Polysilicon nanogap structure development using size expansion technique

2011 ◽  
Vol 28 (3) ◽  
pp. 24-30 ◽  
Author(s):  
Uda Hashim ◽  
Nazwa Taib ◽  
Thikra S. Dhahi ◽  
Azizullah Saifullah
Keyword(s):  
Design Methodology ◽  
Electrical Characterization ◽  
Active Surface ◽  
Device Fabrication ◽  
Electrical Behavior ◽  
Structure Development ◽  
Content Type ◽  
Expansion Technique ◽  
Fabrication And Characterization ◽  
Scanning Electron

PurposeNanobiosensors based on nanogap capacitor are widely used for measuring dielectric properties of DNA, protein and biomolecule. The purpose of this paper is to report on the fabrication and characterization polysilicon nanogap patterning using novelties technique.Design/methodology/approachOverall, the polysilicon nanogap pattern was fabricated based on conventional lithographic techniques. For size expansion technique, by employing simple dry thermal oxidation, the couple of nanogap pattern has been expanded to lowest nanogap value. The progress of nanogap pattern expansion was verified by using scanning electron microscopy (SEM). Conductivity, resistivity, and capacitance test were performed to characterize and to measure electrical behavior of full device fabrication.FindingsSEM characterization emphasis on the expansion of polysilicon nanogap pattern increasing with respect to oxidation time. Electrical characterization shows that nanogap enhanced the sensitivity of the device at the value of nano ampere of current.Originality/valueThese simple least‐cost method does not require complicated nanolithography method of fabrication but still possible to serve as biomolecular junction. This approach can be applied extensively to different design of nanogap structure down to several nanometer levels of dimensions. A method of preparing a nanogap electrode according to the present innovation has an advantage of providing active surface that can be easily modified for immobilizations of biomolecules.

Corrosion inhibition of N80 steel in 10% HCl + 8% HBF4solution

2019 ◽  
Vol 66 (1) ◽  
pp. 1-10
Author(s):  
Juan Du ◽  
Yuning He ◽  
Pingli Liu ◽  
Yigang Liu ◽  
Xianghai Meng ◽  
...  
Keyword(s):  
Corrosion Inhibition ◽  
Design Methodology ◽  
X Ray Diffraction ◽  
Corrosion Morphology ◽  
Content Type ◽  
X Ray ◽  
N80 Steel ◽  
Corrosion Reaction ◽  
Hydrolysis Of ◽  
Scanning Electron

PurposeThis paper aims to analyze the corrosion and corrosion inhibition of N80 in 10 per cent HCl + 8 per cent fluoroboric acid (HBF4) solution for acidizing operation.Design/methodology/approachThe corrosion rate, kinetic parameters (Ea, A) and thermodynamic parameters (ΔH, ΔS) of N80 steel in fresh acid and spent acid, 10 per cent HCl + 8 per cent HBF4, 10 per cent HCl and 8 per cent HBF4solutions were calculated through immersion tests. The corrosion and inhibition properties were studied through X-ray diffraction and electrochemical measurements. The corrosion morphology of the corrosion product was examined by scanning electron microscopy (SEM).FindingsThe results demonstrated that the spent acid was the main cause of acidification corrosion, and the HBF4would cause serious corrosion to N80 steel. The results showed that the N80 steel was more seriously corroded in the spent acid than in fresh acid, and the hydrolysis of HBF4accelerates the dissolution process of N80 steel anode to control the corrosion reaction. The results showed that the acidification will definitely cause serious corrosion to the oil tube; therefore, necessary anti-corrosion measures must be taken in the acidification process.Originality/valueThe results showed that acidizing the formation with 10 per cent HCl + 8 per cent HBF4will definitely cause serious corrosion to the oil tube, especially when the spent acid flows back. Therefore, necessary anti-corrosion measures must be taken in the acidification process, especially in the spent acid flowback stage.

scholarly journals Selective laser melting of Ti6Al7Nb with hydroxyapatite addition

2014 ◽  
Vol 20 (4) ◽  
pp. 301-310 ◽  
Author(s):  
Teodora Marcu ◽  
Cinzia Menapace ◽  
Luca Girardini ◽  
Dan Leordean ◽  
Catalin Popa
Keyword(s):  
Selective Laser Melting ◽  
Laser Power ◽  
Design Methodology ◽  
Point Of View ◽  
Medical Applications ◽  
Laser Melting ◽  
Scanning Strategy ◽  
Content Type ◽  
Processing Times ◽  
Scanning Electron

