed greatly to directional thermal transport. Finally, the collective atomic velocity cross-correlation spectra between branches were used to analyze phonon transport mechanisms for different junctions. Our findings deeply elucidate the thermal transport mechanisms of branched CNTs, which aid in thermal management applications.


2019 ◽  
Vol 24 (1) ◽  
pp. 39-61 ◽  
Author(s):  
Hendrik Sebastian Birkel ◽  
Evi Hartmann

PurposeThe purpose of this paper is to offer a comprehensive overview of challenges and risks of the Internet of Things (IoT) in supply chain management (SCM) and provide a structured framework for classifying and analyzing the relevant literature to deduce insights for research and practice.Design/methodology/approachA systematic literature review (SLR) of 102 peer-reviewed journal articles on the topic of IoT in SCM was conducted.FindingsThis review identifies, categorizes and describes the relevant literature regarding the dimensions time and specificity. The resulting framework contains a holistic overview including focus areas and relations of macro-environmental, network-related and organizational challenges and risks. Furthermore, this review represents a conceptual framework for future research, considering the multidisciplinary body of the subject and provides an analysis of the timeline of literature, journals and used methodologies.Practical implicationsThis study offers valuable insights into IoT and its impact on applications, processes and the structure of organizations and supply chains (SCs). The identification of challenges and risks helps to prepare for changes in the future because of the disruptive nature of this technology.Originality/valueThe originality of this paper lies in the synthesis of the fragmented body of literature of IoT challenges and risks for SCM. The derived framework and identification of relations and research gaps provide the foundation for further research to evaluate the relations between challenges and risks and offer solutions.


2014 ◽  
Vol 4 (1) ◽  
Author(s):  
Xinjiang Wang ◽  
Baoling Huang

Abstract We have systematically investigated the in-plane thermal transport in Si thin films using an approach based on the first-principles calculations and lattice dynamics. The effects of phonon mode depletion induced by the phonon confinement and the corresponding variation in interphonon scattering, which may be important for the thermal conductivities of ultra-thin films but are often neglected in precedent studies, are considered in this study. The in-plane thermal conductivities of Si thin films with different thicknesses have been predicted over a temperature range from 80 K to 800 K and excellent agreements with experimental results are found. The validities of adopting the bulk phonon properties and gray approximation of surface specularity in thin film studies have been clarified. It is found that in ultra-thin films, while the phonon depletion will reduce the thermal conductivity of Si thin films, its effect is largely offset by the reduction in the interphonon scattering rate. The contributions of different phonon modes to the thermal transport and isotope effects in Si films with different thicknesses under various temperatures are also analyzed.


Author(s):  
Taofang Zeng

Phonon heat conduction in thin films and superlattices of dielectric materials has attracted extensive attentions in the past decade. Nonetheless, a wide range of micro- and nanoscale thermal problems is associated with non-planar geometries such as spherical and cylindrical media. With the rapid growth of research and development in nano-materials and nanostructures, understanding of heat transfer in micro- and nano-cylindrical and spherical media becomes important. Examples include cladding and coating for optic fibers and nanowires.


Author(s):  
Gary J. Cheng ◽  
Daniel Pirzada ◽  
Xin Ai ◽  
Ben Li

The results of numerical simulation of heat transfer phenomena in GaAs thin films irradiated by a pulsed laser are presented. A numerical algorithm involving a discontinuous Galerkin finite element method for the solution of hyperbolic heat conduction is used to solve the dual-phase-lag heat conduction equation The effects of different process parameters on heat propagation are analyzed. The heat conduction mode after pulsed laser irradiation is strongly dependent upon the incident laser energy density, film thickness and pulse duration. The heat transfer behavior for nano-, pico- and femto- second pulses has been studied and compared. A wave-type heat transfer phenomena was observed when pulse duration is of the order of relaxation time of the material being heated. It was found that for sub-picosecond pulses, the heat transfer occurs only by a thermal shock wave.


Author(s):  
Dhruv Singh ◽  
Xiaohui Guo ◽  
Alina Alexeenko ◽  
Jayathi Y. Murthy ◽  
Timothy S. Fisher

A physically rigorous computational algorithm is developed and applied to calculate sub-continuum thermal transport in structures containing semiconductor-gas interfaces. The solution is based on a finite volume discretization of the Boltzmann equation for gas molecules (in the gas phase) and phonons (in the semiconductor). A partial equilibrium is assumed between gas molecules and phonons at the interface of the two media, and the degree of this equilibrium is determined by the accommodation coefficients of gas molecules and phonons on either side of the interface. Energy balance is imposed to obtain a value of the interface temperature. The problem of heat transfer between two parallel plates is investigated. A range of transport regimes is studied, varying from ballistic phonon transport and free molecular flow to continuum heat transfer in both gas and solid. In particular, the thermal interface resistance (or temperature slip) at a gas-solid interface is extracted in the mesoscopic regime where a solution of the Boltzmann equation is necessary. This modeling approach is expected to find applications in the study of heat conduction through microparticle beds, gas flows in microchannel heat sinks and in determining gas gap conductance in thermal interface materials.


