The Solution of AIO-ET Via Open and Process Window Improvement

2020 ◽  
Author(s):  
Baichun Zhang ◽  
Jianguo Yang ◽  
Lei Sun ◽  
Quanbo Li ◽  
Jun Huang ◽  
...  
Keyword(s):  
Process Window

Dual Damascene Process for FatWires in Copper/FSG Technology

2003 ◽  
Vol 766 ◽  
Author(s):  
J. Gambino ◽  
T. Stamper ◽  
H. Trombley ◽  
S. Luce ◽  
F. Allen ◽  
...  
Keyword(s):  
Line Width ◽  
Lower Cost ◽  
Process Window ◽  
Cmos Process ◽  
Dual Damascene ◽  
Damascene Process ◽  
Interconnect Technology

AbstractA trench-first dual damascene process has been developed for fat wires (1.26 μm pitch, 1.1 μm thickness) in a 0.18 μm CMOS process with copper/fluorosilicate glass (FSG) interconnect technology. The process window for the patterning of vias in such deep trenches depends on the trench depth and on the line width of the trench, with the worse case being an intermediate line width (lines that are 3X the via diameter). Compared to a single damascene process, the dual damascene process has comparable yield and reliability, with lower via resistance and lower cost.

АЛГОРИТМ РАСЧЕТА ОКОН ПРОЦЕССА ФОТОЛИТОГРАФИИ НА ОСНОВЕ МОДЕЛИ РЕЗИСТА С ПОСТОЯННЫМ ПОРОГОМ

2020 ◽  
Vol 96 (3s) ◽  
pp. 756-757
Author(s):  
Е.С. Шамин ◽  
Е.Л. Харченко
Keyword(s):  
Process Window ◽  
Model Generation ◽  
Modeling Tools ◽  
Photolithography Process

Данная работа посвящена описанию возможного алгоритма создания моделей резиста с постоянным порогом и расчета окон процесса на их основе. Приведенные изыскания реализованы в виде программного средства, использующего средства моделирования фотолитографии Mentor Graphics Calibre. This work is dedicated to the description of one of possible algorithms of constant threshold resist model generation used for photolithography process window calculation. This algorithm has been realized in the form of a program using Mentor Graphics Calibre modeling tools.

scholarly journals Upscaling of LATP synthesis: Stoichiometric screening of phase purity and microstructure to ionic conductivity maps

Ionics ◽  
2021 ◽  
Vol 27 (5) ◽  
pp. 2017-2025
Author(s):  
Nikolas Schiffmann ◽  
Ethel C. Bucharsky ◽  
Karl G. Schell ◽  
Charlotte A. Fritsch ◽  
Michael Knapp ◽  
...  
Keyword(s):  
Ionic Conductivity ◽  
Sol Gel ◽  
Ion Conductivity ◽  
Process Window ◽  
Lithium Aluminum ◽  
Potential Candidate ◽  
Secondary Phases ◽  
X Ray Diffraction ◽  
Battery Cell ◽  
Li Ion

AbstractLithium aluminum titanium phosphate (LATP) is known to have a high Li-ion conductivity and is therefore a potential candidate as a solid electrolyte. Via sol-gel route, it is already possible to prepare the material at laboratory scale in high purity and with a maximum Li-ion conductivity in the order of 1·10−3 s/cm at room temperature. However, for potential use in a commercial, battery-cell upscaling of the synthesis is required. As a first step towards this goal, we investigated whether the sol-gel route is tolerant against possible deviations in the concentration of the precursors. In order to establish a possible process window for sintering, the temperature interval from 800 °C to 1100 °C and holding times of 10 to 480 min were evaluated. The resulting phase compositions and crystal structures were examined by X-ray diffraction. Impedance spectroscopy was performed to determine the electrical properties. The microstructure of sintered pellets was analyzed by scanning electron microscopy and correlated to both density and ionic conductivity. It is shown that the initial concentration of the precursors strongly influences the formation of secondary phases like AlPO4 and LiTiOPO4, which in turn have an influence on ionic conductivity, densification behavior, and microstructure evolution.

scholarly journals Experimental and Numerical Study of the Effects of the Reversal Hot Rolling Conditions on the Recrystallization Behavior of Austenite Model Alloys

Metals ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 26
Author(s):  
Krzysztof Muszka ◽  
Mateusz Sitko ◽  
Paulina Lisiecka-Graca ◽  
Thomas Simm ◽  
Eric Palmiere ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Hot Rolling ◽  
Strain Path ◽  
Physical Simulation ◽  
Numerical Study ◽  
Kinematic Hardening ◽  
Process Window ◽  
Recrystallization Behavior ◽  
Full Field ◽  
Strain Reversal