Purpose – The purpose of this paper was to obtain by means of selective laser melting and then characterize biocomposites of medical-grade Ti6Al7Nb with hydroxyapatite (2 and 5 vol.%) and without hydroxyapatite, as reference. Design/methodology/approach – Rectangular samples were manufactured with the same scanning strategy; the laser power was between 50 W and 200 W. Processed samples were analysed by means of optical microscopy, scanning electron microscopy and microhardness. Findings – The results showed that despite the very short processing times, hydroxyapatite decomposed and interacted with the base Ti6Al7Nb material. The decomposition degree was found to depend on the applied laser power. From the porosity and bulk microstructure point of view, the most appropriate materials for the purposed medical applications were Ti6Al7Nb with hydroxyapatite processed with a laser power of 50 W. Originality/value – The originality of the present work consists in the study of the behaviour and interaction of hydroxyapatite additive with the Ti6Al7Nb base powder under selective laser melting conditions, as depending on the applied laser power.

Comparative analysis of stearates as grease lubricant thickeners

2019 ◽  
Vol 71 (9) ◽  
pp. 1093-1098
Author(s):  
Lidan Yao ◽  
Lixin Wang ◽  
Haining Yang ◽  
Chuan Li ◽  
Hui Song ◽  
...  
Keyword(s):  
Radial Distribution ◽  
Metal Ion ◽  
Design Methodology ◽  
Distribution Functions ◽  
Binding Energies ◽  
Radial Distribution Functions ◽  
Fiber Structure ◽  
Content Type ◽  
Dropping Point ◽  
Scanning Electron

Purpose This paper aims to investigate the influence of stearate types on the thickening ability, dropping point and fiber structure of greases. Design/methodology/approach Several greases were prepared from polyolefins and various stearates. The melting point of the stearates and the dropping point of the resultant greases were measured, and the intermolecular binding energies of the thickener and the radial distribution function of the metal–oxygen in the thickener were determined with the aid of molecular simulation. The microstructures of the greases were also analyzed via scanning electron microscopy. Findings A higher stearate binding energy was found to correlate to a higher dropping point of the resultant greases. The thickening ability of the stearate is related to the group and period of the constituent metal ion. Within a group, greater atomic numbers of the metal were correlated to lower thickening ability. In a period, as the atomic number of the metal increased, the thickening ability was enhanced. The radial distribution functions of metal and oxygen can explain the aggregation of the stearate thickeners in the grease. Originality/value This work compared the thickening capacity of several stearates. Guidelines for preparing stearates to tailor the resultant grease are presented.

Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing

2014 ◽  
Vol 26 (4) ◽  
pp. 173-179 ◽  
Author(s):  
Guokui Ju ◽  
Fei Lin ◽  
Wenzhen Bi ◽  
Yongjiu Han ◽  
Wang Junjie ◽  
...  
Keyword(s):  
Cross Sections ◽  
Design Methodology ◽  
Ageing Time ◽  
Solder Matrix ◽  
Thermal Ageing ◽  
Service Reliability ◽  
Content Type ◽  
Isothermal Ageing ◽  
Interfacial Intermetallic Compounds ◽  
Scanning Electron

Purpose – The purpose of this study was to comparatively investigate interfacial intermetallic compounds (IMCs) in the Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu (SACBC/Cu) and Sn3.0Ag0.5Cu/Cu (SAC/Cu) solder joints, and to determine any differences. Design/methodology/approach – The samples were annealed after isothermal ageing at 150°C for 0, 168 and 500 hours, and their cross-sections were observed by scanning electron microscopy and energy dispersive spectroscopy. Findings – The interfacial IMC morphology in two joints had significant differences. For the Cu/SAC/Cu joints, the granular and short rod-like Ag3Sn particles attached on the surface and boundary of interfacial Cu6Sn5 grains were detected, and they coarsened observably with ageing time at 150°C, and lastly embedded at the grain boundaries. However, for the Cu/SACBC/Cu joints, there were tiny filamentous Ag3Sn growing on the surface of interfacial Cu6Sn5 grains, and the Ag3Sn had a tendency to break into nanoparticles, which would be distributed evenly and cover the IMC layer, profiting from the Bi and Cr precipitates from solder matrix during ageing. Originality/value – The paper implies that the addition of Bi and Cr could affect the IMCs of joints, thereby delaying interfacial reactions between Sn and Cu atoms and improving the service reliability. The SACBC solder is a potential alloy for electronic packaging production.