2019 ◽  
Vol 30 (4) ◽  
pp. 1725-1742 ◽  
Author(s):  
Andrzej Frąckowiak ◽  
David Spura ◽  
Uwe Gampe ◽  
Michał Ciałkowski

Purpose T-shaped cavities occur by design in many technical applications. An example of such a stator cavity is the side space between the guide vane carriers and the outer casing of a steam turbine. Thermal conditions inside it have a significant impact on the deformation of the turbine casing. In order to improve its prediction, the purpose of this paper is to provide a methodology to gain better knowledge of the local heat transfer at the cavity boundaries based on experimental results. Design/methodology/approach To determine the heat transfer coefficient distribution inside a model cavity with the help of a scaled generic test rig, an inverse heat conduction problem is posed and a method for solving such type of problems in the form of linear combinations of Trefftz functions is presented. Findings The results of the calculations are compared with another inverse method using first-order gradient optimization technique as well as with estimated values obtained with an analytic two-dimensional thermal network model, and they show an excellent agreement. The calculation procedure is proved to be numerically stable for different degrees of complexity of the sought boundary conditions. Originality/value This paper provides a universal and robust methodology for the fast direct determination of an arbitrary distribution of heat transfer coefficients based on material temperature measurements spread over the confining wall.


Author(s):  
Nitish Kumar ◽  
Matthew Barry ◽  
Satish Kumar

Abstract Phonon transport  in β-Ga2O3 thin films and metal–oxide field effect transistors (MESFETs) are investigated using non-gray Boltzmann transport equations (BTE) to decipher the effect of  ballistic-diffusive phonon transport. The effects of domain size, and  energy dissipation to various phonon modes and subsequent phonon-phonon energy exchange on the thermal transport and temperature distribution is investigated using non-gray BTE. Our analysis deciphered that domain size plays a major role in thermal transport in β-Ga2O3 but energy dissipation to various phonon modes and subsequent phonon-phonon energy exchange does not affect the temperature field significantly.   Phonon transport in β-Ga2O3 MESFETs on diamond substrate is investigated using coupled non-gray BTE and Fourier model. It is established that the ballistic effects need to be considered for devices with β-Ga2O3 layer thickness less than 1 µm. A non-gray phonon BTE model should be used near hotspot in the thin β-Ga2O3 layer as the Fourier model may not give accurate temperature distribution. The results from this work will help in understanding the mechanism of phonon transport in the β-Ga2O3 thin films and energy efficient design of its FETs.


Author(s):  
Ranganayakulu Chennu

Purpose The purpose of this study is to find the thermo-hydraulic performances of compact heat exchangers (CHE’s), which are strongly depending upon the prediction of performance of various types of heat transfer surfaces such as offset strip fins, wavy fins, rectangular fins, triangular fins, triangular and rectangular perforated fins in terms of Colburn “j” and Fanning friction “f” factors. Design/methodology/approach Numerical methods play a major role for analysis of compact plate-fin heat exchangers, which are cost-effective and fast. This paper presents the on-going research and work carried out earlier for single-phase steady-state heat transfer and pressure drop analysis on CHE passages and fins. An analysis of a cross-flow plate-fin compact heat exchanger, accounting for the individual effects of two-dimensional longitudinal heat conduction through the exchanger wall, inlet fluid flow maldistribution and inlet temperature non-uniformity are carried out using a Finite Element Method (FEM). Findings The performance deterioration of high-efficiency cross-flow plate-fin compact heat exchangers have been reviewed with the combined effects of wall longitudinal heat conduction and inlet fluid flow/temperature non-uniformity using a dedicated FEM analysis. It is found that the performance deterioration is quite significant in some typical applications due to the effects of wall longitudinal heat conduction and inlet fluid flow non-uniformity on cross-flow plate-fin heat exchangers. A Computational Fluid Dynamics (CFD) program FLUENT has been used to predict the design data in terms of “j” and “f” factors for plate-fin heat exchanger fins. The suitable design data are generated using CFD analysis covering the laminar, transition and turbulent flow regimes for various types of fins. Originality/value The correlations for the friction factor “f” and Colburn factor “j” have been found to be good. The correlations can be used by the heat exchanger designers and can reduce the number of tests and modification of the prototype to a minimum for similar applications and types of fins.


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