Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Ni-P solder joints

2016 ◽  
Vol 28 (4) ◽  
pp. 215-221 ◽  
Author(s):  
Xingchen Yan ◽  
Kexin Xu ◽  
Junjie Wang ◽  
Xicheng Wei ◽  
Wurong Wang
Keyword(s):  
Design Methodology ◽  
Solder Bump ◽  
Solder Joints ◽  
Diffusion Rate ◽  
Analysis Software ◽  
Content Type ◽  
Image Analysis Software ◽  
Interfacial Intermetallic Compound ◽  
Ge Doping ◽  
Scanning Electron

Purpose The purpose of this paper is to comparatively investigate the microstructure and interfacial intermetallic compound (IMC) layer of Cu/SACPG/Ni and Cu/SAC0307/Ni solder joints after thermal aging. Design/methodology/approach The specimens were thermally aged at 150°C for 0, 24, 168 and 500 h. The microstructure and morphology of the interface IMC layer were observed by means of scanning electron microscope. The IMCs and the solder bump surface were analyzed by EDS. Moreover, the thickness of IMC layer was measured by using the image analysis software. Findings The morphology of IMC of Cu/SAC0307/Ni solder joint was consistent with that of the Cu/SACPG/Ni joint, which indicates that the addition of P and Ge had little effect on the IMC formation. The needle-like (Cu,Ni)6Sn5 was formed at the interface of solder/Ni solder joints. Meanwhile, the tiny particles inferred as Ag3Sn phase attached to the surface of (Cu,Ni)6Sn5. The growth rate of IMC layer of the Cu/SACPG/Ni joint was smaller than that of Cu/SAC0307/Ni joint with aging time increasing, which means the addition of trace P and Ge can slightly suppress the diffusion rate of the interfacial IMC. Originality/value There are no previous studies on the formation mechanism of the IMC layer of SAC0307 solder alloys with P and Ge addition.

The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies

2015 ◽  
Vol 27 (4) ◽  
pp. 178-184 ◽  
Author(s):  
Ye Tian ◽  
Justin Chow ◽  
Xi Liu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Design Methodology ◽  
Growth Process ◽  
Flip Chip ◽  
Solder Bump ◽  
Solder Joints ◽  
Solder Matrix ◽  
Industrial Practice ◽  
Content Type ◽  
Flip Chips

Purpose – The purpose of this paper is to study the intermetallic compound (IMC) thickness, composition and morphology in 100-μm pitch and 200-μm pitch Sn–Ag–Cu (SAC305) flip-chip assemblies after bump reflow and assembly reflow. In particular, emphasis is placed on the effect of solder joint size on the interfacial IMCs between metal pads and solder matrix. Design/methodology/approach – This work uses 100-μm pitch and 200-μm pitch silicon flip chips with nickel (Ni) pads and stand-off height of approximately 45 and 90 μm, respectively, assembled on substrates with copper (Cu) pads. The IMCs evolution in solder joints was investigated during reflow by using 100- and 200-μm pitch flip-chip assemblies. Findings – After bump reflow, the joints size controls the IMC composition and dominant IMC type as well as IMC thickness and also influences the dominant IMC morphology. After assembly reflow, the cross-reaction of the pad metallurgies promotes the dominant IMC transformation and shape coarsened on the Ni pad interface for smaller joints and promotes a great number of new dominate IMC growth on the Ni pad interface in larger joints. On the Cu pad interface, many small voids formed in the IMC in larger joints, but were not observed in smaller joints, combined with the drawing of the IMC growth process. Originality/value – With continued advances in microelectronics, it is anticipated that next-generation microelectronic assemblies will require a reduction of the flip-chip solder bump pitch to 100 μm or less from the current industrial practice of 130 to150 μm. This work shows that as the packaging size reduced with the solder joint interconnection, the solder size becomes an important factor in the intermetallic composition as well as morphology and thickness after reflow.

Corrosion inhibition of N80 steel in 10% HCl + 8% HBF4solution

2019 ◽  
Vol 66 (1) ◽  
pp. 1-10
Author(s):  
Juan Du ◽  
Yuning He ◽  
Pingli Liu ◽  
Yigang Liu ◽  
Xianghai Meng ◽  
...  
Keyword(s):  
Corrosion Inhibition ◽  
Design Methodology ◽  
X Ray Diffraction ◽  
Corrosion Morphology ◽  
Content Type ◽  
X Ray ◽  
N80 Steel ◽  
Corrosion Reaction ◽  
Hydrolysis Of ◽  
Scanning Electron