Adhesive properties of S.S to PU and PVC leathers

2014 ◽  
Vol 26 (2) ◽  
pp. 108-117 ◽  
Author(s):  
Shouxiang Jiang ◽  
Dagang Miao ◽  
Diandong Zhao
Keyword(s):  
Electron Microscopy ◽  
Weight Loss ◽  
Bonding Strength ◽  
Design Methodology ◽  
Adhesive Properties ◽  
Content Type ◽  
Force Microscopy ◽  
Atomic Force ◽  
Scanning Electron ◽  
Better Than

Purpose – The purpose of this paper is to investigate the interfacial nanostructures and the adhesions of the stainless steel (S.S) coating to the polyurethane (PU) and polyvinyl chloride (PVC) leathers. Design/methodology/approach – PU leather and PVC leather deposit S.S nano-films on the surface of PU and PVC leathers in this study. The interfacial nanostructures were investigated by scanning electron microscopy (SEM) and atomic force microscopy (AFM). The experimental results revealed that the surface roughness of the substrates had extremely important influence on the morphology of nano-films. The adhesions of the S.S coating to the PU and PVC leathers were investigated by the peel-off test. Findings – The results showed that the adhesive performance of the S.S nano-films coating on PVC leather was better than that on the substrate of PU leather. Moreover, a weight loss of per peeling force calculating formulation is proposed to determine the bonding strength between the S.S films and the substrates. Originality/value – In this paper, influence of different substrates on surface morphology of S.S coating was studied by SEM and AFM. Moreover, the weight loss of per peeling force calculating formulation was used to discuss the bonding strength between the S.S coating and the substrates. The research methods presented in this paper are of innovation significance to a certain extent.

Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Ni-P solder joints

2016 ◽  
Vol 28 (4) ◽  
pp. 215-221 ◽  
Author(s):  
Xingchen Yan ◽  
Kexin Xu ◽  
Junjie Wang ◽  
Xicheng Wei ◽  
Wurong Wang
Keyword(s):  
Design Methodology ◽  
Solder Bump ◽  
Solder Joints ◽  
Diffusion Rate ◽  
Analysis Software ◽  
Content Type ◽  
Image Analysis Software ◽  
Interfacial Intermetallic Compound ◽  
Ge Doping ◽  
Scanning Electron

Purpose The purpose of this paper is to comparatively investigate the microstructure and interfacial intermetallic compound (IMC) layer of Cu/SACPG/Ni and Cu/SAC0307/Ni solder joints after thermal aging. Design/methodology/approach The specimens were thermally aged at 150°C for 0, 24, 168 and 500 h. The microstructure and morphology of the interface IMC layer were observed by means of scanning electron microscope. The IMCs and the solder bump surface were analyzed by EDS. Moreover, the thickness of IMC layer was measured by using the image analysis software. Findings The morphology of IMC of Cu/SAC0307/Ni solder joint was consistent with that of the Cu/SACPG/Ni joint, which indicates that the addition of P and Ge had little effect on the IMC formation. The needle-like (Cu,Ni)6Sn5 was formed at the interface of solder/Ni solder joints. Meanwhile, the tiny particles inferred as Ag3Sn phase attached to the surface of (Cu,Ni)6Sn5. The growth rate of IMC layer of the Cu/SACPG/Ni joint was smaller than that of Cu/SAC0307/Ni joint with aging time increasing, which means the addition of trace P and Ge can slightly suppress the diffusion rate of the interfacial IMC. Originality/value There are no previous studies on the formation mechanism of the IMC layer of SAC0307 solder alloys with P and Ge addition.

A failure case of P110 steel tubing in CO2 flooding well

2020 ◽  
Vol 67 (5) ◽  
pp. 453-463
Author(s):  
Longfei Song ◽  
Zhiyong Liu ◽  
Lin Lu ◽  
Xiaogang Li ◽  
BaoZhuang Sun ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Stress Concentration ◽  
Design Methodology ◽  
Galvanic Corrosion ◽  
Mechanical Damage ◽  
Co2 Flooding ◽  
Content Type ◽  
P110 Steel ◽  
Steel Tubing ◽  
Scanning Electron

Purpose This paper aims to analyze a failure case of a P110 tube in a CO2 flooding well. Design/methodology/approach The chemical composition, microstructure and mechanical properties of the failed P110 tubing steel were tested, and met the API Spec 5CT standard. The fractures were investigated by scanning electron microscopy and energy dispersive spectroscopy. Findings Fracture was induced by stress corrosion cracking (SCC) and that the stress concentration caused by the mechanical damage played an important role in the failure. The failure case is a SCC failure affected by mechanical damage and galvanic corrosion. Originality/value The effect of the infiltration of groundwater was studied in the failure case. The stress concentration caused by the mechanical damage played an important role in the failure.