The experimental and numerical study of the effects of the recrystallization behavior of austenite model alloys during hot plate rolling on reverse rolling is the main goal of the paper. The computer models that are currently applied for simulation of reverse rolling are not strain-path-sensitive, thus leading to overestimation of the processing parameters outside the accepted process window (e.g., deformation in the partial austenite recrystallization region). Therefore, in this work, a particular focus is put on the investigation of strain path effects that occur during hot rolling and their influence on the microstructure evolution and mechanical properties of microalloyed austenite. Both experimental and numerical techniques are employed in this study, taking advantage of the integrated computational material engineering concept. The combined isotropic–kinematic hardening model is used for the macroscale predictions to take into account softening effects due to strain reversal. The macroscale model is additionally enriched with the full-field microstructure evolution model within the cellular automata framework. Examples of obtained results, highlighting the role of the strain reversal on the microstructural response, are presented within the paper. The combination of the physical simulation of austenitic model alloys and computer modeling provided new insights into optimization of the processing routes of advanced high-strength steels (AHSS).

Effect of Laser Thermal Processing on Defect Evolution in Silicon

2002 ◽  
Vol 717 ◽  
Author(s):  
Erik Kuryliw ◽  
Kevin S. Jones ◽  
David Sing ◽  
Michael J. Rendon ◽  
Somit Talwar
Keyword(s):  
Point Defects ◽  
Thermal Processing ◽  
Defect Formation ◽  
Secondary Ion Mass Spectrometry ◽  
Laser Energy ◽  
Process Window ◽  
Loop Formation ◽  
Transmission Electron ◽  
Ultra Shallow Junctions ◽  
Laser Thermal Processing

AbstractLaser Thermal Processing (LTP) involves laser melting of an implantation induced preamorphized layer to form highly doped ultra shallow junctions in silicon. In theory, a large number of interstitials remain in the end of range (EOR) just below the laser-formed junction. There is also the possibility of quenching in point defects during the liquid phase epitaxial regrowth of the melt region. Since post processing anneals are inevitable, it is necessary to understand both the behavior of these interstitials and the nature of point defects in the recrystallized-melt region since they can directly affect deactivation and enhanced diffusion. In this study, an amorphizing 15 keV 1 x 1015/cm2 Si+ implant was done followed by a 1 keV 1 x 1014/cm2 B+ implant. The surface was then laser melted at energy densities between 0.74 and 0.9 J/cm2 using a 308 nm excimer-laser. It was found that laser energy densities above 0.81 J/cm2 melted past the amorphous-crystalline interface. Post-LTP furnace anneals were performed at 750°C for 2 and 4 hours. Transmission electron microscopy was used to analyze the defect formation after LTP and following furnace anneals. Secondary ion mass spectrometry measured the initial and final boron profiles. It was observed that increasing the laser energy density led to increased dislocation loop formation and increased diffusion after the furnace anneal. A maximum loop density and diffusion was observed at the end of the process window, suggesting a correlation between the crystallization defects and the interstitial evolution.

scholarly journals Analysis of the Downscaling Effect and Definition of the Process Fingerprints in Micro Injection of Spiral Geometries

Micromachines ◽  
2019 ◽  
Vol 10 (5) ◽  
pp. 335 ◽  
Author(s):  
Antonio Luca ◽  
Oltmann Riemer
Keyword(s):  
Correlation Analysis ◽  
Process Parameters ◽  
Cross Sections ◽  
Mass Production ◽  
Process Window ◽  
Response Variable ◽  
Process Indicators ◽  
Flow Length ◽  
Definition Of ◽  
Microinjection Moulding

Microinjection moulding has been developed to fulfil the needs of mass production of micro components in different fields. A challenge of this technology lies in the downscaling of micro components, which leads to faster solidification of the polymeric material and a narrower process window. Moreover, the small cavity dimensions represent a limit for process monitoring due to the inability to install in-cavity sensors. Therefore, new solutions must be found. In this study, the downscaling effect was investigated by means of three spiral geometries with different cross sections, considering the achievable flow length as a response variable. Process indicators, called “process fingerprints”, were defined to monitor the process in-line. In the first stage, a relationship between the achievable flow length and the process parameters, as well as between the process fingerprints and the process parameters, was established. Subsequently, a correlation analysis was carried out to find the process indicators that are mostly related to the achievable flow length.

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