PurposeThis paper aims to analyze the corrosion and corrosion inhibition of N80 in 10 per cent HCl + 8 per cent fluoroboric acid (HBF4) solution for acidizing operation.Design/methodology/approachThe corrosion rate, kinetic parameters (Ea, A) and thermodynamic parameters (ΔH, ΔS) of N80 steel in fresh acid and spent acid, 10 per cent HCl + 8 per cent HBF4, 10 per cent HCl and 8 per cent HBF4solutions were calculated through immersion tests. The corrosion and inhibition properties were studied through X-ray diffraction and electrochemical measurements. The corrosion morphology of the corrosion product was examined by scanning electron microscopy (SEM).FindingsThe results demonstrated that the spent acid was the main cause of acidification corrosion, and the HBF4would cause serious corrosion to N80 steel. The results showed that the N80 steel was more seriously corroded in the spent acid than in fresh acid, and the hydrolysis of HBF4accelerates the dissolution process of N80 steel anode to control the corrosion reaction. The results showed that the acidification will definitely cause serious corrosion to the oil tube; therefore, necessary anti-corrosion measures must be taken in the acidification process.Originality/valueThe results showed that acidizing the formation with 10 per cent HCl + 8 per cent HBF4will definitely cause serious corrosion to the oil tube, especially when the spent acid flows back. Therefore, necessary anti-corrosion measures must be taken in the acidification process, especially in the spent acid flowback stage.

Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Mardiana Said ◽  
Muhammad Firdaus Mohd Nazeri ◽  
Nurulakmal Mohd Sharif ◽  
Ahmad Azmin Mohamad
Keyword(s):  
Tensile Properties ◽  
Design Methodology ◽  
Solder Joints ◽  
Reflow Time ◽  
Sac305 Solder ◽  
Cross Sectional ◽  
Content Type ◽  
Solder Reflow ◽  
Microwave Hybrid Heating ◽  
Si Wafer

Purpose This paper aims to investigate the morphology and tensile properties of SAC305 solder alloy under the influence of microwave hybrid heating (MHH) for soldering at different microwave parameters. Design/methodology/approach Si wafer was used as susceptor in MHH for solder reflow. Microwave operating power for medium and high ranging from 40 to 140 s reflow time was used to investigate their effect on the microstructure and strength of SAC305/Cu solder joints. The morphology and elemental composition of the intermetallic compound (IMC) joint were evaluated on the top surface and cross-sectional view. Findings IMC formation transformed from scallop-like to elongated scallop-like structure for medium operating power and scallop-like to planar-like structure for high operating power when exposed to longer reflow time. Compositional and phase analysis confirmed that the observed IMCs consist of Cu6Sn5, Cu3Sn and Ag3Sn. A thinner IMC layer was formed at medium operating power, 80 s (2.4 µm), and high operating power, 40 s (2.5 µm). The ultimate tensile strength at high operating power, 40 s (45.5 MPa), was 44.9% greater than that at medium operating power, 80 s (31.4 MPa). Originality/value Microwave parameters with the influence of Si wafer in MHH in soldering have been developed and optimized. A microwave temperature profile was established to select the appropriate parameter for solder reflow. For this MHH soldering method, the higher operating power and shorter reflow time are preferable.

Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging

2018 ◽  
Vol 30 (1) ◽  
pp. 14-25 ◽  
Author(s):  
Peng Yao ◽  
Xiaoyan Li ◽  
Fengyang Jin ◽  
Yang Li
Keyword(s):  
Electronic Packaging ◽  
Design Methodology ◽  
Solder Joints ◽  
Critical Size ◽  
Content Type ◽  
Detailed Mechanism ◽  
Ripening Process ◽  
Research Gap ◽  
Equivalent Method ◽  
First Time

Purpose This paper aims to analyze the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging. Design/methodology/approach Because of the infeasibility of analyzing the morphology transformation intuitively, a novel equivalent method is used. The morphology transformation on the Cu3Sn grains, during the formation of full Cu3Sn solder joints, is regarded as equivalent to the morphology transformation on the Cu3Sn grains derived from the Cu/Sn structures with different Sn thickness. Findings During soldering, the Cu3Sn grains first grew in the fine equiaxial shape in a ripening process until the critical size. Under the critical size, the Cu3Sn grains were changed from the equiaxial shape to the columnar shape. Moreover, the columnar Cu3Sn grains could be divided into different clusters with different growth directions. With the proceeding of soldering, the columnar Cu3Sn grains continued to grow in a feather of the width growing at a greater extent than the length. With the growth of the columnar Cu3Sn grains, adjacent Cu3Sn grains, within each cluster, merged with each other. Next, the merged columnar Cu3Sn grains, within each cluster, continued to merge with each other. Finally, the columnar Cu3Sn grains, within each cluster, merged into one coarse columnar Cu3Sn grain with the formation of full Cu3Sn solder joints. The detailed mechanism, for the very interesting morphology transformation, has been proposed. Originality/value Few researchers focused on the morphology transformation of interfacial phases during the formation of full intermetallic compounds joints. To bridge the research gap, the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints has been studied for the first time.