The use of poly(amido)amine dendrimer in modification of cotton for improving dyeing properties of acid dye

2019 ◽  
Vol 31 (2) ◽  
pp. 220-231 ◽  
Author(s):  
Ashwini A. Patil ◽  
Saptarshi Maiti ◽  
Ravindra V. Adivarekar
Keyword(s):  
Cotton Fabric ◽  
Design Methodology ◽  
Pamam Dendrimer ◽  
Cotton Fabrics ◽  
The Other ◽  
Acid Dye ◽  
Acid Dyes ◽  
Color Strength ◽  
Content Type ◽  
Scanning Electron

PurposeCotton being an anionic fiber can be dyed with direct, reactive, vat and sulfur dyes but cannot be dyed with acid dyes due to their chemical differences. But there are certain advantages of acid dyes like acid dyeing is the simplest method than the other classes of dyes; and it offers various intense and bright shades. So, the purpose of this paper is to focus on acid dyeing of cotton fabric after its chemical modification.Design/methodology/approachSuch modification of cotton fabric has been achieved using poly(amido)amine dendrimer (PAMAM) treatment. The current work is based on the synthesis of a full-generation PAMAM dendrimer (G0) and its application onto the cotton fabric for modifying the cotton substrate by the exhaust and padding method.FindingsThe treatment of the dendrimer on cotton fabric has been analyzed by Fourier transform infrared spectroscopy and scanning electron microscopy. The dyeing results in terms of color strength of the treated cotton fabrics are compared with those of conventional acid dyed silk fabric. The fastness assessments such as wash, light and rubbing fastnesses after dyeing of treated cotton fabrics are also performed and found to be satisfactory.Originality/valueThis paper can be used in the application of synthesized poly(amido)amine dendrimer in acid dyeing of cotton.

The preparation and properties of a transparent coating based on organic silicone resins

2015 ◽  
Vol 62 (1) ◽  
pp. 48-52 ◽  
Author(s):  
Jia-Neng Cheng ◽  
Yan Liu ◽  
Hongwei Che ◽  
Guoping Yan ◽  
Xinghai Liu ◽  
...  
Keyword(s):  
Design Methodology ◽  
Impact Resistance ◽  
Light Transmittance ◽  
Protective Film ◽  
Coating Film ◽  
Good Adhesion ◽  
Coating Films ◽  
Content Type ◽  
Transparent Coating ◽  
Scanning Electron

Purpose – The purpose of this investigation was to study a transparent coating based on organic silicone resins prepared by the hydrolysis and condensation of methyltriethoxysilane and tetraethoxysilane. Design/methodology/approach – The coating film was characterized by IR, UV, thermal gravity analysis, scanning electron microscope and an automatic contact angle meter. Some properties of the coating film, such as adhesion, impact resistance and wear-resistance also were evaluated. Findings – These uniform, clear and smooth coating films possessed the high transparent and light transmittance, high density, high hydrophobicity, good adhesion, hardness and anti-corrosion. Originality/value – The coating may be considered as a protective film for the surfaces of the metals and plastics.

Structural and Electrical Characterization of Hydrophobic Direct-Bonded Silicon Interfaces

1993 ◽  
Vol 318 ◽  
Author(s):  
Gordon Tam ◽  
F. Secco d'Aragona ◽  
N. David Theodore
Keyword(s):  
Wafer Bonding ◽  
Electrical Characterization ◽  
Device Fabrication ◽  
High Resistivity ◽  
Electrical Behavior ◽  
Cross Sectional ◽  
Spreading Resistance ◽  
Bonded Interface ◽  
Transmission Electron ◽  
Direct Wafer Bonding

ABSTRACTDirect wafer bonding is a viable technique for fabricating high-voltage devices. An understanding of the microstructure and electrical behavior of the bonded interface is critical for device fabrication. In this paper, we investigated the microstructure of the silicon-to-silicon bonded interface using cross-sectional transmission electron microscopy and the corresponding electrical behavior using spreading resistance probing. Results indicate that oxide precipitates were present at the bonded interface when Czochralski silicon wafer were used in the process. Oxide precipitates were noticeably absent from the bonded interface when float zone wafers were bonded to each other. We find that oxide precipitates at the interface arise not due to the residual oxide at the surface prior to wafer bonding but due to gettering of oxygen from the Czochralski wafer. Spreading resistance measurements show occurrence of a high resistivity region at the bonding interface whether or not oxide precipitates are present.

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