Polysilicon nanogap structure development using size expansion technique

2011 ◽  
Vol 28 (3) ◽  
pp. 24-30 ◽  
Author(s):  
Uda Hashim ◽  
Nazwa Taib ◽  
Thikra S. Dhahi ◽  
Azizullah Saifullah
Keyword(s):  
Design Methodology ◽  
Electrical Characterization ◽  
Active Surface ◽  
Device Fabrication ◽  
Electrical Behavior ◽  
Structure Development ◽  
Content Type ◽  
Expansion Technique ◽  
Fabrication And Characterization ◽  
Scanning Electron

PurposeNanobiosensors based on nanogap capacitor are widely used for measuring dielectric properties of DNA, protein and biomolecule. The purpose of this paper is to report on the fabrication and characterization polysilicon nanogap patterning using novelties technique.Design/methodology/approachOverall, the polysilicon nanogap pattern was fabricated based on conventional lithographic techniques. For size expansion technique, by employing simple dry thermal oxidation, the couple of nanogap pattern has been expanded to lowest nanogap value. The progress of nanogap pattern expansion was verified by using scanning electron microscopy (SEM). Conductivity, resistivity, and capacitance test were performed to characterize and to measure electrical behavior of full device fabrication.FindingsSEM characterization emphasis on the expansion of polysilicon nanogap pattern increasing with respect to oxidation time. Electrical characterization shows that nanogap enhanced the sensitivity of the device at the value of nano ampere of current.Originality/valueThese simple least‐cost method does not require complicated nanolithography method of fabrication but still possible to serve as biomolecular junction. This approach can be applied extensively to different design of nanogap structure down to several nanometer levels of dimensions. A method of preparing a nanogap electrode according to the present innovation has an advantage of providing active surface that can be easily modified for immobilizations of biomolecules.

scholarly journals Selective laser melting of Ti6Al7Nb with hydroxyapatite addition

2014 ◽  
Vol 20 (4) ◽  
pp. 301-310 ◽  
Author(s):  
Teodora Marcu ◽  
Cinzia Menapace ◽  
Luca Girardini ◽  
Dan Leordean ◽  
Catalin Popa
Keyword(s):  
Selective Laser Melting ◽  
Laser Power ◽  
Design Methodology ◽  
Point Of View ◽  
Medical Applications ◽  
Laser Melting ◽  
Scanning Strategy ◽  
Content Type ◽  
Processing Times ◽  
Scanning Electron

Purpose – The purpose of this paper was to obtain by means of selective laser melting and then characterize biocomposites of medical-grade Ti6Al7Nb with hydroxyapatite (2 and 5 vol.%) and without hydroxyapatite, as reference. Design/methodology/approach – Rectangular samples were manufactured with the same scanning strategy; the laser power was between 50 W and 200 W. Processed samples were analysed by means of optical microscopy, scanning electron microscopy and microhardness. Findings – The results showed that despite the very short processing times, hydroxyapatite decomposed and interacted with the base Ti6Al7Nb material. The decomposition degree was found to depend on the applied laser power. From the porosity and bulk microstructure point of view, the most appropriate materials for the purposed medical applications were Ti6Al7Nb with hydroxyapatite processed with a laser power of 50 W. Originality/value – The originality of the present work consists in the study of the behaviour and interaction of hydroxyapatite additive with the Ti6Al7Nb base powder under selective laser melting conditions, as depending on the applied laser power.

A technique to quantify and characterize the density of fibres and follicles in the skin of sheep

1995 ◽  
Vol 46 (8) ◽  
pp. 1525 ◽  
Author(s):  
BN Nagorcka ◽  
AE Dollin ◽  
DE Hollis ◽  
CD Beaton
Keyword(s):  
Low Cost ◽  
Skin Surface ◽  
Analysis Software ◽  
Sem Images ◽  
Fibre Bundles ◽  
Image Analysis Software ◽  
Skin Biopsies ◽  
The Cost ◽  
Non Destructive ◽  
Scanning Electron

A description is given of a non-destructive technique to count fibres and quantify their relative positions in the skin of sheep by making impressions of the skin surface of live sheep. Each impression contains within it clear morphological structures caused by individual wool fibres as they emerge from individual follicles, and clusters of wool fibres emerging from follicle bundles. Individual fibres and clusters of fibres can also be seen to be grouped together forming 'follicle groups'. The detailed accuracy of the impressions is confirmed by examining scanning electron microscope (SEM) images of a model of the skin obtained using the skin impression, and by examining SEM images of the impression itself. The impressions of individual fibres and clusters of fibres (produced from follicle bundles) appear to be countable using image analysis software. The new technique provides a low cost method (i.e. low relative to the cost of analysing skin biopsies) for measuring the density of fibres and fibre bundles, and the number of fibres per bundle in the skin. The measurements are expected to be of significant commercial interest to wool breeders.

A content analysis of influential wine blogs

2014 ◽  
Vol 26 (3) ◽  
pp. 168-187 ◽  
Author(s):  
Stefanie Beninger ◽  
Michael Parent ◽  
Leyland Pitt ◽  
Anthony Chan
Keyword(s):  
Content Analysis ◽  
Exploratory Study ◽  
Design Methodology ◽  
Wine Industry ◽  
Analysis Software ◽  
Product Attributes ◽  
Content Type ◽  
Analysis Study ◽  
Practical Implications ◽  
Insight Into

Purpose – The purpose of this exploratory study was to analyze the content of influential wine blogs. Design/methodology/approach – The study used content analysis software, Leximancer, to analyze the entire contents of five influential amateur wine blogs. Findings – A key finding is that these blogs all balance self-promotion with the content of their blogs, namely, wine and wine-related topics. The wine blogs, though evaluating wines in different ways, review not only the product attributes but also the experience surrounding wine. Research limitations/implications – Limitations of this study include that the analysis only included five wine blogs and the content analysis was conducted by a sole researcher using a computerized approach. Practical implications – Wine blogs have increasing influence in the wine industry, especially those written by amateur wine bloggers. As such, understanding the tactics used by wine bloggers is of interest to practitioners who aim to market their wines using such channels as well as providing insight into this contemporary platform for current and aspiring wine critics. Originality/value – This is the first content analysis study that analyzes the content of wine blogs as the readers themselves see it. It provides insights of value not only to those involved in marketing in the wine industry but also to those interested in the developments of amateur blogs in marketing.

On the Microstructure of Different Types of Particles in PM10 in Beijing-Tianjin-Tangshan City Group Agglomeration Atmosphere

2013 ◽  
Vol 448-453 ◽  
pp. 341-348 ◽  
Author(s):  
Shi Hong Cen ◽  
Xiao Yan Song ◽  
Long Yi Shao ◽  
Bing Yan ◽  
Yan Li Wu ◽  
...  
Keyword(s):  
Research Result ◽  
Urban Agglomeration ◽  
Spherical Particles ◽  
Distribution Characteristics ◽  
Analysis Software ◽  
Image Analysis Software ◽  
Mineral Particles ◽  
Different Types ◽  
City Group ◽  
Scanning Electron

This paper analyses the microstructure of different types of particles in PM10in Beijing-Tianjin-Tangshan urban agglomeration atmosphere in spring and summer by using field emission scanning electron microscopy (FESEM), in which the distribution characteristics of the size and number of the different types of particles in PM10are specifically analyzed by using image analysis software. The research result shows that the types of particles in Beijing-Tianjin-Tangshan urban agglomeration atmosphere are unknown particles, soot aggregates, mineral particles and spherical particles. According to the proportion of the three partials in the atmosphere, the three cities ranks as follows: in the aspect of unknown particles, Tianjin ranks first, which is followed by Tangshan and Beijing; in the aspect of soot aggregates, Tangshan ranks first ,which is followed by Beijing and Tianjin; in the aspect of mineral particles, Beijing ranks first ,which is followed by Tangshan and Tianjin; in the aspect of spherical particles, Beijing ranks first ,which is followed by Tangshan and Tianjin;

Comparative analysis of stearates as grease lubricant thickeners

2019 ◽  
Vol 71 (9) ◽  
pp. 1093-1098
Author(s):  
Lidan Yao ◽  
Lixin Wang ◽  
Haining Yang ◽  
Chuan Li ◽  
Hui Song ◽  
...  
Keyword(s):  
Radial Distribution ◽  
Metal Ion ◽  
Design Methodology ◽  
Distribution Functions ◽  
Binding Energies ◽  
Radial Distribution Functions ◽  
Fiber Structure ◽  
Content Type ◽  
Dropping Point ◽  
Scanning Electron

Purpose This paper aims to investigate the influence of stearate types on the thickening ability, dropping point and fiber structure of greases. Design/methodology/approach Several greases were prepared from polyolefins and various stearates. The melting point of the stearates and the dropping point of the resultant greases were measured, and the intermolecular binding energies of the thickener and the radial distribution function of the metal–oxygen in the thickener were determined with the aid of molecular simulation. The microstructures of the greases were also analyzed via scanning electron microscopy. Findings A higher stearate binding energy was found to correlate to a higher dropping point of the resultant greases. The thickening ability of the stearate is related to the group and period of the constituent metal ion. Within a group, greater atomic numbers of the metal were correlated to lower thickening ability. In a period, as the atomic number of the metal increased, the thickening ability was enhanced. The radial distribution functions of metal and oxygen can explain the aggregation of the stearate thickeners in the grease. Originality/value This work compared the thickening capacity of several stearates. Guidelines for preparing stearates to tailor the resultant grease are presented.

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